MY192594A - Processing device of electronic component - Google Patents

Processing device of electronic component

Info

Publication number
MY192594A
MY192594A MYPI2021003251A MYPI2021003251A MY192594A MY 192594 A MY192594 A MY 192594A MY PI2021003251 A MYPI2021003251 A MY PI2021003251A MY PI2021003251 A MYPI2021003251 A MY PI2021003251A MY 192594 A MY192594 A MY 192594A
Authority
MY
Malaysia
Prior art keywords
electronic component
turning
processing device
component holding
displacement
Prior art date
Application number
MYPI2021003251A
Inventor
Nagasato Shoichi
Original Assignee
Ueno Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ueno Seiki Co Ltd filed Critical Ueno Seiki Co Ltd
Publication of MY192594A publication Critical patent/MY192594A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/914—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems incorporating rotary and rectilinear movements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Specific Conveyance Elements (AREA)
  • Manipulator (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A processing device of an electronic component includes a turning portion, an electronic component holding portion that is provided on the turning portion, a holding position changing portion that enables displacement of the electronic component holding portion with respect to the turning portion in a predetermined displacement direction, a turning drive portion that is configured to turn the turning portion, and a displacement drive portion that is provided so as to move the electronic component holding portion to one side in the displacement direction. The holding position changing portion includes a plurality of parallel leaf springs that intersect the displacement direction and connect the electronic component holding portion and the turning portion.
MYPI2021003251A 2019-09-20 2020-09-16 Processing device of electronic component MY192594A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019171910A JP6817648B1 (en) 2019-09-20 2019-09-20 Electronic component processing equipment
PCT/JP2020/035053 WO2021054354A1 (en) 2019-09-20 2020-09-16 Electronic component processing device

Publications (1)

Publication Number Publication Date
MY192594A true MY192594A (en) 2022-08-29

Family

ID=74164645

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2021003251A MY192594A (en) 2019-09-20 2020-09-16 Processing device of electronic component

Country Status (6)

Country Link
JP (1) JP6817648B1 (en)
CN (1) CN113196896B (en)
MY (1) MY192594A (en)
SG (1) SG11202106623QA (en)
TW (1) TWI746170B (en)
WO (1) WO2021054354A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11622485B1 (en) * 2021-09-22 2023-04-04 Asmpt Singapore Pte. Ltd. Flexural pick arm for a pick and place apparatus

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2845161B2 (en) * 1995-04-28 1999-01-13 ニチデン機械株式会社 Collet and die bonder using the same
US6269846B1 (en) * 1998-01-13 2001-08-07 Genetic Microsystems, Inc. Depositing fluid specimens on substrates, resulting ordered arrays, techniques for deposition of arrays
JP3817207B2 (en) * 2002-08-21 2006-09-06 Ｔｄｋ株式会社 Mounting processing device and control device for mounting processing device
JP5011720B2 (en) * 2005-12-19 2012-08-29 シンフォニアテクノロジー株式会社 Parts supply device
TWI471971B (en) * 2007-10-30 2015-02-01 尼康股份有限公司 Substrate holding member, substrate bonding apparatus, laminated substrate manufacturing apparatus, substrate bonding method, laminated substrate manufacturing method, and laminated semiconductor device manufacturing method
PH12013501086A1 (en) * 2010-11-30 2013-07-08 Ueno Seiki Co Ltd Electronic component holding device, electronic component inspecting device provided therewith, and electronic component classification device
JP5370949B1 (en) * 2013-03-11 2013-12-18 アキム株式会社 Work conveying method and apparatus
JP5828943B1 (en) * 2014-08-11 2015-12-09 株式会社新川 Electronic component mounting equipment
JP6516132B1 (en) * 2018-02-09 2019-05-22 上野精機株式会社 Electronic component processing device

Also Published As

Publication number Publication date
CN113196896B (en) 2022-08-23
JP6817648B1 (en) 2021-01-20
CN113196896A (en) 2021-07-30
WO2021054354A1 (en) 2021-03-25
JP2021050046A (en) 2021-04-01
TWI746170B (en) 2021-11-11
SG11202106623QA (en) 2021-07-29
TW202122331A (en) 2021-06-16

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