MY181072A - Holding table - Google Patents

Holding table

Info

Publication number
MY181072A
MY181072A MYPI2015000210A MYPI2015000210A MY181072A MY 181072 A MY181072 A MY 181072A MY PI2015000210 A MYPI2015000210 A MY PI2015000210A MY PI2015000210 A MYPI2015000210 A MY PI2015000210A MY 181072 A MY181072 A MY 181072A
Authority
MY
Malaysia
Prior art keywords
wafer
holding
holding table
reinforcing portion
annular
Prior art date
Application number
MYPI2015000210A
Inventor
Saki Kimura
Toshio Tsuchiya
Takeshi Dejima
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of MY181072A publication Critical patent/MY181072A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work for planar work
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Jigs For Machine Tools (AREA)
  • Dicing (AREA)

Abstract

The present invention relates to a holding table (5) for use with a wafer processing method for processing a wafer. The holding table (5) having an upper surface functioning as a holding surface (51) for holding the wafer. The holding surface (51) is formed with a plurality of suction grooves (57, 58), wherein a vacuum is produced in the suction grooves (57, 58) to hold the wafer under suction. The upper surface of the holding table (5) formed with an annular escape groove (53) for allowing the escape of a laser beam having an absorption wavelength applied to the wafer along the boundary portion (86) between a device area (83) and an annular reinforcing portion (85) of the wafer to separate and deleting said annular reinforcing portion (85) from the wafer.
MYPI2015000210A 2014-02-05 2015-01-27 Holding table MY181072A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014020641A JP6317935B2 (en) 2014-02-05 2014-02-05 Holding table

Publications (1)

Publication Number Publication Date
MY181072A true MY181072A (en) 2020-12-17

Family

ID=53547291

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015000210A MY181072A (en) 2014-02-05 2015-01-27 Holding table

Country Status (7)

Country Link
JP (1) JP6317935B2 (en)
KR (1) KR102175865B1 (en)
CN (1) CN104816100B (en)
DE (1) DE102015201833B4 (en)
MY (1) MY181072A (en)
SG (1) SG10201500647RA (en)
TW (1) TWI637460B (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6371579B2 (en) * 2014-05-12 2018-08-08 株式会社ディスコ Chuck table
JP6564669B2 (en) * 2015-10-06 2019-08-21 株式会社ディスコ Device manufacturing method
JP6672053B2 (en) 2016-04-18 2020-03-25 株式会社ディスコ Wafer processing method
DE102016110378B4 (en) * 2016-06-06 2023-10-26 Infineon Technologies Ag Removing a reinforcement ring from a wafer
DE102016111629B4 (en) * 2016-06-24 2022-10-27 Infineon Technologies Ag Method of manufacturing a semiconductor device
JP2018101678A (en) * 2016-12-20 2018-06-28 株式会社ディスコ Processing method of workpiece
JP6770443B2 (en) 2017-01-10 2020-10-14 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor devices and semiconductor wafers
JP2019016691A (en) * 2017-07-06 2019-01-31 リンテック株式会社 Removal device and removal method
JP7045811B2 (en) * 2017-07-06 2022-04-01 リンテック株式会社 Removal device and removal method
JP6955919B2 (en) * 2017-07-06 2021-10-27 リンテック株式会社 Removal device and removal method
KR102409260B1 (en) * 2020-05-19 2022-06-17 주식회사 에이엘티 A Remove device and remove method for taiko wafer ring
KR20220048938A (en) 2020-10-13 2022-04-20 가부시기가이샤 디스코 Laser processing apparatus
JP7807203B2 (en) * 2020-10-13 2026-01-27 株式会社ディスコ Laser processing equipment
CN112599413B (en) * 2021-03-04 2021-05-14 成都先进功率半导体股份有限公司 A kind of wafer chip cutting method
CN113275769B (en) * 2021-07-22 2021-09-21 南通智谷数控机械有限公司 Intelligent control clears up unedged sponge cutting machine
JP7680301B2 (en) * 2021-08-02 2025-05-20 株式会社Ｓｃｒｅｅｎホールディングス Light irradiation device and light irradiation method
JP7788242B2 (en) * 2021-09-24 2025-12-18 株式会社ディスコ processing equipment
CN114843178B (en) * 2022-04-28 2025-12-05 华虹半导体(无锡)有限公司 Ring-taking method for taiko thinned wafers

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6049888A (en) * 1983-08-30 1985-03-19 Dainippon Printing Co Ltd Laser cutting device
JPS61138489U (en) * 1985-02-19 1986-08-28
US6955956B2 (en) * 2000-12-26 2005-10-18 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device
JP5390740B2 (en) 2005-04-27 2014-01-15 株式会社ディスコ Wafer processing method
JP2008283025A (en) * 2007-05-11 2008-11-20 Disco Abrasive Syst Ltd Wafer division method
CN201067832Y (en) * 2007-07-30 2008-06-04 深圳市大族激光科技股份有限公司 Processing platform for laser machining
JP5544228B2 (en) * 2010-07-14 2014-07-09 株式会社ディスコ Wafer processing method
JP5686570B2 (en) * 2010-10-29 2015-03-18 株式会社ディスコ How to use wafer support plate
CN103153522B (en) * 2011-07-28 2015-11-25 三菱电机株式会社 Laser processing device and laser processing control device
JP5606412B2 (en) * 2011-08-29 2014-10-15 富士フイルム株式会社 Pattern forming apparatus, pattern forming method, and pattern forming substrate manufacturing method
CN202861627U (en) * 2012-09-21 2013-04-10 北京工业大学 High-power laser absorption device

Also Published As

Publication number Publication date
DE102015201833B4 (en) 2020-10-29
KR20150092705A (en) 2015-08-13
SG10201500647RA (en) 2015-09-29
TWI637460B (en) 2018-10-01
JP2015147231A (en) 2015-08-20
TW201532182A (en) 2015-08-16
CN104816100B (en) 2019-09-06
DE102015201833A1 (en) 2015-08-06
CN104816100A (en) 2015-08-05
JP6317935B2 (en) 2018-04-25
KR102175865B1 (en) 2020-11-06

Similar Documents

Publication Publication Date Title
MY181072A (en) Holding table
TWD189090S (en) Cutting or grinding machine for metalworking
MY199816A (en) Method and apparatus for detecting facet region, wafer producing method, and laser processing apparatus
MX394114B (en) ABRASIVE ARTICLE INCLUDING SHAPED ABRASIVE PARTICLES.
MX394721B (en) ABRASIVE ARTICLE INCLUDING SHAPED ABRASIVE PARTICLES.
MY183043A (en) Laser lift-off method of wafer
MY180842A (en) Wafer processing method
SG10201810390TA (en) Thermal processing susceptor
AR096478A1 (en) COMPOSITIONS FOR SURFACE TREATMENT THAT INCLUDE PHOTOCROMÁTIC DYES
EA201691781A1 (en) METHOD OF CUTTING OF LAMINATED SUPERHTHON GLASS LAYER
MX2017007373A (en) Last system for braiding footwear.
MY177237A (en) Wafer producing method
MY170046A (en) Wafer processing method
MY185297A (en) Work sucking board, work cutting apparatus, work-cutting method, and fabricating method for work sucking board
EA201691333A1 (en) METHOD OF MANUFACTURING A FACED ELEMENT
ES2722050T3 (en) Apparatus and method for automatic arrangement of composite structures
MY196621A (en) Method for Introducing at Least One Cutout or Aperture Into a Sheetlike Workpiece
GB2562941A (en) Handler bonding and debonding for semiconductor dies
SG11201900881YA (en) Laser irradiation device, laser irradiation method, and semiconductor device manufacturing method
MX2015004510A (en) Forming machine and method for control of a forming machine.
AR107749A1 (en) GRID FOR EXTRACTION SYSTEM
EP3151348A3 (en) Semiconductor laser resonator and semiconductor laser device including the same
WO2015186076A3 (en) Abrasive tool for machining surfaces
TW201612976A (en) Etching method and storage medium
MX2019001759A (en) PRE-TREATMENT COMPOSITION.