MY190752A - Solder alloy, solder paste, solder ball, solder preform, and solder joint - Google Patents

Solder alloy, solder paste, solder ball, solder preform, and solder joint

Info

Publication number
MY190752A
MY190752A MYPI2021003229A MYPI2021003229A MY190752A MY 190752 A MY190752 A MY 190752A MY PI2021003229 A MYPI2021003229 A MY PI2021003229A MY PI2021003229 A MYPI2021003229 A MY PI2021003229A MY 190752 A MY190752 A MY 190752A
Authority
MY
Malaysia
Prior art keywords
solder
alloy
preform
paste
joint
Prior art date
Application number
MYPI2021003229A
Inventor
Masato Shiratori
Yuji Kawamata
Hiroyoshi Kawasaki
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of MY190752A publication Critical patent/MY190752A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Provided are a solder alloy which has excellent temperature cycle characteristics and drop impact resistance and in which yellowish discoloration is suppressed, excellent wettability is maintained, and an increase in viscosity of a solder paste over time can be suppressed, and a solder paste, a solder ball, a solder preform, and a solder joint in which the solder alloy is used. The solder alloy consists of, by mass%, 0.2% to 1.2% of Ag, 0.6% to 0.9% of Cu, 1.2% to 3.0% of Bi, 0.01% to 2.0% of In, 0.02% to 1.0% of Sb, 0.0040% to 0.025% of As, and a balance of Sn.
MYPI2021003229A 2019-05-27 2020-05-21 Solder alloy, solder paste, solder ball, solder preform, and solder joint MY190752A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019098947 2019-05-27
PCT/JP2020/020063 WO2020241436A1 (en) 2019-05-27 2020-05-21 Solder alloy, solder paste, solder ball, solder preform and solder joint

Publications (1)

Publication Number Publication Date
MY190752A true MY190752A (en) 2022-05-12

Family

ID=73553754

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2021003229A MY190752A (en) 2019-05-27 2020-05-21 Solder alloy, solder paste, solder ball, solder preform, and solder joint

Country Status (4)

Country Link
JP (3) JP6810374B1 (en)
CN (1) CN113165123B (en)
MY (1) MY190752A (en)
WO (1) WO2020241436A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY190752A (en) * 2019-05-27 2022-05-12 Senju Metal Industry Co Solder alloy, solder paste, solder ball, solder preform, and solder joint
CN114012303A (en) * 2021-10-28 2022-02-08 宁波佳明金属制品有限公司 Low-temperature solder and preparation method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07171693A (en) * 1993-12-20 1995-07-11 Toshiba Corp Solder
JP2000173253A (en) * 1998-09-30 2000-06-23 Matsushita Electric Ind Co Ltd Portable mini disk player
WO2000018536A1 (en) * 1998-09-30 2000-04-06 Matsushita Electric Industrial Co., Ltd. Soldering material and electric/electronic device using the same
WO2012127642A1 (en) * 2011-03-23 2012-09-27 千住金属工業株式会社 Lead-free solder alloy
US20150336216A1 (en) * 2013-01-11 2015-11-26 Senju Metal lndustry Co., Ltd. Cu BALL
CN111344106B (en) * 2017-11-24 2022-03-04 千住金属工业株式会社 Solder materials, solder pastes and solder joints
MY190752A (en) * 2019-05-27 2022-05-12 Senju Metal Industry Co Solder alloy, solder paste, solder ball, solder preform, and solder joint

Also Published As

Publication number Publication date
JPWO2020241436A1 (en) 2021-09-13
CN113165123A (en) 2021-07-23
JP2025061124A (en) 2025-04-10
JP6810374B1 (en) 2021-01-06
CN113165123B (en) 2022-03-01
JP2021037548A (en) 2021-03-11
WO2020241436A1 (en) 2020-12-03

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