MY197343A - A method for inspecting a skeleton wafer - Google Patents

A method for inspecting a skeleton wafer

Info

Publication number
MY197343A
MY197343A MYPI2019002407A MYPI2019002407A MY197343A MY 197343 A MY197343 A MY 197343A MY PI2019002407 A MYPI2019002407 A MY PI2019002407A MY PI2019002407 A MYPI2019002407 A MY PI2019002407A MY 197343 A MY197343 A MY 197343A
Authority
MY
Malaysia
Prior art keywords
wafer image
skeleton
skeleton wafer
inspecting
image
Prior art date
Application number
MYPI2019002407A
Inventor
Tiong Kung Woo Eric
Tan Wan Kiat Thomas
Original Assignee
Mi Equipment M Sdn Bhd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mi Equipment M Sdn Bhd filed Critical Mi Equipment M Sdn Bhd
Priority to MYPI2019002407A priority Critical patent/MY197343A/en
Priority to KR1020200051550A priority patent/KR102383577B1/en
Priority to PH12020050118A priority patent/PH12020050118A1/en
Priority to TW109114254A priority patent/TWI747257B/en
Publication of MY197343A publication Critical patent/MY197343A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G01N2021/8893—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques providing a video image and a processed signal for helping visual decision

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Quality & Reliability (AREA)
  • Theoretical Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Manufacturing & Machinery (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)

Abstract

The present invention relates to a method for inspecting a skeleton wafer (1), comprising the steps of (i) performing template matching of at least one skeleton wafer image and at least one processed wafer image (101); (ii) rescaling said skeleton wafer image to match the processed wafer image's size (103); and (iii) computing differences between said skeleton wafer image and said processed wafer image (107); Gaussian mask convolution is performed on at least one electronic component of said skeleton wafer image to suppress weight on at least one edge of said skeleton wafer image (105), said step is done after step (ii) and prior to step (iii).
MYPI2019002407A 2019-04-29 2019-04-29 A method for inspecting a skeleton wafer MY197343A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
MYPI2019002407A MY197343A (en) 2019-04-29 2019-04-29 A method for inspecting a skeleton wafer
KR1020200051550A KR102383577B1 (en) 2019-04-29 2020-04-28 A method for inspecting a skeleton wafer
PH12020050118A PH12020050118A1 (en) 2019-04-29 2020-04-28 A method for inspecting a skeleton wafer
TW109114254A TWI747257B (en) 2019-04-29 2020-04-29 A method for inspecting a skeleton wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI2019002407A MY197343A (en) 2019-04-29 2019-04-29 A method for inspecting a skeleton wafer

Publications (1)

Publication Number Publication Date
MY197343A true MY197343A (en) 2023-06-14

Family

ID=73429742

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019002407A MY197343A (en) 2019-04-29 2019-04-29 A method for inspecting a skeleton wafer

Country Status (4)

Country Link
KR (1) KR102383577B1 (en)
MY (1) MY197343A (en)
PH (1) PH12020050118A1 (en)
TW (1) TWI747257B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112991332A (en) * 2021-04-21 2021-06-18 视睿（杭州）信息科技有限公司 Polycrystalline defect detection method and device for wafer defects
CN117058124A (en) * 2023-08-30 2023-11-14 桦鼎智能装备(东莞)有限公司 Wafer inspection methods, devices and media
WO2025249686A1 (en) * 2024-05-28 2025-12-04 주식회사 코윈디에스티 Method for automatically inspecting, classifying, and removing defect of flat substrate
WO2025249631A1 (en) * 2024-05-28 2025-12-04 주식회사 코윈디에스티 Method for automatically inspecting, classifying and removing wafer defect

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7155052B2 (en) * 2002-06-10 2006-12-26 Tokyo Seimitsu (Israel) Ltd Method for pattern inspection
JP4229767B2 (en) * 2003-06-30 2009-02-25 株式会社東京精密 Image defect inspection method, image defect inspection apparatus, and appearance inspection apparatus
US7617477B2 (en) * 2005-09-09 2009-11-10 Brion Technologies, Inc. Method for selecting and optimizing exposure tool using an individual mask error model
US8103086B2 (en) * 2007-01-11 2012-01-24 Kla-Tencor Corporation Reticle defect inspection with model-based thin line approaches
JP4629086B2 (en) * 2007-12-05 2011-02-09 株式会社東芝 Image defect inspection method and image defect inspection apparatus
CN101620039B (en) * 2008-07-01 2011-06-22 中芯国际集成电路制造(上海)有限公司 Sample positioning template of precision cutting machine table
EP2339611B1 (en) * 2009-12-23 2015-11-11 ISMECA Semiconductor Holding SA Wafer handler comprising a vision system
US9311698B2 (en) * 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
WO2014209226A1 (en) * 2013-06-07 2014-12-31 Asti Holdings Limited Systems and methods for automatically verifying correct die removal from film frames
US10186028B2 (en) * 2015-12-09 2019-01-22 Kla-Tencor Corporation Defect signal to noise enhancement by reducing die to die process noise
CN108171688B (en) * 2017-12-19 2021-01-08 浙江大学 A wafer surface defect detection method based on Gabor feature and random dimension reduction

Also Published As

Publication number Publication date
KR20200126921A (en) 2020-11-09
TWI747257B (en) 2021-11-21
TW202113303A (en) 2021-04-01
PH12020050118A1 (en) 2021-04-26
KR102383577B1 (en) 2022-04-05

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