MY194451A - Method for Producing Lead Wire Terminal, Chip Electrolytic Capacitor, and Half-Finished Product of Lead Wire Terminal - Google Patents

Method for Producing Lead Wire Terminal, Chip Electrolytic Capacitor, and Half-Finished Product of Lead Wire Terminal

Info

Publication number
MY194451A
MY194451A MYPI2019001100A MYPI2019001100A MY194451A MY 194451 A MY194451 A MY 194451A MY PI2019001100 A MYPI2019001100 A MY PI2019001100A MY PI2019001100 A MYPI2019001100 A MY PI2019001100A MY 194451 A MY194451 A MY 194451A
Authority
MY
Malaysia
Prior art keywords
lead wire
wire terminal
terminal
lead
producing
Prior art date
Application number
MYPI2019001100A
Inventor
Manabu Yamazaki
Original Assignee
Kohoku Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2017030843A external-priority patent/JP6656625B2/en
Priority claimed from JP2017143082A external-priority patent/JP6632034B2/en
Priority claimed from JP2017175783A external-priority patent/JP2018061015A/en
Application filed by Kohoku Kogyo Kk filed Critical Kohoku Kogyo Kk
Publication of MY194451A publication Critical patent/MY194451A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/006—Apparatus or processes for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

The present invention suppresses local decrease of the solder wettability in a lead part of a lead wire terminal for chip electrolytic capacitors, while suppressing the generation of a metal powder. A method for producing a lead wire terminal (4) which has a band-like lead part (41) and a terminal part 42 that is provided at one end of the lead part (41), and which is fitted to a capacitor element (3) of a chip electrolytic capacitor (1) via the terminal part. This method for producing a lead wire terminal (4) comprises: a step for preparing a metal wire rod (411) which has a polygonal cross-sectional shape and is provided with a coating layer (412) having good solder wettability on the outer circumference; and a step for forming the lead part (41) by pressing the metal wire rod (411). FIG. 4
MYPI2019001100A 2016-10-04 2017-10-02 Method for Producing Lead Wire Terminal, Chip Electrolytic Capacitor, and Half-Finished Product of Lead Wire Terminal MY194451A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2016196437 2016-10-04
JP2017030843A JP6656625B2 (en) 2017-02-22 2017-02-22 Manufacturing method of chip type electrolytic capacitor
JP2017143082A JP6632034B2 (en) 2017-07-06 2017-07-06 Method of manufacturing lead wire terminal for chip type electrolytic capacitor and chip type electrolytic capacitor
JP2017175783A JP2018061015A (en) 2016-10-04 2017-09-13 Manufacturing method of lead wire terminal, chip type electrolytic capacitor and semifinished product of lead wire terminal
PCT/JP2017/036402 WO2018066681A1 (en) 2016-10-04 2017-10-02 Method for producing lead wire terminal, chip electrolytic capacitor, and half-finished product of lead wire terminal

Publications (1)

Publication Number Publication Date
MY194451A true MY194451A (en) 2022-11-30

Family

ID=61831432

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019001100A MY194451A (en) 2016-10-04 2017-10-02 Method for Producing Lead Wire Terminal, Chip Electrolytic Capacitor, and Half-Finished Product of Lead Wire Terminal

Country Status (4)

Country Link
KR (3) KR102370962B1 (en)
CN (2) CN113066669B (en)
MY (1) MY194451A (en)
WO (1) WO2018066681A1 (en)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0447949Y2 (en) * 1986-01-22 1992-11-12
JPH05335192A (en) * 1992-05-29 1993-12-17 Elna Co Ltd Manufacturing device of chip-type electrolytic capacitor
JPH0677374A (en) * 1992-08-27 1994-03-18 Nec Corp Lead for semiconductor device and manufacture thereof
JP3344462B2 (en) * 1997-06-30 2002-11-11 エルナー株式会社 Electronic components
JP2004192929A (en) * 2002-12-11 2004-07-08 Anzen Dengu Kk Thermal fuse and its mounting method
JP2004228424A (en) * 2003-01-24 2004-08-12 Nec Tokin Corp Chip electrolytic capacitor and method of manufacturing the same
JP4350708B2 (en) * 2003-08-29 2009-10-21 湖北工業株式会社 Tab terminal taping method and apparatus
JP5334757B2 (en) * 2009-08-31 2013-11-06 三洋電機株式会社 Electrolytic capacitor
JP5431130B2 (en) * 2009-11-24 2014-03-05 三洋電機株式会社 Electrolytic capacitor manufacturing method
CN104422288B (en) * 2013-09-04 2016-08-24 株式会社村田制作所 Heat treatment fixture

Also Published As

Publication number Publication date
KR102412355B1 (en) 2022-06-23
KR102370962B1 (en) 2022-03-04
CN113066669B (en) 2022-09-13
CN112992547A (en) 2021-06-18
WO2018066681A1 (en) 2018-04-12
KR20190057050A (en) 2019-05-27
CN112992547B (en) 2022-11-11
CN113066669A (en) 2021-07-02
KR20210032019A (en) 2021-03-23
KR102401140B1 (en) 2022-05-24
KR20210032018A (en) 2021-03-23

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