MY192589A - Wiring substrate, method for manufacturing wiring substrate, electronic component, and method for manufacturing electronic component - Google Patents

Wiring substrate, method for manufacturing wiring substrate, electronic component, and method for manufacturing electronic component

Info

Publication number
MY192589A
MY192589A MYPI2019000001A MYPI2019000001A MY192589A MY 192589 A MY192589 A MY 192589A MY PI2019000001 A MYPI2019000001 A MY PI2019000001A MY PI2019000001 A MYPI2019000001 A MY PI2019000001A MY 192589 A MY192589 A MY 192589A
Authority
MY
Malaysia
Prior art keywords
wiring substrate
electronic component
manufacturing
layer
conductor portions
Prior art date
Application number
MYPI2019000001A
Inventor
Ha HWANG Sun
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of MY192589A publication Critical patent/MY192589A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A wiring substrate (1) includes a first layer (100) and a second layer (200) on one surface of the first layer (100). The first layer (100) includes a plurality of first conductor portions (6) and a resin portion (3) disposed between the plurality of first conductor portions (6) to electrically isolate the plurality of first conductor portions (6). The second layer (200) includes a plurality of second conductor portions (4) in contact with the plurality of first conductor portions (6), respectively, and electrically isolated from each other. The plurality of second conductor portions (4) are each in contact with the resin portion (3) on a portion of a surface of the second conductor portion (4) closer to the first layer (100). Figure 1
MYPI2019000001A 2016-07-08 2017-04-04 Wiring substrate, method for manufacturing wiring substrate, electronic component, and method for manufacturing electronic component MY192589A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016136037A JP6333894B2 (en) 2016-07-08 2016-07-08 Wiring board, wiring board manufacturing method, electronic component, and electronic component manufacturing method
PCT/JP2017/014101 WO2018008214A1 (en) 2016-07-08 2017-04-04 Wiring board, method for manufacturing wiring board, electronic component, and method for manufacturing electronic component

Publications (1)

Publication Number Publication Date
MY192589A true MY192589A (en) 2022-08-29

Family

ID=60912065

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019000001A MY192589A (en) 2016-07-08 2017-04-04 Wiring substrate, method for manufacturing wiring substrate, electronic component, and method for manufacturing electronic component

Country Status (6)

Country Link
JP (1) JP6333894B2 (en)
KR (1) KR102254999B1 (en)
CN (1) CN109478536A (en)
MY (1) MY192589A (en)
TW (1) TWI650051B (en)
WO (1) WO2018008214A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003303859A (en) * 2002-04-10 2003-10-24 Hitachi Cable Ltd Tape carrier for semiconductor device and method of manufacturing the same
US7164192B2 (en) * 2003-02-10 2007-01-16 Skyworks Solutions, Inc. Semiconductor die package with reduced inductance and reduced die attach flow out
JP2005116909A (en) * 2003-10-10 2005-04-28 Hitachi Cable Ltd Electronic device and wiring board used in electronic device
JP2011029518A (en) * 2009-07-28 2011-02-10 Shindo Denshi Kogyo Kk Flexible printed wiring board, semiconductor device, and method for manufacturing the same
JP5848976B2 (en) * 2012-01-25 2016-01-27 新光電気工業株式会社 WIRING BOARD, LIGHT EMITTING DEVICE, AND WIRING BOARD MANUFACTURING METHOD

Also Published As

Publication number Publication date
TW201804881A (en) 2018-02-01
TWI650051B (en) 2019-02-01
JP6333894B2 (en) 2018-05-30
WO2018008214A1 (en) 2018-01-11
CN109478536A (en) 2019-03-15
JP2018006702A (en) 2018-01-11
KR102254999B1 (en) 2021-05-24
KR20190025835A (en) 2019-03-12

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