MY189234A - Epoxy resin composition, resin layer-attached carrier material metal base circuit substrate, and electronic device - Google Patents

Epoxy resin composition, resin layer-attached carrier material metal base circuit substrate, and electronic device

Info

Publication number
MY189234A
MY189234A MYPI2016000648A MYPI2016000648A MY189234A MY 189234 A MY189234 A MY 189234A MY PI2016000648 A MYPI2016000648 A MY PI2016000648A MY PI2016000648 A MYPI2016000648 A MY PI2016000648A MY 189234 A MY189234 A MY 189234A
Authority
MY
Malaysia
Prior art keywords
epoxy resin
resin composition
resin layer
circuit substrate
metal base
Prior art date
Application number
MYPI2016000648A
Inventor
Toshio Komiyatani
Daisuke Kitahara
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of MY189234A publication Critical patent/MY189234A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)

Abstract

An epoxy resin composition of the present invention is used to form an insulating resin layer (102) that constitutes a metal base circuit substrate (100) including a metal substrate (101), the insulating resin layer (102) provided on the metal substrate (101), and a metal layer (103) provided on the insulating resin layer (102). The epoxy resin composition includes an epoxy resin and alumina. The content of the alumina is equal to or more than 75% by mass and equal to or less than 95% by mass with respect to 100% by mass of a total solid content of the epoxy resin composition.
MYPI2016000648A 2013-10-17 2014-09-19 Epoxy resin composition, resin layer-attached carrier material metal base circuit substrate, and electronic device MY189234A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013216115 2013-10-17
PCT/JP2014/074820 WO2015056523A1 (en) 2013-10-17 2014-09-19 Epoxy-resin composition, carrier material with resin layer, metal-based circuit board, and electronic device

Publications (1)

Publication Number Publication Date
MY189234A true MY189234A (en) 2022-01-31

Family

ID=52827976

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016000648A MY189234A (en) 2013-10-17 2014-09-19 Epoxy resin composition, resin layer-attached carrier material metal base circuit substrate, and electronic device

Country Status (5)

Country Link
JP (1) JP6477483B2 (en)
CN (1) CN105659711A (en)
MY (1) MY189234A (en)
TW (1) TW201525055A (en)
WO (1) WO2015056523A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115216150A (en) 2014-02-24 2022-10-21 汉高知识产权控股有限责任公司 Thermally conductive precoat underfill formulation and use thereof
JP6846862B2 (en) * 2015-10-26 2021-03-24 京セラ株式会社 Printed wiring board and its manufacturing method
JP6724474B2 (en) * 2016-03-29 2020-07-15 味の素株式会社 Resin sheet
US20200102454A1 (en) 2016-12-27 2020-04-02 Hitachi Chemical Company, Ltd. Resin composition and electronic component device
CN106813209B (en) * 2017-03-08 2019-09-03 纳晶科技股份有限公司 Quantum dot film, the manufacturing method of quantum dot film and the display containing the quantum dot film
WO2021090630A1 (en) * 2019-11-08 2021-05-14 デンカ株式会社 Insulating resin composition, insulating resin cured body, layered body, and circuit base board
JP7543395B2 (en) * 2020-03-31 2024-09-02 デンカ株式会社 Alumina powder, resin composition, and heat dissipation part
JP7546044B2 (en) * 2020-03-31 2024-09-05 デンカ株式会社 Alumina powder, resin composition, and heat dissipation part
CN111556649B (en) * 2020-05-15 2021-03-30 上海林众电子科技有限公司 Insulated metal substrate and preparation method and application thereof
EP3937227B1 (en) * 2020-07-09 2025-03-05 Infineon Technologies Austria AG A semiconductor device package comprising a thermal interface material with improved handling properties
JP7594419B2 (en) * 2020-12-01 2024-12-04 イビデン株式会社 Thermally conductive resin composition, heat dissipation structure, and method for producing thermally conductive resin composition
KR102742635B1 (en) * 2022-03-30 2024-12-17 후루카와 덴키 고교 가부시키가이샤 Composition for thermally conductive film-type adhesive and thermally conductive film-type adhesive, and semiconductor package using thermally conductive film-type adhesive and method for manufacturing the same

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5822055B2 (en) * 1979-06-15 1983-05-06 昭和電工株式会社 Compounding agents for polymeric substances
JPS5635494A (en) * 1979-08-30 1981-04-08 Showa Denko Kk High heat transfer electric insulating substrate
JPS57182917A (en) * 1981-05-06 1982-11-11 Showa Denko Kk High thermal conductive electrically insulated substrate
JPS6296313A (en) * 1985-10-24 1987-05-02 Denki Kagaku Kogyo Kk Production of high-purity spherical silica filler
JPH0883979A (en) * 1994-09-12 1996-03-26 Hitachi Chem Co Ltd Manufacturing method of metal base substrate
JP2000049461A (en) * 1998-07-28 2000-02-18 Matsushita Electric Works Ltd Manufacturing method of multilayer printed wiring board
JP4004270B2 (en) * 2001-11-05 2007-11-07 電気化学工業株式会社 High thermal conductive inorganic powder and resin composition
JP2003306594A (en) * 2002-04-17 2003-10-31 Hitachi Ltd Epoxy resin composition and rotating machine using the same
JP2003342021A (en) * 2002-05-28 2003-12-03 Polymatech Co Ltd Aluminum oxide powder composition and heat-conductive molding containing the same
JP4309710B2 (en) * 2003-07-11 2009-08-05 住友ベークライト株式会社 Adhesive film for semiconductor, dicing film and semiconductor device
JP2005089633A (en) * 2003-09-18 2005-04-07 Denki Kagaku Kogyo Kk Curable composite material and circuit board using the same
JP2005306718A (en) * 2004-01-08 2005-11-04 Showa Denko Kk Inorganic powder, resin composition filled with the powder, and use thereof
JP2005213459A (en) * 2004-01-30 2005-08-11 Nippon Steel Corp High thermal conductivity material
US20050228097A1 (en) * 2004-03-30 2005-10-13 General Electric Company Thermally conductive compositions and methods of making thereof
JP4906243B2 (en) * 2004-06-02 2012-03-28 電気化学工業株式会社 Inorganic powder and its use
KR101239010B1 (en) * 2005-09-05 2013-03-04 덴끼 가가꾸 고교 가부시키가이샤 Resin composition and hybrid integrated circuit board making use of the same
JP4922793B2 (en) * 2007-03-09 2012-04-25 アルファーサイエンティフィック株式会社 Mixed conductive powder and method for producing the same, conductive paste and method for producing the same
WO2009017170A1 (en) * 2007-07-31 2009-02-05 Denki Kagaku Kogyo Kabushiki Kaisha Alumina powder, process for producing the same, and composition containing the same
JP5345340B2 (en) * 2008-05-16 2013-11-20 新日鉄住金マテリアルズ株式会社 Alumina-containing particles and resin moldings
CN102337006B (en) * 2010-07-02 2014-09-10 日立化成工业株式会社 Resin composition, B stage sheet, metal foil with resin, metal substrate, and LED substrate
JP5568399B2 (en) * 2010-07-14 2014-08-06 電気化学工業株式会社 Spherical alumina powder, production method and use thereof
JP5870934B2 (en) * 2010-12-28 2016-03-01 住友ベークライト株式会社 Method for manufacturing metal-based circuit board
EP2692526B1 (en) * 2011-03-28 2020-10-28 Hitachi Chemical Company, Ltd. Multilayer resin sheet, resin sheet laminate, cured multilayer resin sheet and method for producing same, multilayer resin sheet with metal foil, and semiconductor device
CN102212250A (en) * 2011-04-15 2011-10-12 广东生益科技股份有限公司 Filler composition and copper clad laminate made using it
JP2013014671A (en) * 2011-07-01 2013-01-24 Hitachi Chemical Co Ltd Resin composition sheet, resin composition sheet with metal foil, metal base wiring board material, metal base wiring board and electronic member
JP5263429B1 (en) * 2012-05-21 2013-08-14 東洋インキＳｃホールディングス株式会社 Thermally conductive easily deformable aggregate and method for producing the same

Also Published As

Publication number Publication date
WO2015056523A1 (en) 2015-04-23
CN105659711A (en) 2016-06-08
JPWO2015056523A1 (en) 2017-03-09
TW201525055A (en) 2015-07-01
JP6477483B2 (en) 2019-03-06

Similar Documents

Publication Publication Date Title
EP3128540A4 (en) Thermosetting resin composition, semiconductor device and electrical/electronic component
IN2014CN03520A (en)
GB2497451A (en) Gate insulator layer for electronic devices
SG10201403101WA (en) Resin Composition
TW201613037A (en) Substrate for power modules, substrate with heat sink for power modules and power module with heat sink
PH12015500899B1 (en) Coverplay film, flexible printed circuit board using same, and production method therefor
MX351312B (en) Electronic control apparatus and method for connecting substrate of electronic control apparatus.
WO2014112954A8 (en) Substrate for semiconductor packaging and method of forming same
TW201614848A (en) Field effect transistor and semiconductor device
MY169978A (en) Low dielectric loss thermoset resin system at high frequency for use in electrical components
MX371065B (en) ADHESIVE COMPOSITIONS CONTAINING GRAPHENIC CARBON PARTICLES.
IN2014KN02828A (en)
TW201612461A (en) Heat dispersion structure and manufacturing method thereof
WO2014195482A3 (en) Organic electronic device
SG10201401166YA (en) Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereof
EP3054752A4 (en) Curable composition for printed circuit board, and cured coating film and printed circuit board incorporating same
SG10201805388PA (en) Insulating layer for printed circuit board and printed circuit board
WO2019096717A3 (en) Composition for organic electronic devices
MY168401A (en) Entry sheet for drilling
WO2014106524A3 (en) Materials for electronic devices
EP3031859A4 (en) Epoxy resin composition and electronic component device
EP3290453A4 (en) Epoxy resin composition, thermoconductive material precursor, b-stage sheet, prepreg, heat-dissipating material, laminated plate, metal substrate, and printed circuit board
MY188498A (en) Epoxy resin composition
EP2662395A3 (en) Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound
PL3590652T3 (en) Solder alloy, solder junction material, and electronic circuit substrate