MY181207A - Dicing sheet - Google Patents

Dicing sheet

Info

Publication number
MY181207A
MY181207A MYPI2016704523A MYPI2016704523A MY181207A MY 181207 A MY181207 A MY 181207A MY PI2016704523 A MYPI2016704523 A MY PI2016704523A MY PI2016704523 A MYPI2016704523 A MY PI2016704523A MY 181207 A MY181207 A MY 181207A
Authority
MY
Malaysia
Prior art keywords
base material
dicing sheet
laminated
adhesive layer
sheet
Prior art date
Application number
MYPI2016704523A
Inventor
Naoya Saiki
Daisuke Yamamoto
Hiroyuki Yoneyama
Youichi Inao
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=54833335&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MY181207(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of MY181207A publication Critical patent/MY181207A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Laser Beam Processing (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

A dicing sheet of the invention is a dicing sheet (1) including a base material (2), an adhesive layer (3) which is laminated on the first surface side of the base material (2), and a release sheet (6) which is laminated on the adhesive layer (3) on the side opposite to the base material (2), in which an arithmetic mean roughness (Ral) of a second surface of the base material (2) is 0.2 ?m or greater, and an arithmetic mean roughness (Ra2) of the second surface of the base material (2) after the dicing sheet (1) is heated for 2 hours at 130?C is 0.25 ?m or less. Figure 1
MYPI2016704523A 2014-06-10 2015-05-18 Dicing sheet MY181207A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014120034 2014-06-10
PCT/JP2015/064181 WO2015190230A1 (en) 2014-06-10 2015-05-18 Dicing sheet

Publications (1)

Publication Number Publication Date
MY181207A true MY181207A (en) 2020-12-21

Family

ID=54833335

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016704523A MY181207A (en) 2014-06-10 2015-05-18 Dicing sheet

Country Status (8)

Country Link
JP (1) JP6319438B2 (en)
KR (1) KR102355108B1 (en)
CN (2) CN110211912B (en)
MY (1) MY181207A (en)
PH (1) PH12016502287A1 (en)
SG (1) SG11201609451VA (en)
TW (2) TWI675901B (en)
WO (1) WO2015190230A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110211912B (en) * 2014-06-10 2023-06-02 琳得科株式会社 Cutting sheet
JP6573841B2 (en) * 2016-03-04 2019-09-11 リンテック株式会社 Semiconductor processing sheet
JP7008620B2 (en) * 2016-03-04 2022-01-25 リンテック株式会社 Sheet for semiconductor processing
CN108271381B (en) * 2016-03-04 2022-06-07 琳得科株式会社 Semiconductor processing sheet
JPWO2017169387A1 (en) * 2016-03-30 2019-02-07 リンテック株式会社 Film adhesive, semiconductor processing sheet, and semiconductor device manufacturing method
EP3439021B1 (en) * 2016-03-31 2025-01-29 Mitsui Chemicals ICT Materia, Inc. Use of a film for component manufacture and component manufacturing method
US11276600B2 (en) 2016-03-31 2022-03-15 Mitsui Chemicals Tohcello, Inc. Film for component manufacture and component manufacturing method
JP7402052B2 (en) * 2018-01-24 2023-12-20 リンテック株式会社 Long laminated sheets and their rolls
JP7614782B2 (en) * 2019-11-07 2025-01-16 日東電工株式会社 Dicing tape and dicing die bond film
JP7664023B2 (en) * 2020-01-30 2025-04-17 リンテック株式会社 Sheet for processing workpiece and method for manufacturing processed workpiece
JP7591453B2 (en) 2021-03-31 2024-11-28 リンテック株式会社 Support sheet, composite sheet for forming resin film, kit, and method for producing chip with resin film

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000344915A (en) * 1999-04-02 2000-12-12 Toray Ind Inc Roughness-changeable film
EP3252806B1 (en) 2002-03-12 2019-10-09 Hamamatsu Photonics K.K. Substrate dividing method
JP5165829B2 (en) * 2004-02-26 2013-03-21 日東電工株式会社 Rolled wafer processing adhesive sheet
JP4642436B2 (en) * 2004-11-12 2011-03-02 リンテック株式会社 Marking method and protective film forming and dicing sheet
JP2007109808A (en) * 2005-10-12 2007-04-26 Furukawa Electric Co Ltd:The Semiconductor wafer dicing-adhesive tape for die bonding
JP4762671B2 (en) 2005-10-26 2011-08-31 古河電気工業株式会社 Dicing tape and semiconductor wafer dicing method
JP4767144B2 (en) * 2006-10-04 2011-09-07 日東電工株式会社 Adhesive sheet for laser processing
JP4430085B2 (en) * 2007-03-01 2010-03-10 日東電工株式会社 Dicing die bond film
CN101636267B (en) * 2007-03-19 2013-04-24 琳得科株式会社 Releasing sheet and adhesive body
JP2011040449A (en) * 2009-08-07 2011-02-24 Du Pont Mitsui Polychem Co Ltd Substrate for dicing tape, the dicing tape, and method for manufacturing semiconductor device
JP5603757B2 (en) * 2009-12-04 2014-10-08 リンテック株式会社 Laser dicing adhesive sheet and method for manufacturing semiconductor device
WO2011096350A1 (en) * 2010-02-02 2011-08-11 三井化学東セロ株式会社 Surface protective film
JP5391158B2 (en) * 2010-06-30 2014-01-15 古河電気工業株式会社 Wafer sticking adhesive sheet and wafer processing method using the same
JP2012033637A (en) * 2010-07-29 2012-02-16 Nitto Denko Corp Dicing tape integrated semiconductor rear face film, and method of manufacturing semiconductor device
JP5889892B2 (en) * 2011-06-14 2016-03-22 デンカ株式会社 Method for manufacturing adhesive sheet and electronic component
JP5363662B2 (en) * 2011-09-30 2013-12-11 リンテック株式会社 Dicing sheet with protective film forming layer and chip manufacturing method
JP2013095842A (en) * 2011-10-31 2013-05-20 Lintec Corp Adhesive sheet and method for producing the same
JP2013181063A (en) * 2012-02-29 2013-09-12 Nitto Denko Corp Self-rolling adhesive film
JP5583725B2 (en) * 2012-09-20 2014-09-03 リンテック株式会社 Laser dicing sheet-peeling sheet laminate, laser dicing sheet and chip body manufacturing method
WO2014046121A1 (en) * 2012-09-20 2014-03-27 リンテック株式会社 Laser dicing sheet / peeling sheet laminate, laser dicing sheet, and chip manufacturing method
JP6029481B2 (en) * 2013-02-04 2016-11-24 リンテック株式会社 Laser dicing sheet and semiconductor chip manufacturing method
CN110211912B (en) * 2014-06-10 2023-06-02 琳得科株式会社 Cutting sheet

Also Published As

Publication number Publication date
JP6319438B2 (en) 2018-05-09
KR20170016814A (en) 2017-02-14
WO2015190230A1 (en) 2015-12-17
CN110211912B (en) 2023-06-02
CN106463375B (en) 2019-06-28
TWI741335B (en) 2021-10-01
CN106463375A (en) 2017-02-22
KR102355108B1 (en) 2022-01-24
CN110211912A (en) 2019-09-06
TW201604260A (en) 2016-02-01
PH12016502287A1 (en) 2017-02-13
SG11201609451VA (en) 2016-12-29
TW201940623A (en) 2019-10-16
TWI675901B (en) 2019-11-01
JPWO2015190230A1 (en) 2017-04-20

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