MY188679A - Copper foil provided with carrier - Google Patents

Copper foil provided with carrier

Info

Publication number
MY188679A
MY188679A MYPI2018701007A MYPI2018701007A MY188679A MY 188679 A MY188679 A MY 188679A MY PI2018701007 A MYPI2018701007 A MY PI2018701007A MY PI2018701007 A MYPI2018701007 A MY PI2018701007A MY 188679 A MY188679 A MY 188679A
Authority
MY
Malaysia
Prior art keywords
carrier
copper foil
ultra
foil provided
layer
Prior art date
Application number
MYPI2018701007A
Inventor
Michiya Kohiki
Tomota Nagaura
Kazuhiko Sakaguchi
Toru Chiba
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=50278311&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MY188679(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY188679A publication Critical patent/MY188679A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

A carrier-attached copper foil suitable for fine pitching is provided. The carrier-attached copper foil includes a copper foil carrier, a release layer laminated onto the copper foil carrier, and an ultra-thin copper layer laminated on the release layer. The ultra-thin copper layer is roughened, and the Rz of the surface of the ultra-thin copper layer is 1.6 ?m or less when measured using a non-contact roughness meter. (Figure 1)
MYPI2018701007A 2012-09-11 2013-09-11 Copper foil provided with carrier MY188679A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012200017 2012-09-11
JP2012200973 2012-09-12
JP2012280024 2012-12-21
JP2013012468A JP5481577B1 (en) 2012-09-11 2013-01-25 Copper foil with carrier

Publications (1)

Publication Number Publication Date
MY188679A true MY188679A (en) 2021-12-22

Family

ID=50278311

Family Applications (2)

Application Number Title Priority Date Filing Date
MYPI2015000601A MY167704A (en) 2012-09-11 2013-09-11 Copper foil provided with carrier
MYPI2018701007A MY188679A (en) 2012-09-11 2013-09-11 Copper foil provided with carrier

Family Applications Before (1)

Application Number Title Priority Date Filing Date
MYPI2015000601A MY167704A (en) 2012-09-11 2013-09-11 Copper foil provided with carrier

Country Status (7)

Country Link
JP (1) JP5481577B1 (en)
KR (2) KR102050646B1 (en)
CN (4) CN104619889B (en)
MY (2) MY167704A (en)
PH (1) PH12015500529B1 (en)
TW (2) TWI575120B (en)
WO (1) WO2014042201A1 (en)

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CN108277509A (en) * 2012-11-20 2018-07-13 Jx日矿日石金属株式会社 Copper foil with carrier
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TWI613940B (en) * 2014-03-31 2018-02-01 Jx Nippon Mining & Metals Corp Copper foil with printed carrier, printed wiring board, laminated body, electronic device, and printed wiring board manufacturing method
JP2015205481A (en) * 2014-04-22 2015-11-19 Jx日鉱日石金属株式会社 Copper foil with carrier, copper-clad laminate, printed wiring board, electronic apparatus and manufacturing method of printed wiring board
JP6591766B2 (en) * 2014-04-24 2019-10-16 Ｊｘ金属株式会社 Copper foil with carrier, printed wiring board, laminate, electronic device and method for manufacturing printed wiring board
JP6297011B2 (en) * 2014-08-28 2018-03-20 株式会社有沢製作所 Three-layer flexible metal-clad laminate and double-sided three-layer flexible metal-clad laminate
CN105050331B (en) * 2015-07-07 2016-09-07 安徽铜冠铜箔有限公司 A kind of manufacture method of the high roughness electronics Copper Foil for ceramic base high-frequency copper-clad plate
JP6782561B2 (en) * 2015-07-16 2020-11-11 Ｊｘ金属株式会社 Copper foil with carrier, laminate, manufacturing method of laminate, manufacturing method of printed wiring board and manufacturing method of electronic equipment
JP6945523B2 (en) * 2016-04-14 2021-10-06 三井金属鉱業株式会社 Surface-treated copper foil, copper foil with carrier, and methods for manufacturing copper-clad laminates and printed wiring boards using them.
US10950768B2 (en) 2017-04-27 2021-03-16 Kyocera Corporation Circuit board and light-emitting device provided with same
WO2019003775A1 (en) 2017-06-29 2019-01-03 京セラ株式会社 Circuit board and light-emitting device provided with same
US10711360B2 (en) * 2017-07-14 2020-07-14 Rohm And Haas Electronic Materials Llc Nickel electroplating compositions with copolymers of arginine and bisepoxides and methods of electroplating nickel
MY204665A (en) 2018-03-30 2024-09-07 Mitsui Mining & Smelting Co Ltd Copper-clad laminate
KR102098475B1 (en) 2018-07-06 2020-04-07 주식회사 포스코 A Manufacturing Method of Surface-treated Zn-Ni Alloy Electroplated Steel Sheet Having Excellent Corrosion Resistivity and Paintability
JP6895936B2 (en) * 2018-09-28 2021-06-30 古河電気工業株式会社 Surface-treated copper foil, and copper-clad laminates and circuit boards using this
US10581081B1 (en) * 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
TWI697549B (en) * 2019-12-23 2020-07-01 長春人造樹脂廠股份有限公司 Liquid crystal polymer film and laminate comprising the same
TWI740515B (en) 2019-12-23 2021-09-21 長春人造樹脂廠股份有限公司 Liquid crystal polymer film and laminate comprising the same
EP4132235B1 (en) * 2020-03-30 2025-02-19 Mitsubishi Materials Corporation Bonded body and insulating circuit board
EP4212579A4 (en) * 2020-09-14 2024-10-16 Dai Nippon Printing Co., Ltd. Matte article
CN112226790B (en) * 2020-10-19 2022-04-22 九江德福科技股份有限公司 Production method of ultrathin high-strength electronic copper foil
WO2022153580A1 (en) * 2021-01-15 2022-07-21 Ｊｘ金属株式会社 Surface-treated copper foil, copper-clad laminate, and printed wiring board
WO2022244826A1 (en) * 2021-05-20 2022-11-24 三井金属鉱業株式会社 Roughened copper foil, copper foil with carrier, copper-cladded laminate board, and printed wiring board
KR20240017841A (en) * 2021-06-03 2024-02-08 미쓰이금속광업주식회사 Roughened copper foil, copper clad laminate and printed wiring board
EP4362611A1 (en) * 2021-06-24 2024-05-01 Kyocera Corporation Wiring board
WO2023281759A1 (en) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 Surface-treated copper foil, copper-clad laminate, and printed wiring board
TWI781818B (en) * 2021-11-05 2022-10-21 長春石油化學股份有限公司 Surface-treated copper foil and copper clad laminate
KR102872719B1 (en) * 2023-03-16 2025-10-17 와이엠티 주식회사 Carrier for metal foil with fine protrusions and metal foil comprising the same
CN120685415B (en) * 2025-08-26 2026-02-13 淄博芯材集成电路有限责任公司 Method for manufacturing test strips to simulate peel strength under inner layer substrate process flow

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TW595280B (en) * 2000-04-25 2004-06-21 Nippon Denkai Kk Copper foil for TAB tape carrier, TAB tape carrier using the copper foil and TAB carrier tape
US7026059B2 (en) * 2000-09-22 2006-04-11 Circuit Foil Japan Co., Ltd. Copper foil for high-density ultrafine printed wiring boad
JP2002134858A (en) * 2000-10-25 2002-05-10 Hitachi Cable Ltd Copper foil for printed circuit boards
JP4178415B2 (en) 2002-07-04 2008-11-12 三井金属鉱業株式会社 Electrolytic copper foil with carrier foil
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JP2010236072A (en) * 2009-03-31 2010-10-21 Nippon Mining & Metals Co Ltd Laminated copper foil and method for producing the same
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JP2010006071A (en) 2009-08-21 2010-01-14 Furukawa Electric Co Ltd:The Surface treatment copper foil, extremely thin copper foil with carrier, flexible copper clad laminate, and polyimide based flexible printed wiring board
JP5356968B2 (en) * 2009-09-30 2013-12-04 Ｊｘ日鉱日石金属株式会社 Sn plating film and composite material having the same
JP2011116074A (en) * 2009-12-07 2011-06-16 Jx Nippon Mining & Metals Corp Metal foil equipped with electric resistance film and board for printed circuit using the metal foil
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CN102452197B (en) * 2010-10-21 2014-08-20 财团法人工业技术研究院 Foil-attached copper foil and method for producing same
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JP2012167297A (en) * 2011-02-09 2012-09-06 Jfe Steel Corp Electrogalvanized steel plate

Also Published As

Publication number Publication date
MY167704A (en) 2018-09-21
CN104619889B (en) 2018-10-09
PH12015500529B1 (en) 2018-09-21
KR20150052315A (en) 2015-05-13
TW201428144A (en) 2014-07-16
KR101766554B1 (en) 2017-08-08
JP5481577B1 (en) 2014-04-23
KR20170046822A (en) 2017-05-02
CN107641820A (en) 2018-01-30
JP2014139336A (en) 2014-07-31
KR102050646B1 (en) 2019-11-29
TWI504788B (en) 2015-10-21
CN104619889A (en) 2015-05-13
TW201533280A (en) 2015-09-01
CN109379858A (en) 2019-02-22
WO2014042201A1 (en) 2014-03-20
CN108588766B (en) 2020-02-18
PH12015500529A1 (en) 2015-04-27
TWI575120B (en) 2017-03-21
CN108588766A (en) 2018-09-28

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