MY184538A - Resin sealing apparatus and method of detecting abnormality of resin sealing apparatus - Google Patents

Resin sealing apparatus and method of detecting abnormality of resin sealing apparatus

Info

Publication number
MY184538A
MY184538A MYPI2017701079A MYPI2017701079A MY184538A MY 184538 A MY184538 A MY 184538A MY PI2017701079 A MYPI2017701079 A MY PI2017701079A MY PI2017701079 A MYPI2017701079 A MY PI2017701079A MY 184538 A MY184538 A MY 184538A
Authority
MY
Malaysia
Prior art keywords
pin
load detection
sealing apparatus
resin sealing
load
Prior art date
Application number
MYPI2017701079A
Inventor
Hiroaki Miyahara
Original Assignee
Dai Ichi Seiko Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Ichi Seiko Co Ltd filed Critical Dai Ichi Seiko Co Ltd
Publication of MY184538A publication Critical patent/MY184538A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/4005—Ejector constructions; Ejector operating mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

Provided are a resin sealing apparatus (52) and a method of detecting abnormality of a resin sealing apparatus which are capable of appropriately detecting whether a sliding defect of an exposing pin (30) occurs in respect to a resin sealed package in which an exposed portion is formed at a surface of an electronic component. A first mold (2) includes an upper die set (6) and an upper mold chase (7). A spring pin (13) is provided in the upper mold chase. The spring pin is a member which has a tip that comes into contact with a surface of a sensor element of a substrate with the sensor element (38) which is a base material with electronic components, and forms an exposed portion. A light shielding sensors (14) is provided on an upper end surface of a holder base (9). The light shielding sensor detects a tip of a to-be-detected pin (37) that constitutes the spring pin. Further, the load measuring loader (40) of the resin sealing apparatus (52) includes a base portion (41), and a load detection pin holder (42). The load detection pin holder is a portion which is pushed up by a second mold (3) operated by a mold driving device, the load detection pin holder moves upward through a guide portion (44), and approaches the cavity (11) of the first mold. In addition, the load detection pin holder includes a load detection pin (45) as a load sensor, and a detection signal cable (46). The load detection pin measures a load when a tip of the load detection pin (47) comes into contact with the tip of the exposing pin (35), and pushes up the exposing pin. Figure 1
MYPI2017701079A 2016-03-30 2017-03-28 Resin sealing apparatus and method of detecting abnormality of resin sealing apparatus MY184538A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016069507A JP6079925B1 (en) 2016-03-30 2016-03-30 Resin sealing device and abnormality detection method of resin sealing device

Publications (1)

Publication Number Publication Date
MY184538A true MY184538A (en) 2021-04-01

Family

ID=58043235

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017701079A MY184538A (en) 2016-03-30 2017-03-28 Resin sealing apparatus and method of detecting abnormality of resin sealing apparatus

Country Status (4)

Country Link
JP (1) JP6079925B1 (en)
CN (1) CN107263827B (en)
MY (1) MY184538A (en)
SG (1) SG10201702521WA (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6831311B2 (en) 2017-09-15 2021-02-17 株式会社神戸製鋼所 Gas supply device and how to start operation of the gas supply device
JP6541746B2 (en) * 2017-10-30 2019-07-10 Ｔｏｗａ株式会社 Resin molding apparatus and method of manufacturing resin molded article
JP7432925B2 (en) * 2020-12-04 2024-02-19 アピックヤマダ株式会社 Pressure monitoring device, resin sealing device, and pressure monitoring method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62212112A (en) * 1986-03-14 1987-09-18 Matsushita Electric Works Ltd Apparatus for lead frame loading to molding die assembly in encapsulation of electronic component
JPH0754831Y2 (en) * 1990-11-15 1995-12-18 株式会社アーレスティ Pin type load sensor for pressure molding machine
JPH0760806A (en) * 1993-08-30 1995-03-07 Sony Corp Mold for mold
JP2684168B2 (en) * 1995-10-30 1997-12-03 トーワ株式会社 Mold release resistance measuring method and measuring apparatus
JP2003142510A (en) * 2001-11-02 2003-05-16 Mitsubishi Electric Corp Method for manufacturing semiconductor device
JP4094515B2 (en) * 2003-09-26 2008-06-04 株式会社ルネサステクノロジ Manufacturing method of semiconductor device
TWI357922B (en) * 2007-12-24 2012-02-11 Eternal Chemical Co Ltd Coating compositions and curing method thereof
JP5539814B2 (en) * 2010-08-30 2014-07-02 Ｔｏｗａ株式会社 Method and apparatus for manufacturing resin-sealed molded article having substrate exposed surface
JP5229292B2 (en) * 2010-10-01 2013-07-03 第一精工株式会社 Resin sealing device and resin sealing method
JP2013256002A (en) * 2012-06-11 2013-12-26 Yazaki Corp Insert molding apparatus, and insert molding method
US9269597B2 (en) * 2013-01-23 2016-02-23 Microchip Technology Incorporated Open cavity plastic package
NL2010252C2 (en) * 2013-02-06 2014-08-07 Boschman Tech Bv Semiconductor product processing method, including a semiconductor product encapsulation method and a semiconductor product carrier-mounting method, and corresponding semiconductor product processing apparatus.
JP5777660B2 (en) * 2013-05-17 2015-09-09 アサヒ・エンジニアリング株式会社 Resin molding apparatus and semiconductor device manufacturing method
WO2015083257A1 (en) * 2013-12-04 2015-06-11 信越エンジニアリング株式会社 Method for manufacturing bonded device
JP6087859B2 (en) * 2014-03-27 2017-03-01 Ｔｏｗａ株式会社 Resin molding apparatus and resin molding method

Also Published As

Publication number Publication date
JP6079925B1 (en) 2017-02-15
SG10201702521WA (en) 2017-10-30
CN107263827A (en) 2017-10-20
CN107263827B (en) 2020-05-19
JP2017177595A (en) 2017-10-05

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