MY192661A - Semiconductor processing tape - Google Patents

Semiconductor processing tape

Info

Publication number
MY192661A
MY192661A MYPI2017001239A MYPI2017001239A MY192661A MY 192661 A MY192661 A MY 192661A MY PI2017001239 A MYPI2017001239 A MY PI2017001239A MY PI2017001239 A MYPI2017001239 A MY PI2017001239A MY 192661 A MY192661 A MY 192661A
Authority
MY
Malaysia
Prior art keywords
tape
stress
removable adhesive
semiconductor processing
adhesive tape
Prior art date
Application number
MYPI2017001239A
Inventor
Masami Aoyama
Jirou Sugiyama
Toru Sano
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY192661A publication Critical patent/MY192661A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

[Problem] To provide a semiconductor processing tape (10) that shows excellent pickup properties and shows low thermal shrinkage rate, no occurrence of wrinkles, no occurrence of displacement in chip position, and sufficient kerf width extension in the tape shrinkage process. [Means to Solve the Problem] A semiconductor processing tape, which comprises a removable adhesive tape that is provided with a substrate film and a removable adhesive layer (13) formed on at least one side of the substrate film, wherein, in the process of fragmenting the adhesive by expansion, when the tensile elongation of the removable adhesive tape (15) according to the method of JIS7162 is 10%, the relationship between the stress of the substrate alone and the stress of the removable adhesive tape (15), is: stress on removable adhesive tape (15)/stress on substrate alone = 1 or less.
MYPI2017001239A 2015-03-24 2016-03-23 Semiconductor processing tape MY192661A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015060797 2015-03-24
PCT/JP2016/059203 WO2016152919A1 (en) 2015-03-24 2016-03-23 Semiconductor processing tape

Publications (1)

Publication Number Publication Date
MY192661A true MY192661A (en) 2022-08-30

Family

ID=56978356

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017001239A MY192661A (en) 2015-03-24 2016-03-23 Semiconductor processing tape

Country Status (7)

Country Link
JP (1) JP6097893B2 (en)
KR (1) KR101894690B1 (en)
CN (1) CN107408501B (en)
MY (1) MY192661A (en)
SG (1) SG11201706197VA (en)
TW (1) TWI697539B (en)
WO (1) WO2016152919A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6785162B2 (en) * 2017-01-12 2020-11-18 株式会社ディスコ Split device
JP7539223B2 (en) * 2019-03-08 2024-08-23 日東電工株式会社 Dicing tape and dicing tape with adhesive film
JP7060547B2 (en) * 2019-05-29 2022-04-26 古河電気工業株式会社 Glass processing tape
KR102813705B1 (en) * 2019-06-13 2025-05-28 닛토덴코 가부시키가이샤 Dicing tape and dicing die-bonding film
CN114097073B (en) * 2019-11-28 2025-12-23 积水化学工业株式会社 Method for manufacturing semiconductor devices and laminates for semiconductor processing
JP7381315B2 (en) * 2019-12-03 2023-11-15 日東電工株式会社 Adhesive film with dicing tape
JP7008164B1 (en) * 2020-07-30 2022-01-25 古河電気工業株式会社 Semiconductor processing tape
WO2023281996A1 (en) * 2021-07-08 2023-01-12 マクセル株式会社 Adhesive tape
WO2025192663A1 (en) * 2024-03-15 2025-09-18 株式会社レゾナック Temporary protection film for semiconductor encapsulation molding, method for manufacturing same, lead frame provided with temporary protection film, temporarily protected encapsulation molding object, and method for manufacturing semiconductor package

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1095960A (en) * 1996-09-20 1998-04-14 Nichiban Co Ltd Adhesive tape and first aid bandage
JP2003041206A (en) 2001-07-30 2003-02-13 Hitachi Chem Co Ltd Adhesive sheet, its using method, and semiconductor device
JP4358502B2 (en) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 Semiconductor substrate cutting method
JP2004059852A (en) * 2002-07-31 2004-02-26 Dainippon Ink & Chem Inc Adhesive sheet
JP2004273895A (en) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd Method of dividing semiconductor wafer
JP4754278B2 (en) 2005-06-23 2011-08-24 リンテック株式会社 Chip body manufacturing method
JP5393024B2 (en) * 2007-12-14 2014-01-22 株式会社ニトムズ Stretch release tape
JP2010219293A (en) * 2009-03-17 2010-09-30 Furukawa Electric Co Ltd:The Tape for processing wafer
JP5554118B2 (en) * 2010-03-31 2014-07-23 古河電気工業株式会社 Wafer processing tape
JP2012054432A (en) * 2010-09-01 2012-03-15 Nitto Denko Corp Pressure-sensitive adhesive sheet for semiconductor wafer protection
CN105143380B (en) 2013-03-28 2019-05-17 古河电气工业株式会社 Adhesive tapes and tapes for wafer processing
JP2015021082A (en) * 2013-07-19 2015-02-02 日東電工株式会社 Thermally peelable adhesive tape for cutting electronic parts and method for cutting electronic parts

Also Published As

Publication number Publication date
SG11201706197VA (en) 2017-08-30
KR101894690B1 (en) 2018-09-04
JP6097893B2 (en) 2017-03-15
WO2016152919A1 (en) 2016-09-29
TWI697539B (en) 2020-07-01
CN107408501A (en) 2017-11-28
KR20170117199A (en) 2017-10-20
TW201700671A (en) 2017-01-01
JPWO2016152919A1 (en) 2017-04-27
CN107408501B (en) 2018-08-24

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