MY190233A - Pressure-sensitive adhesive tape - Google Patents

Pressure-sensitive adhesive tape

Info

Publication number
MY190233A
MY190233A MYPI2021003938A MYPI2021003938A MY190233A MY 190233 A MY190233 A MY 190233A MY PI2021003938 A MYPI2021003938 A MY PI2021003938A MY PI2021003938 A MYPI2021003938 A MY PI2021003938A MY 190233 A MY190233 A MY 190233A
Authority
MY
Malaysia
Prior art keywords
adhesive tape
pressure
sensitive adhesive
foam substrate
block
Prior art date
Application number
MYPI2021003938A
Inventor
Akifumi Horio
Makoto Fukuyama
Tatsuya Nishigaki
Satoshi Doi
Yasushi ISHIDO
Hina Yasuda
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of MY190233A publication Critical patent/MY190233A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/065—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/26—Porous or cellular plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2353/00—Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Organic Insulating Materials (AREA)

Abstract

The present invention aims to provide an adhesive tape having excellent flexibility and shock resistance while having excellent heat resistance. Provided is an adhesive tape including a foam substrate and an adhesive layer on both sides of the foam substrate, the foam substrate containing a block copolymer including at least one hard block and one soft block, the soft block including a (meth)acrylic monomer.
MYPI2021003938A 2019-04-24 2020-04-23 Pressure-sensitive adhesive tape MY190233A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019082813 2019-04-24
PCT/JP2020/017519 WO2020218430A1 (en) 2019-04-24 2020-04-23 Pressure-sensitive adhesive tape

Publications (1)

Publication Number Publication Date
MY190233A true MY190233A (en) 2022-04-06

Family

ID=72942794

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2021003938A MY190233A (en) 2019-04-24 2020-04-23 Pressure-sensitive adhesive tape

Country Status (6)

Country Link
JP (2) JP6966650B2 (en)
KR (2) KR102425598B1 (en)
CN (1) CN113302250B (en)
MY (1) MY190233A (en)
TW (1) TWI833947B (en)
WO (1) WO2020218430A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022092149A1 (en) * 2020-10-28 2022-05-05 積水化学工業株式会社 Pressure-sensitive adhesive tape
CN116367994B (en) * 2020-10-28 2025-11-11 积水化学工业株式会社 Adhesive tape
CN116096829A (en) * 2020-10-28 2023-05-09 积水化学工业株式会社 Adhesive tape
TW202311466A (en) * 2021-05-17 2023-03-16 日商積水化學工業股份有限公司 Adhesive tape
KR20220165381A (en) * 2021-06-08 2022-12-15 엘지디스플레이 주식회사 Display module and display device including the same
CN118119653A (en) * 2021-10-28 2024-05-31 井上株式会社 Foamed sheet and electronic and electrical equipment using the same
WO2023139826A1 (en) * 2022-01-18 2023-07-27 日東電工株式会社 Foam member

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060173124A1 (en) * 2005-02-01 2006-08-03 National Starch And Chemical Investment Holding Corporation Solution pressure sensitive adhesives based on acrylic block copolymers
WO2007138936A1 (en) * 2006-05-26 2007-12-06 Denki Kagaku Kogyo Kabushiki Kaisha Tape base and adhesive tape
JP2009242541A (en) 2008-03-31 2009-10-22 Sekisui Chem Co Ltd Impact-absorbing tape
JP5249625B2 (en) 2008-04-15 2013-07-31 積水化学工業株式会社 Adhesive sheet for display device front plate
WO2013154137A1 (en) * 2012-04-13 2013-10-17 Dic株式会社 Adhesive tape
DE102013209827A1 (en) * 2012-06-21 2013-12-24 Tesa Se Heat resistant tape
KR20160060005A (en) * 2013-09-20 2016-05-27 세키스이가가쿠 고교가부시키가이샤 Double-sided adhesive tape for portable electronic device
JP6367598B2 (en) * 2013-11-22 2018-08-01 日東電工株式会社 Double-sided adhesive sheet
JP6314341B2 (en) * 2014-06-26 2018-04-25 Dic株式会社 Double-sided adhesive tape and articles
CN106062113A (en) * 2014-09-02 2016-10-26 积水化学工业株式会社 Double-sided adhesive tape for portable electronic device
KR102350651B1 (en) * 2014-11-11 2022-01-11 가부시키가이샤 데라오카 세이사쿠쇼 Adhesive tape having foamed resin base material, and method for producing same
JPWO2017131082A1 (en) * 2016-01-26 2018-11-15 積水化学工業株式会社 Double-sided adhesive tape
EP3336153B1 (en) * 2016-12-19 2020-11-25 3M Innovative Properties Company Rubber-based multilayer pressure-sensitive adhesive assembly having low voc characteristics
KR102168746B1 (en) * 2017-03-13 2020-10-22 주식회사 엘지화학 Foam film, method for manufacturing the same and foam adhesive tape comprising the same
JP6878098B2 (en) * 2017-03-31 2021-05-26 積水化学工業株式会社 Foam sheet and adhesive tape
JP7460315B2 (en) * 2017-03-31 2024-04-02 リンテック株式会社 Adhesive compositions, adhesives and adhesive sheets
KR101989614B1 (en) * 2017-09-27 2019-09-30 주식회사 애니원 Impact-absorbing adhesive tape having improved durability in an environment with a high temperature and a high humidity
WO2020059791A1 (en) 2018-09-21 2020-03-26 積水化学工業株式会社 Double-sided adhesive tape

Also Published As

Publication number Publication date
JP6966650B2 (en) 2021-11-17
KR20210079375A (en) 2021-06-29
JPWO2020218430A1 (en) 2021-09-13
KR102559150B1 (en) 2023-07-24
JP2021191877A (en) 2021-12-16
TWI833947B (en) 2024-03-01
KR20220103829A (en) 2022-07-22
JP7547298B2 (en) 2024-09-09
CN113302250A (en) 2021-08-24
CN113302250B (en) 2023-02-17
KR102425598B1 (en) 2022-07-27
TW202104490A (en) 2021-02-01
WO2020218430A1 (en) 2020-10-29

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