MY192914A - Curable resin film and sheet for forming a first protective film - Google Patents

Curable resin film and sheet for forming a first protective film

Info

Publication number
MY192914A
MY192914A MYPI2019004447A MYPI2019004447A MY192914A MY 192914 A MY192914 A MY 192914A MY PI2019004447 A MYPI2019004447 A MY PI2019004447A MY PI2019004447 A MYPI2019004447 A MY PI2019004447A MY 192914 A MY192914 A MY 192914A
Authority
MY
Malaysia
Prior art keywords
curable resin
forming
resin film
sheet
film
Prior art date
Application number
MYPI2019004447A
Inventor
Masanori Yamagishi
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of MY192914A publication Critical patent/MY192914A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

A curable resin film (12) is a film for forming a first protective film (12?) on a surface having a bump (91) of a semiconductor wafer (90) by being attached to the surface, and being cured, in which a visible light transmittance of the curable resin film before curing is 45% or less, and an infrared transmittance of the curable resin film before curing is 33% or more. A sheet for forming a first protective film includes a first supporting sheet (101, 102, 103), and the curable resin film on one surface of the first supporting sheet (101a, 102a, 103a). (Figure 2)
MYPI2019004447A 2017-02-09 2018-01-26 Curable resin film and sheet for forming a first protective film MY192914A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017022165 2017-02-09
PCT/JP2018/002484 WO2018147097A1 (en) 2017-02-09 2018-01-26 Curable resin film and sheet for forming first protective film

Publications (1)

Publication Number Publication Date
MY192914A true MY192914A (en) 2022-09-15

Family

ID=63108082

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019004447A MY192914A (en) 2017-02-09 2018-01-26 Curable resin film and sheet for forming a first protective film

Country Status (8)

Country Link
JP (1) JP6388752B1 (en)
KR (1) KR102430167B1 (en)
CN (1) CN110249414B (en)
MY (1) MY192914A (en)
PH (1) PH12019501814B1 (en)
SG (1) SG11201907214VA (en)
TW (1) TWI663642B (en)
WO (1) WO2018147097A1 (en)

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* Cited by examiner, † Cited by third party
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KR102747152B1 (en) * 2019-02-26 2024-12-26 린텍 가부시키가이샤 Sheet for forming thermosetting resin film and first protective film
WO2020175423A1 (en) * 2019-02-26 2020-09-03 リンテック株式会社 Thermosetting resin film and sheet for forming first protective film
JP6803498B1 (en) * 2019-03-29 2020-12-23 三井化学東セロ株式会社 Manufacturing method of electronic device
JP7326103B2 (en) * 2019-10-07 2023-08-15 リンテック株式会社 Protective film forming film and protective film forming composite sheet
JP7326101B2 (en) * 2019-10-07 2023-08-15 リンテック株式会社 Protective film forming film and protective film forming composite sheet
JP7176072B2 (en) * 2019-12-27 2022-11-21 リンテック株式会社 Manufacturing method of kit and semiconductor chip
KR20240136335A (en) * 2022-01-12 2024-09-13 린텍 가부시키가이샤 Sheet for forming a first protective film, method for manufacturing a semiconductor device, and use of the sheet
JP7260017B1 (en) 2022-01-31 2023-04-18 大日本印刷株式会社 Adhesive tape for semiconductor processing
WO2024247101A1 (en) * 2023-05-30 2024-12-05 株式会社レゾナック Method for producing semiconductor device, and semiconductor device
TWI883943B (en) * 2024-05-02 2025-05-11 南亞塑膠工業股份有限公司 Protection membrane and adhesive composition
WO2026083829A1 (en) * 2024-10-15 2026-04-23 リンテック株式会社 Bonding sheet, method for using bonding sheet, and method for manufacturing semiconductor device

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JP2011253940A (en) * 2010-06-02 2011-12-15 Sony Chemical & Information Device Corp Wafer dicing method, connecting method, and connecting structure
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JP6585068B2 (en) * 2014-10-29 2019-10-02 リンテック株式会社 Protective film forming film and composite sheet for forming protective film
JP6558034B2 (en) * 2015-04-03 2019-08-14 大日本印刷株式会社 Flexible multilayer circuit board for LED element and LED dot matrix display device using the same
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JP6506117B2 (en) * 2015-06-25 2019-04-24 リンテック株式会社 Protective film-forming film, protective film-forming sheet, method of manufacturing work or workpiece, inspection method, workpiece judged to be non-defective, and workpiece judged to be non-defective

Also Published As

Publication number Publication date
JP6388752B1 (en) 2018-09-12
SG11201907214VA (en) 2019-09-27
CN110249414B (en) 2023-04-04
PH12019501814A1 (en) 2020-09-14
PH12019501814B1 (en) 2022-08-03
TWI663642B (en) 2019-06-21
WO2018147097A1 (en) 2018-08-16
KR20190116352A (en) 2019-10-14
JPWO2018147097A1 (en) 2019-02-14
CN110249414A (en) 2019-09-17
KR102430167B1 (en) 2022-08-05
TW201834044A (en) 2018-09-16

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