MY190925A - Electronic-components sealing mold, transfer molding apparatus, and electronic-components sealing method - Google Patents

Electronic-components sealing mold, transfer molding apparatus, and electronic-components sealing method

Info

Publication number
MY190925A
MY190925A MYPI2017704846A MYPI2017704846A MY190925A MY 190925 A MY190925 A MY 190925A MY PI2017704846 A MYPI2017704846 A MY PI2017704846A MY PI2017704846 A MYPI2017704846 A MY PI2017704846A MY 190925 A MY190925 A MY 190925A
Authority
MY
Malaysia
Prior art keywords
mold
electronic
mold cavity
holder
cavity block
Prior art date
Application number
MYPI2017704846A
Inventor
Masuda Kosaku
Nishimoto Masakazu
Miyahara Hiroaki
Original Assignee
Dai Ichi Seiko Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Ichi Seiko Co Ltd filed Critical Dai Ichi Seiko Co Ltd
Publication of MY190925A publication Critical patent/MY190925A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/3665—Moulds for making articles of definite length, i.e. discrete articles cores or inserts, e.g. pins, mandrels, sliders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5875—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

An electronic-components sealing mold (2) is provided with: a lower-mold cavity block (53) for placing a substrate (91) with electronic-components mounted on a surface thereof; an upper-mold cavity holder (23) that vertically moves in conjunction with vertical movement of the lower-mold cavity block (53) and holds the substrate (91) with the lower-mold cavity block (53); an upper-mold chess holder (22) that vertically moves in conjunction with vertical movement of the upper-mold cavity holder (23) and has through-holes; an upper-mold spring (28) that expands/contracts in conjunction with vertical movement of the upper-mold chess holder (22); an upper-mold cavity block (27) that is positioned so as to be vertically movable inside the upper-mold cavity holder (23) and forms a cavity with the lower-mold cavity block (53); and joining members (25) that are inserted in the through-holes of the upper-mold chess holder (22) so as to be slidably movable and fixed to an upper face of the upper-mold cavity block (27). The lower-mold cavity block (53) is provided with a pot part in which a plunger for injecting a molten resin covering front faces of the electronic components into the cavity can be inserted. (Figure 2)
MYPI2017704846A 2015-06-19 2016-01-08 Electronic-components sealing mold, transfer molding apparatus, and electronic-components sealing method MY190925A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015124024A JP6020667B1 (en) 2015-06-19 2015-06-19 Transfer molding machine and method of manufacturing electronic component
PCT/JP2016/050550 WO2016203779A1 (en) 2015-06-19 2016-01-08 Electronic-components sealing mold, transfer molding machine, and electronic-components sealing method

Publications (1)

Publication Number Publication Date
MY190925A true MY190925A (en) 2022-05-20

Family

ID=57216899

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017704846A MY190925A (en) 2015-06-19 2016-01-08 Electronic-components sealing mold, transfer molding apparatus, and electronic-components sealing method

Country Status (6)

Country Link
JP (1) JP6020667B1 (en)
KR (1) KR102144610B1 (en)
CN (1) CN107708956B (en)
MY (1) MY190925A (en)
TW (1) TWI668769B (en)
WO (1) WO2016203779A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6296195B1 (en) * 2017-07-21 2018-03-20 第一精工株式会社 Resin sealing mold adjustment method and resin sealing mold
TWI787417B (en) * 2018-02-09 2022-12-21 日商山田尖端科技股份有限公司 Mold for compression molding and compression molding device
JP7092513B2 (en) * 2018-02-09 2022-06-28 アピックヤマダ株式会社 Mold base for compression molding dies
JP6923502B2 (en) * 2018-11-21 2021-08-18 Ｔｏｗａ株式会社 Transfer drive mechanism, resin molding device and manufacturing method of resin molded products
CN110126177A (en) * 2019-05-30 2019-08-16 开平市盈光机电科技有限公司 A kind of moulding process for the cell phone rear cover embryo material including center adjusting active type chamber by spring
JP7160770B2 (en) * 2019-07-22 2022-10-25 アピックヤマダ株式会社 Resin molding equipment
TWI711520B (en) * 2019-09-11 2020-12-01 日商朝日科技股份有限公司 Resin sealing forming device and resin sealing forming method
CN112976666B (en) * 2019-12-12 2022-07-26 东莞市天贺电子科技有限公司 Dynamic balance buffer mechanism applied to compression forming die
US12394641B2 (en) * 2022-06-02 2025-08-19 Samsung Electronics Co., Ltd. Molding apparatus of semiconductor package
TWI822159B (en) * 2022-06-30 2023-11-11 萬潤科技股份有限公司 Pressing device and pressing equipment
JP7661285B2 (en) * 2022-07-15 2025-04-14 Ｔｏｗａ株式会社 Mold, resin molding device, and method for manufacturing resin molded product
KR102498076B1 (en) * 2022-08-22 2023-02-10 에스피반도체통신 주식회사 Mold for semicondeutor chip
CN115332095B (en) * 2022-10-12 2022-12-27 安徽大华半导体科技有限公司 QFN large substrate packaging mold and method
CN116604779A (en) * 2023-06-29 2023-08-18 广东鑫信智能装备有限公司 Semi-automatic plastic packaging machine
CN117790397B (en) * 2024-02-26 2024-05-10 湖南酷牛存储科技有限公司 Multilayer memory chip packaging equipment and working method thereof

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3524205B2 (en) * 1995-04-18 2004-05-10 株式会社サイネックス Semiconductor resin sealing device
JP3280634B2 (en) * 1999-03-26 2002-05-13 松下電工株式会社 Semiconductor package manufacturing method, mold for manufacturing semiconductor package, and semiconductor package
JP3368242B2 (en) * 1999-12-16 2003-01-20 第一精工株式会社 Resin sealing method and resin sealing device
EP1238775B1 (en) * 1999-12-16 2006-03-08 Dai-Ichi Seiko Co. Ltd. Resin sealing mold
JP2002219740A (en) * 2001-01-26 2002-08-06 Nec Kansai Ltd Apparatus and method for resin molding
JP2003053791A (en) * 2001-08-22 2003-02-26 Mitsubishi Electric Corp Semiconductor manufacturing apparatus and semiconductor device manufactured by the apparatus
JP3612063B2 (en) * 2003-02-24 2005-01-19 第一精工株式会社 Resin sealing mold, resin sealing method and resin sealing apparatus using the same
JP4243177B2 (en) * 2003-12-22 2009-03-25 株式会社ルネサステクノロジ Manufacturing method of semiconductor device
US8342837B2 (en) * 2006-09-19 2013-01-01 Dai-Ichi Seiko Co., Ltd. Resin sealing apparatus
JP5065747B2 (en) 2007-04-27 2012-11-07 アサヒ・エンジニアリング株式会社 Semiconductor package manufacturing method and manufacturing apparatus
JP5352896B2 (en) * 2008-01-19 2013-11-27 アピックヤマダ株式会社 Transfer molding method and transfer molding apparatus
JP6058431B2 (en) * 2013-03-08 2017-01-11 アピックヤマダ株式会社 Resin molding apparatus and resin molding method

Also Published As

Publication number Publication date
CN107708956B (en) 2020-06-09
JP2017011072A (en) 2017-01-12
TWI668769B (en) 2019-08-11
KR20180018573A (en) 2018-02-21
CN107708956A (en) 2018-02-16
JP6020667B1 (en) 2016-11-02
KR102144610B1 (en) 2020-08-13
WO2016203779A1 (en) 2016-12-22
TW201701371A (en) 2017-01-01

Similar Documents

Publication Publication Date Title
PH12013502391A1 (en) Apparatus and method for injection molding at low constant pressure
MX378475B (en) Plastic moulded part and method for the production thereof
PH12013502386A1 (en) Alternative pressure for a low constant pressure injection molding apparatus
JP2015226014A5 (en)
PH12016500203A1 (en) Injection molding machines and methods for accounting for changes in material properties during injection molding runs
BR112015002192A2 (en) injection molding apparatus and method comprising a mold cavity surface comprising a thermally controllable die
PH12016502612B1 (en) Apparatus and method for melting and molding metal in vacuum environment
SG10201806043PA (en) Resin molding apparatus and method for manufacturing resin molded product
MX2015006012A (en) Method for manuf acturing polarizing plastic lens.
MX2019012466A (en) Method and apparatus for counter-gravity mold filling.
MY176368A (en) System and method for manufacturing ophthalmic devices
MY187162A (en) Mould, moulding apparatus and method for controlled overmoulding of a carrier with electronic components and moulded product
MX2015014350A (en) Demoulding unit.
MY173026A (en) Injection molding method and injection molding machine
MX369187B (en) Casting method and casting device.
MX2016003094A (en) Apparatus and method for making an article.
MX2016015418A (en) A mould tool for injection moulding.
MY191719A (en) Resin molded article and method for producing resin molded article
MY175210A (en) Process for making molded devices
TW200713473A (en) Method of resin-seal-molding electronic component and apparatus therefor
MX2015008781A (en) Apparatus and method usable with an injection molder for producing articles, in particular orthodontic brackets.
MY182872A (en) Mold apparatus for molding metal in high vacuum environment
BR112013024170A2 (en) medical device comprising machined parts and injection molded parts
MY157603A (en) In-Mold Decoration Molding Method and In-Mold Decoration Molding Machine
IN2014CN03212A (en)