MY192453A - Silicone composition having excellent heat dissipation properties - Google Patents

Silicone composition having excellent heat dissipation properties

Info

Publication number
MY192453A
MY192453A MYPI2019002002A MYPI2019002002A MY192453A MY 192453 A MY192453 A MY 192453A MY PI2019002002 A MYPI2019002002 A MY PI2019002002A MY PI2019002002 A MYPI2019002002 A MY PI2019002002A MY 192453 A MY192453 A MY 192453A
Authority
MY
Malaysia
Prior art keywords
heat dissipation
excellent heat
silicone composition
dissipation properties
properties
Prior art date
Application number
MYPI2019002002A
Inventor
Ii Hyuck Yoo
Jang Min Lee
Original Assignee
Kcc Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kcc Corp filed Critical Kcc Corp
Publication of MY192453A publication Critical patent/MY192453A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The present invention relates to a silicone composition having excellent heat dissipation properties and being applicable to an electronic product and the like.
MYPI2019002002A 2016-11-21 2017-09-12 Silicone composition having excellent heat dissipation properties MY192453A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020160154665A KR101864505B1 (en) 2016-11-21 2016-11-21 Silicone composition having excellent heat-radiating function
PCT/KR2017/010010 WO2018093030A1 (en) 2016-11-21 2017-09-12 Silicone composition having excellent heat dissipation properties

Publications (1)

Publication Number Publication Date
MY192453A true MY192453A (en) 2022-08-21

Family

ID=62145164

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019002002A MY192453A (en) 2016-11-21 2017-09-12 Silicone composition having excellent heat dissipation properties

Country Status (5)

Country Link
KR (1) KR101864505B1 (en)
CN (1) CN109906249A (en)
MY (1) MY192453A (en)
TW (1) TWI661006B (en)
WO (1) WO2018093030A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020093258A1 (en) 2018-11-07 2020-05-14 Dow Global Technologies Llc Thermally conductive composition and methods and devices in which said composition is used
WO2025037579A1 (en) 2023-08-17 2025-02-20 ダウ・東レ株式会社 Thermally conductive composition, thermally conductive member, and heat-dissipating structure

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3900267B2 (en) * 2002-05-09 2007-04-04 信越化学工業株式会社 Room temperature curable organopolysiloxane composition
KR100891974B1 (en) 2002-12-27 2009-04-08 주식회사 엘지생활건강 Hypoallergenic cosmetic emulsion composition
EP1878767A1 (en) * 2006-07-12 2008-01-16 Shin-Etsu Chemical Co., Ltd. Heat conductive silicone grease composition and cured product thereof
JP4572243B2 (en) * 2008-03-27 2010-11-04 信越化学工業株式会社 Thermally conductive laminate and method for producing the same
JP5507059B2 (en) * 2008-05-27 2014-05-28 東レ・ダウコーニング株式会社 Thermally conductive silicone composition and electronic device
JP5667740B2 (en) * 2008-06-18 2015-02-12 東レ・ダウコーニング株式会社 Curable organopolysiloxane composition and semiconductor device
KR100999973B1 (en) * 2008-12-30 2010-12-13 남동진 Siloxane Heat Resistant Resin Composition
KR20110121881A (en) * 2010-05-03 2011-11-09 주식회사 케이씨씨 Silicone composition with excellent long-term storage stability and heat dissipation
JP5619487B2 (en) * 2010-06-24 2014-11-05 東レ・ダウコーニング株式会社 Thermally conductive silicone grease composition
GB201212782D0 (en) * 2012-07-18 2012-08-29 Dow Corning Organosiloxane compositions
WO2015016001A1 (en) * 2013-08-02 2015-02-05 株式会社ダイセル Curable resin composition and semiconductor device using same
EP3099746B1 (en) * 2014-01-27 2021-05-05 Dow Toray Co., Ltd. Silicone gel composition

Also Published As

Publication number Publication date
KR101864505B1 (en) 2018-06-29
TWI661006B (en) 2019-06-01
CN109906249A (en) 2019-06-18
WO2018093030A1 (en) 2018-05-24
KR20180056838A (en) 2018-05-30
TW201825596A (en) 2018-07-16

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