MY192587A - Binary weighted capacitor array with split capacitor layout - Google Patents

Binary weighted capacitor array with split capacitor layout

Info

Publication number
MY192587A
MY192587A MYPI2018001448A MYPI2018001448A MY192587A MY 192587 A MY192587 A MY 192587A MY PI2018001448 A MYPI2018001448 A MY PI2018001448A MY PI2018001448 A MYPI2018001448 A MY PI2018001448A MY 192587 A MY192587 A MY 192587A
Authority
MY
Malaysia
Prior art keywords
binary weighted
capacitor array
top plate
capacitor
split capacitor
Prior art date
Application number
MYPI2018001448A
Inventor
Kong Yew Tan
Binti Abdul Wahab Rohaya
Original Assignee
Mimos Berhad
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mimos Berhad filed Critical Mimos Berhad
Priority to MYPI2018001448A priority Critical patent/MY192587A/en
Priority to PCT/MY2019/000031 priority patent/WO2020036479A1/en
Publication of MY192587A publication Critical patent/MY192587A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/495—Capacitive arrangements or effects of, or between wiring layers
    • H10W20/496—Capacitor integral with wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
    • H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
    • H10D84/212—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only capacitors

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

The present invention discloses a method of building a binary weighted split capacitor array (1) for minimizing routing induced parasitic mismatch. Specifically, the binary weighted split capacitor array is built with a plurality of unit capacitors with three- dimensional structures having a top plate comprising a plurality of stacked metal plates (M2, M3, M4, M5) and a bottom plate enclosing the top plate with side walls, a floor layer and a ceiling layer to minimize top plate parasitic capacitance to the substrate, and to achieve overall equal parasitic capacitance to the substrate. (Figure 15)
MYPI2018001448A 2018-08-15 2018-08-15 Binary weighted capacitor array with split capacitor layout MY192587A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
MYPI2018001448A MY192587A (en) 2018-08-15 2018-08-15 Binary weighted capacitor array with split capacitor layout
PCT/MY2019/000031 WO2020036479A1 (en) 2018-08-15 2019-07-26 Binary weighted capacitor array with split capacitor layout

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI2018001448A MY192587A (en) 2018-08-15 2018-08-15 Binary weighted capacitor array with split capacitor layout

Publications (1)

Publication Number Publication Date
MY192587A true MY192587A (en) 2022-08-29

Family

ID=69525735

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018001448A MY192587A (en) 2018-08-15 2018-08-15 Binary weighted capacitor array with split capacitor layout

Country Status (2)

Country Link
MY (1) MY192587A (en)
WO (1) WO2020036479A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114551433B (en) 2020-11-25 2025-04-25 扬智科技股份有限公司 Layout structure
CN114726374B (en) * 2022-04-22 2024-04-30 深圳市灵明光子科技有限公司 A capacitor array structure
CN114844503B (en) * 2022-05-11 2024-05-14 上海交通大学 Low-power successive approximation analog-to-digital converter based on split capacitor DAC

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7473955B1 (en) * 2006-03-07 2009-01-06 Alvand Technologies, Inc. Fabricated cylinder capacitor for a digital-to-analog converter
US7456462B1 (en) * 2006-03-07 2008-11-25 Alvand Technologies, Inc. Fabricated U-shaped capacitor for a digital-to-analog converter
US20140049872A1 (en) * 2012-08-16 2014-02-20 Himax Technologies Limited Metal-oxide-metal capacitor able to reduce area of capacitor arrays
CN104143982B (en) * 2014-04-02 2017-11-10 上海菱沃铂智能技术有限公司 A kind of small area DAC capacitor arrays for SAR types ADC
WO2017168521A1 (en) * 2016-03-28 2017-10-05 オリンパス株式会社 A/d converter and a/d conversion apparatus

Also Published As

Publication number Publication date
WO2020036479A1 (en) 2020-02-20

Similar Documents

Publication Publication Date Title
MY192587A (en) Binary weighted capacitor array with split capacitor layout
EP4102585A3 (en) High density three-dimensional integrated capacitors
EA200900498A1 (en) ISOLATED PRODUCTS IN THE FORM OF THE BOX
JP2016534571A5 (en)
DE602005005478D1 (en) MULTIPLE CAPACITIVE CONVERTER
EP4583660A3 (en) Methods of forming a semiconductor device structure including a stair step structure, and related semiconductor devices
JP2017098020A5 (en)
TW200744218A (en) Semiconductor device and method of manufacturing the same
ATE279233T1 (en) IMPLANTABLE MEDICAL DEVICE COMPRISING A FLAT ELECTROLYTIC CAPACITOR WITH MATCHED ANODE LAYERS
TW201613049A (en) Semiconductor package and method of manufacture
WO2012087485A3 (en) Rectangular capacitors for dynamic random access memory (dram) and dual-pass lithography methods to form the same
TW200713358A (en) Solid capacitor and fabrication method thereof
EP4097616A4 (en) ENHANCED BLOCKCHAIN MAIN NODE COMPUTER STACK
US7339225B2 (en) Capacitor structure
WO2019243882A3 (en) Semiconductor structure enhanced for high voltage applications
TWI583005B (en) Stackable high-density metal-oxide-metal capacitor with minimal top plate parasitic capacitance
US20180358390A1 (en) Dielectric capacitor
MX379896B (en) Residential block and method for producing a thermal insulation
TW200735172A (en) Integrated circuit devices and fabrication method thereof, and methods for forming metal-insulator-metal capacitors
TW200707767A (en) Methods of forming metal-insulator-metal (MIM) capacitors with passivation layers on dielectric layers and devices so formed
MY206762A (en) Package with embedded capacitors
EP3203501A3 (en) Nonvolatile memory device and method for manufacturing the same
WO2014165247A3 (en) Capacitors comprising pores in an aluminium substrate
RU2011141825A (en) OIL TRANSFORMER ISOLATING MODULE
JP2016170018A (en) MEMS equipment