MY194581A - Method for manufacturing an electronic module for a smart card - Google Patents

Method for manufacturing an electronic module for a smart card

Info

Publication number
MY194581A
MY194581A MYPI2019002436A MYPI2019002436A MY194581A MY 194581 A MY194581 A MY 194581A MY PI2019002436 A MYPI2019002436 A MY PI2019002436A MY PI2019002436 A MYPI2019002436 A MY PI2019002436A MY 194581 A MY194581 A MY 194581A
Authority
MY
Malaysia
Prior art keywords
smart card
manufacturing
face
electronic module
contacts
Prior art date
Application number
MYPI2019002436A
Inventor
Bernard Calvas
Didier Livrati
Katia Leiva
Original Assignee
Smart Packaging Solutions S P S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smart Packaging Solutions S P S filed Critical Smart Packaging Solutions S P S
Publication of MY194581A publication Critical patent/MY194581A/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The invention relates to a method for manufacturing an electronic module for a smart card, said module comprising, on the one hand, a substrate (11) having on a first face (8) a terminal block of electric contacts enabling operation by contact with the corresponding contacts of a smart card reader, and comprising an antenna (3) provided with at least one coil, a microelectronic chip (2), and metal connection wires (4, 5, 6) constituting protruding loops relative to a second face (7) and connecting the pads of the microelectronic chip (2) to corresponding pads of the antenna (3) and/or the terminal block of contacts, characterised in that it comprises a step, after wiring the connection wires (4, 5, 6), of covering the face of the module located on the side of the chip (2), with a cover (13) which flattens the wire loops (4, 5, 6) in order to reduce the height thereof.
MYPI2019002436A 2016-11-04 2017-11-02 Method for manufacturing an electronic module for a smart card MY194581A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1601576A FR3058545B1 (en) 2016-11-04 2016-11-04 METHOD FOR MANUFACTURING AN ELECTRONIC MODULE FOR A CHIP CARD
PCT/FR2017/000206 WO2018083389A1 (en) 2016-11-04 2017-11-02 Method for manufacturing an electronic module for a smart card

Publications (1)

Publication Number Publication Date
MY194581A true MY194581A (en) 2022-12-02

Family

ID=57906667

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019002436A MY194581A (en) 2016-11-04 2017-11-02 Method for manufacturing an electronic module for a smart card

Country Status (7)

Country Link
EP (1) EP3535695B1 (en)
JP (2) JP7166527B2 (en)
CN (1) CN109983478A (en)
FR (1) FR3058545B1 (en)
MY (1) MY194581A (en)
PL (1) PL3535695T3 (en)
WO (1) WO2018083389A1 (en)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2743649B1 (en) * 1996-01-17 1998-04-03 Gemplus Card Int CONTACTLESS ELECTRONIC MODULE, ELECTRONIC LABEL CARD INCORPORATING THE SAME, AND METHODS OF MAKING SAME
JPH09240178A (en) * 1996-03-13 1997-09-16 Citizen Watch Co Ltd Manufacture of communication ic card
FR2775810B1 (en) * 1998-03-09 2000-04-28 Gemplus Card Int NON-CONTACT CARD MANUFACTURING PROCESS
JP2000207521A (en) 1999-01-18 2000-07-28 Toppan Printing Co Ltd Composite IC card and method of manufacturing the same
FR2790849B1 (en) 1999-03-12 2001-04-27 Gemplus Card Int MANUFACTURING METHOD FOR CONTACTLESS CARD TYPE ELECTRONIC DEVICE
DE19940564C2 (en) * 1999-08-26 2002-03-21 Infineon Technologies Ag Chip card module and this comprehensive chip card, as well as methods for producing the chip card module
JP2003243673A (en) 2001-07-31 2003-08-29 Kyocera Corp Optical semiconductor device
JP3726767B2 (en) * 2002-03-28 2005-12-14 株式会社日立製作所 Semiconductor module
FR2844621A1 (en) * 2002-09-13 2004-03-19 A S K Method for manufacturing without contact or hybrid integrated circuit card, comprises application of two thermoplastic layers under temperature and pressure followed by two hot pressed plastic layers
JP2006253430A (en) 2005-03-11 2006-09-21 Renesas Technology Corp Semiconductor device and manufacturing method thereof
DE102005058101B4 (en) * 2005-12-05 2019-04-25 Smartrac Ip B.V. Chip card and method for producing a chip card
DE102006060719A1 (en) * 2006-12-21 2008-06-26 Infineon Technologies Ag Chip card module comprises substrate and two sides, where conducting structures are placed on sides of substrate in adhesion free manner, and chip is arranged on sides of substrate
EP2605188A1 (en) * 2011-12-14 2013-06-19 Gemalto SA Method for manufacturing chip cards
EP2608114A1 (en) * 2011-12-19 2013-06-26 Gemalto SA Method for producing a mould with an integrated circuit chip protected by a pad
NL1039642C2 (en) * 2012-05-18 2013-11-20 Willemsen CHIP CARD DEVICE AND METHOD FOR MANUFACTURING THEM.
FR2996944B1 (en) * 2012-10-15 2018-05-04 Smart Packaging Solutions Sps SIMPLIFIED ELECTRONIC MODULE FOR A CHIP CARD WITH A DOUBLE COMMUNICATION INTERFACE

Also Published As

Publication number Publication date
JP2019536186A (en) 2019-12-12
CN109983478A (en) 2019-07-05
JP7166527B2 (en) 2022-11-08
EP3535695A1 (en) 2019-09-11
JP2022078128A (en) 2022-05-24
EP3535695B1 (en) 2020-05-27
WO2018083389A1 (en) 2018-05-11
JP7273209B2 (en) 2023-05-12
FR3058545B1 (en) 2018-10-26
FR3058545A1 (en) 2018-05-11
PL3535695T3 (en) 2020-11-30

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