MY193145A - Adhesive sheet for producing semiconductor device and production method for semiconductor device using the same - Google Patents

Adhesive sheet for producing semiconductor device and production method for semiconductor device using the same

Info

Publication number
MY193145A
MY193145A MYPI2019004109A MYPI2019004109A MY193145A MY 193145 A MY193145 A MY 193145A MY PI2019004109 A MYPI2019004109 A MY PI2019004109A MY PI2019004109 A MYPI2019004109 A MY PI2019004109A MY 193145 A MY193145 A MY 193145A
Authority
MY
Malaysia
Prior art keywords
semiconductor device
adhesive sheet
producing
mentioned above
same
Prior art date
Application number
MYPI2019004109A
Inventor
Yasufumi Kondou
Takamasa Ichikawa
Shouji IWASAKI
Wenfeng Fu
Yuuki Matsunaga
Original Assignee
Tomoegawa Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tomoegawa Co Ltd filed Critical Tomoegawa Co Ltd
Publication of MY193145A publication Critical patent/MY193145A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/02—Copolymers with acrylonitrile
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)

Abstract

The present invention relates to an adhesive sheet for producing a semiconductor device. In the adhesive sheet for producing a semiconductor device which includes a substrate, and a thermo-setting type adhesive layer provided on one surface of the substrate mentioned above, and which is releasably adhered to a wiring substrate or a lead frame of the semiconductor device, the adhesive layer mentioned above contains (a) a carboxyl group-containing acrylonitrile ? butadiene copolymer, (b) an epoxy resin having the following structural formula (1), (c) a compound having two or more maleimide groups, and (d) a reactive siloxane compound. In addition, the present invention provides a method for producing a semiconductor device using the adhesive sheet mentioned above. (FIGURE 2)
MYPI2019004109A 2017-02-02 2018-02-01 Adhesive sheet for producing semiconductor device and production method for semiconductor device using the same MY193145A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017017490A JP6956492B2 (en) 2017-02-02 2017-02-02 Adhesive sheet for manufacturing semiconductor devices and manufacturing method of semiconductor devices using it
PCT/JP2018/003406 WO2018143343A1 (en) 2017-02-02 2018-02-01 Adhesive sheet for producing semiconductor device and production method for semiconductor device using same

Publications (1)

Publication Number Publication Date
MY193145A true MY193145A (en) 2022-09-26

Family

ID=63040829

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019004109A MY193145A (en) 2017-02-02 2018-02-01 Adhesive sheet for producing semiconductor device and production method for semiconductor device using the same

Country Status (7)

Country Link
JP (1) JP6956492B2 (en)
KR (1) KR102424574B1 (en)
CN (1) CN110214168B (en)
MY (1) MY193145A (en)
SG (1) SG11201906503UA (en)
TW (1) TWI770112B (en)
WO (1) WO2018143343A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6909171B2 (en) * 2018-02-12 2021-07-28 株式会社巴川製紙所 Adhesive sheet for manufacturing semiconductor devices and manufacturing method of semiconductor devices using it
JP7187906B2 (en) * 2018-09-10 2022-12-13 昭和電工マテリアルズ株式会社 Semiconductor device manufacturing method
CN110982156B (en) * 2019-12-24 2022-10-04 海隆石油产品技术服务（上海）有限公司 Easily-bonded high-filling polyolefin sheet material and preparation method and application thereof
JP7750932B2 (en) * 2021-02-16 2025-10-07 株式会社巴川コーポレーション Adhesive sheet for semiconductor device manufacturing and method for manufacturing semiconductor device using same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3779601B2 (en) 2001-11-28 2006-05-31 株式会社巴川製紙所 Mask sheet for semiconductor device assembly
JP2004182804A (en) * 2002-12-02 2004-07-02 Mitsui Chemicals Inc Resin composition and film adhesive comprising the same
JP4319892B2 (en) 2003-11-07 2009-08-26 株式会社巴川製紙所 Adhesive sheet for manufacturing semiconductor device and method for manufacturing semiconductor device
JP2008095014A (en) * 2006-10-13 2008-04-24 Tomoegawa Paper Co Ltd Thermosetting resin composition for QFN and adhesive sheet
KR101891422B1 (en) * 2014-02-14 2018-08-23 미쓰이 가가쿠 토세로 가부시키가이샤 Adhesive film for protecting surface of semiconductor wafer, semiconductor device manufacturing method and semiconductor wafer protection method using adhesive film

Also Published As

Publication number Publication date
CN110214168B (en) 2025-12-02
JP2018123254A (en) 2018-08-09
KR20190111911A (en) 2019-10-02
KR102424574B1 (en) 2022-07-25
SG11201906503UA (en) 2019-08-27
WO2018143343A1 (en) 2018-08-09
TWI770112B (en) 2022-07-11
JP6956492B2 (en) 2021-11-02
TW201840770A (en) 2018-11-16
CN110214168A (en) 2019-09-06

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