MY184278A - Resin sealing apparatus and resin sealing method - Google Patents

Resin sealing apparatus and resin sealing method

Info

Publication number
MY184278A
MY184278A MYPI2014000061A MYPI2014000061A MY184278A MY 184278 A MY184278 A MY 184278A MY PI2014000061 A MYPI2014000061 A MY PI2014000061A MY PI2014000061 A MYPI2014000061 A MY PI2014000061A MY 184278 A MY184278 A MY 184278A
Authority
MY
Malaysia
Prior art keywords
resin tablets
resin sealing
resin
communicating passage
tablets
Prior art date
Application number
MYPI2014000061A
Inventor
Takada Naoki
Owari Hiroki
Takeuchi Shin
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of MY184278A publication Critical patent/MY184278A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)

Abstract

In a loader that transports resin tablets, a communicating passage is formed inside of a wall of a housing unit for separately housing therein the resin tablets. A cooling medium is fed and circulated in the communicating passage to cool the resin tablets. These technical features prevent the resin tablets from being affected by radiation heat generated from a clamper and first and second molding dies heated to high temperatures so that temperatures of the resin tablets are controlled and kept at certain degrees. As a result, Degradation and change of properties of the resin tablets are avoided.
MYPI2014000061A 2013-01-08 2014-01-08 Resin sealing apparatus and resin sealing method MY184278A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013001303A JP5985402B2 (en) 2013-01-08 2013-01-08 Resin sealing device and resin sealing method

Publications (1)

Publication Number Publication Date
MY184278A true MY184278A (en) 2021-03-30

Family

ID=51040949

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014000061A MY184278A (en) 2013-01-08 2014-01-08 Resin sealing apparatus and resin sealing method

Country Status (5)

Country Link
JP (1) JP5985402B2 (en)
KR (1) KR101587694B1 (en)
CN (1) CN103915352B (en)
MY (1) MY184278A (en)
TW (1) TWI527167B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101678441B1 (en) 2014-07-16 2016-11-22 엘지전자 주식회사 Food waste treating apparatus
JP6430342B2 (en) * 2015-08-11 2018-11-28 Ｔｏｗａ株式会社 Resin molding apparatus, resin molding method, and mold
CN107466159B (en) * 2016-06-06 2022-07-19 宁波舜宇光电信息有限公司 Molded circuit board of camera module and its manufacturing equipment and manufacturing method
CN107466160B (en) 2016-06-06 2022-04-29 宁波舜宇光电信息有限公司 Equipment and method for manufacturing molded circuit board of camera module
JP6923423B2 (en) * 2017-11-21 2021-08-18 Ｔｏｗａ株式会社 Manufacturing method of transport equipment, resin molding equipment and resin molded products
JP7121763B2 (en) * 2020-02-14 2022-08-18 アピックヤマダ株式会社 RESIN MOLDING APPARATUS AND RESIN MOLDING METHOD
JP7360368B2 (en) * 2020-08-18 2023-10-12 Ｔｏｗａ株式会社 Resin molding equipment and method for manufacturing resin molded products
JP2022045705A (en) * 2020-09-09 2022-03-22 アピックヤマダ株式会社 Resin feeding mechanism, and resin encapsulation device provided with the same
JP7417507B2 (en) * 2020-11-10 2024-01-18 Ｔｏｗａ株式会社 Resin molding equipment and method for manufacturing resin molded products
CN113353664A (en) * 2021-06-22 2021-09-07 濮阳市恩赢高分子材料有限公司 Movable discharging and curing device for benzoxazine resin production
CN116442435A (en) * 2022-01-07 2023-07-18 山田尖端科技株式会社 Resin supply mechanism and resin sealing device comprising same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3423766B2 (en) * 1994-03-11 2003-07-07 Ｔｏｗａ株式会社 Resin encapsulation molding method and mold device for electronic components
JP3575893B2 (en) * 1995-11-27 2004-10-13 アピックヤマダ株式会社 Resin molding device with temperature control mechanism for resin tablet
JP2002127186A (en) * 2000-10-25 2002-05-08 Matsushita Electric Works Ltd Material supply equipment for transfer molding equipment
WO2010038660A1 (en) * 2008-09-30 2010-04-08 Ｔｏｗａ株式会社 Resin sealing compression molding method for electronic component and device therefor
JP5697919B2 (en) * 2010-07-29 2015-04-08 Ｔｏｗａ株式会社 Resin sealing device and resin sealing method
JP5776092B2 (en) * 2011-01-11 2015-09-09 アピックヤマダ株式会社 Compression molding method, compression molding apparatus, and resin supply handler
JP5682033B2 (en) * 2011-03-14 2015-03-11 アピックヤマダ株式会社 Resin sealing device

Also Published As

Publication number Publication date
CN103915352A (en) 2014-07-09
TWI527167B (en) 2016-03-21
CN103915352B (en) 2017-07-14
JP5985402B2 (en) 2016-09-06
TW201436124A (en) 2014-09-16
KR20140090068A (en) 2014-07-16
JP2014135330A (en) 2014-07-24
KR101587694B1 (en) 2016-01-21

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