MY192355A - Lead frame and manufacturing method thereof, and semiconductor package - Google Patents

Lead frame and manufacturing method thereof, and semiconductor package

Info

Publication number
MY192355A
MY192355A MYPI2017700493A MYPI2017700493A MY192355A MY 192355 A MY192355 A MY 192355A MY PI2017700493 A MYPI2017700493 A MY PI2017700493A MY PI2017700493 A MYPI2017700493 A MY PI2017700493A MY 192355 A MY192355 A MY 192355A
Authority
MY
Malaysia
Prior art keywords
lead frame
manufacturing
semiconductor package
pad
smooth surface
Prior art date
Application number
MYPI2017700493A
Inventor
Ishibashi Takahiro
Original Assignee
Mitsui High Tec
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui High Tec filed Critical Mitsui High Tec
Publication of MY192355A publication Critical patent/MY192355A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H10W70/429—Bent parts being the outer leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/466—Tape carriers or flat leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

To provide a lead frame (100) including a pad (10), leads (12) arranged around the pad (10), and support bars (14) supporting the pad (10), wherein the support bars (14) and the leads (12) each have a rough surface (32) and a smooth surface (30), the smooth surface (30) of the support bar (14) on a side of one main face (100a) is closer to the pad (10) than the smooth surface (30) of the lead (12). (Fig. 1)
MYPI2017700493A 2016-02-17 2017-02-15 Lead frame and manufacturing method thereof, and semiconductor package MY192355A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016028068A JP6621681B2 (en) 2016-02-17 2016-02-17 Lead frame, manufacturing method thereof, and semiconductor package

Publications (1)

Publication Number Publication Date
MY192355A true MY192355A (en) 2022-08-17

Family

ID=59648783

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017700493A MY192355A (en) 2016-02-17 2017-02-15 Lead frame and manufacturing method thereof, and semiconductor package

Country Status (4)

Country Link
JP (1) JP6621681B2 (en)
CN (1) CN107093594B (en)
MY (1) MY192355A (en)
TW (1) TWI642146B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7016677B2 (en) * 2017-11-21 2022-02-07 新光電気工業株式会社 Manufacturing method of lead frame, semiconductor device, lead frame
CN113261095B (en) * 2019-01-18 2024-11-26 三菱电机株式会社 Semiconductor device, method for manufacturing semiconductor device, and power conversion device
JP6741356B1 (en) * 2019-03-22 2020-08-19 大口マテリアル株式会社 Lead frame
JP6736716B1 (en) * 2019-03-22 2020-08-05 大口マテリアル株式会社 Lead frame
CN113838827A (en) * 2020-06-24 2021-12-24 上海凯虹科技电子有限公司 Lead frame and package
JP7451455B2 (en) 2021-03-19 2024-03-18 株式会社東芝 semiconductor equipment
JP2023132232A (en) * 2022-03-10 2023-09-22 株式会社三井ハイテック Lead frame and lead frame manufacturing method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03295262A (en) * 1990-04-13 1991-12-26 Mitsubishi Electric Corp Lead frame and manufacture thereof
JP2000243889A (en) * 1999-02-22 2000-09-08 Sony Corp Apparatus and method for processing shape of lead frame for semiconductor device and lead frame for semiconductor device
JP3314754B2 (en) * 1999-04-22 2002-08-12 松下電器産業株式会社 Semiconductor device having lead-free tin-based solder film and method of manufacturing the same
JP3841768B2 (en) * 2003-05-22 2006-11-01 新光電気工業株式会社 Package parts and semiconductor packages
US7049683B1 (en) * 2003-07-19 2006-05-23 Ns Electronics Bangkok (1993) Ltd. Semiconductor package including organo-metallic coating formed on surface of leadframe roughened using chemical etchant to prevent separation between leadframe and molding compound
US7838339B2 (en) * 2008-04-04 2010-11-23 Gem Services, Inc. Semiconductor device package having features formed by stamping
KR101113891B1 (en) * 2009-10-01 2012-02-29 삼성테크윈 주식회사 Lead frame and method of manufacturing lead frame
JP5669495B2 (en) * 2010-09-17 2015-02-12 株式会社大貫工業所 Resin-encapsulated metal component, lead frame used therefor, and method of manufacturing metal component
JP2014007363A (en) * 2012-06-27 2014-01-16 Renesas Electronics Corp Method of manufacturing semiconductor device and semiconductor device
JP2014093452A (en) * 2012-11-05 2014-05-19 Hitachi Cable Ltd Punching die, lead frame, and method of manufacturing lead frame
JP6093646B2 (en) * 2013-05-14 2017-03-08 新光電気工業株式会社 Manufacturing method of plating film

Also Published As

Publication number Publication date
TWI642146B (en) 2018-11-21
JP6621681B2 (en) 2019-12-18
TW201742197A (en) 2017-12-01
CN107093594B (en) 2019-05-03
CN107093594A (en) 2017-08-25
JP2017147332A (en) 2017-08-24

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