MY192207A - Die test apparatus and die transfer method - Google Patents

Die test apparatus and die transfer method

Info

Publication number
MY192207A
MY192207A MYPI2016702874A MYPI2016702874A MY192207A MY 192207 A MY192207 A MY 192207A MY PI2016702874 A MYPI2016702874 A MY PI2016702874A MY PI2016702874 A MYPI2016702874 A MY PI2016702874A MY 192207 A MY192207 A MY 192207A
Authority
MY
Malaysia
Prior art keywords
die
placement platform
swing arm
rotation
test apparatus
Prior art date
Application number
MYPI2016702874A
Inventor
Hsiu-Wei Lin
chun-shao Huang
Chien-Yu Li
Original Assignee
Mpi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mpi Corp filed Critical Mpi Corp
Publication of MY192207A publication Critical patent/MY192207A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
    • G01N35/10—Devices for transferring samples or any liquids to, in, or from, the analysis apparatus, e.g. suction devices, injection devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
    • G01N35/0099—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor comprising robots or similar manipulators

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

A die test apparatus (100) includes a first placement platform (110), a photographic device (130), a second placement platform (120), a transfer mechanism (140), and a calibration module (150). The photographic device (130) is for capturing an image of a die (C1) on a first carrying surface (110a) of the first placement platform (110). The calibration module (150) calculates a target point (T1) and a calibration amount of rotation according to the image. The transfer mechanism (140) comprises a base body (141), a swing arm (142), and a suction nozzle (143). A first end of the swing arm (142) is connected to the base body (141). The suction nozzle (143) is at a second end of the swing arm. The swing arm (142) operates according to a preset amount of rotation and the calibration amount of rotation to compensate a rotation offset of the die (C1) and to move the die (C1) from the first placement platform (110) to the second placement platform (120). Most illustrative drawings: FIG. 3
MYPI2016702874A 2016-01-21 2016-08-05 Die test apparatus and die transfer method MY192207A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105101935A TWI574022B (en) 2016-01-21 2016-01-21 Grain detecting device and die transfer method

Publications (1)

Publication Number Publication Date
MY192207A true MY192207A (en) 2022-08-08

Family

ID=58766063

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016702874A MY192207A (en) 2016-01-21 2016-08-05 Die test apparatus and die transfer method

Country Status (3)

Country Link
DE (1) DE102016106223B3 (en)
MY (1) MY192207A (en)
TW (1) TWI574022B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI651795B (en) * 2017-06-20 2019-02-21 梭特科技股份有限公司 Image assist method for placing chip and chip apparatus using the method
CN109060307B (en) * 2018-09-18 2021-02-09 罗昕明 Flip LED chip detection device
TWI720891B (en) * 2020-05-18 2021-03-01 聯詠科技股份有限公司 Testing system and testing method of chip package
CN115732378B (en) * 2021-08-30 2023-09-26 深圳市智立方自动化设备股份有限公司 A suction nozzle automatic calibration system and method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004363085A (en) * 2003-05-09 2004-12-24 Ebara Corp Inspection apparatus by charged particle beam and method for manufacturing device using inspection apparatus
CN101780456B (en) * 2010-01-08 2013-01-23 广东志成华科光电设备有限公司 Crystal grain angle correction method applied to chip sorting system
TWI447543B (en) * 2011-09-06 2014-08-01 旺矽科技股份有限公司 Grain picker with multi - take - and - letting structure and its alignment method
TWI525737B (en) * 2014-02-19 2016-03-11 聯詠科技股份有限公司 Method and apparatus for picking and placing chip dies with high aspect ratio

Also Published As

Publication number Publication date
DE102016106223B3 (en) 2017-06-29
TWI574022B (en) 2017-03-11
TW201727248A (en) 2017-08-01

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