MY197461A - Conductor path structure, in particular for a lead frame for a smart card application, with at least two superimposed conductor path planes - Google Patents

Conductor path structure, in particular for a lead frame for a smart card application, with at least two superimposed conductor path planes

Info

Publication number
MY197461A
MY197461A MYPI2018001899A MYPI2018001899A MY197461A MY 197461 A MY197461 A MY 197461A MY PI2018001899 A MYPI2018001899 A MY PI2018001899A MY PI2018001899 A MYPI2018001899 A MY PI2018001899A MY 197461 A MY197461 A MY 197461A
Authority
MY
Malaysia
Prior art keywords
conductor path
conductor
path
planes
paths
Prior art date
Application number
MYPI2018001899A
Inventor
Sebastien Kalck
Frederic Morgenthaler
Original Assignee
Linxens Holding
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE202016002993.3U external-priority patent/DE202016002993U1/en
Priority claimed from DE102016005657.6A external-priority patent/DE102016005657A1/en
Application filed by Linxens Holding filed Critical Linxens Holding
Publication of MY197461A publication Critical patent/MY197461A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09136—Means for correcting warpage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Geometry (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The invention relates to a conductor path structure, in particular for a lead- frame for a smart card application, which comprises at least one first con-ductor path plane (10) with several first conductor paths (11; 11a-11f) and at least one second conductor path plane (20) with several second conductor paths (21; 21a-21f). Superimposed conductor path planes (10, 20) are sepa-rated by an insulator (30), at least one first conductor path (11, 11a, 11b, 11c, 11d, 11f) of the first conductor path plane (10) comprises at least one through-extending connection opening (12; 12a-12e), through which a con-nection wire can be guided and can be placed in electrically conductive con- tact with the conductor path (21; 21a-21f) of the second conductor path planes (20). At least two adjacent conductor paths (11; 11a, 11b; 11b, 11c; 11d, 11e; 11e, 11f) of the first conductor path plane (10) are separated from each other by slots (13; 13a-13i) and at least two adjacent conductor paths (21a, 21b; 21b, 21c, 21d, 21e; 21e, 21f) are separated from each other by further slots (23a-23e). According to the invention, the slots (13; 13a-13i) separating one or more adjacent conductor paths (11; 11, 11a, 11b, 11c, 11d, 11f) of the first conductor path plane (10) and other slots (11 or 23) separating the adjacent conductor paths (21; 21a-21f) of the second conduc-tor path plane (20) are arranged offset to each other. [Fig. 1]
MYPI2018001899A 2016-05-11 2017-05-10 Conductor path structure, in particular for a lead frame for a smart card application, with at least two superimposed conductor path planes MY197461A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE202016002993.3U DE202016002993U1 (en) 2016-05-11 2016-05-11 Conductor structure, in particular for a lead frame for a smart card application, with at least two superimposed interconnect levels
DE102016005657.6A DE102016005657A1 (en) 2016-05-11 2016-05-11 Conductor structure, in particular for a lead frame for a smart card application, with at least two superimposed interconnect levels
PCT/EP2017/025118 WO2017194200A2 (en) 2016-05-11 2017-05-10 Conductor path structure, in particular for a lead frame for a smart card application, with at least two superimposed conductor path planes

Publications (1)

Publication Number Publication Date
MY197461A true MY197461A (en) 2023-06-19

Family

ID=59021451

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018001899A MY197461A (en) 2016-05-11 2017-05-10 Conductor path structure, in particular for a lead frame for a smart card application, with at least two superimposed conductor path planes

Country Status (6)

Country Link
EP (1) EP3456160B1 (en)
KR (1) KR102267167B1 (en)
CN (1) CN109315064B (en)
MY (1) MY197461A (en)
SG (1) SG11201809748RA (en)
WO (1) WO2017194200A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10763203B1 (en) 2019-02-08 2020-09-01 Nxp B.V. Conductive trace design for smart card

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3452678B2 (en) * 1995-03-03 2003-09-29 三菱電機株式会社 Manufacturing method of wiring structure
DE19703057A1 (en) * 1996-12-20 1998-07-02 Siemens Ag Carrier element for semiconductor chip esp. for combination chip card
DE19816066A1 (en) * 1998-04-09 1999-10-14 Philips Patentverwaltung Foil as a carrier for integrated circuits
ATE440346T1 (en) * 2005-11-14 2009-09-15 Tyco Electronics France Sas SMARTCARD BODY, SMARTCARD AND MANUFACTURING METHOD
CN101841734B (en) * 2009-03-16 2012-11-07 华为技术有限公司 Back plate and back plate communication system

Also Published As

Publication number Publication date
KR20190010866A (en) 2019-01-31
KR102267167B1 (en) 2021-06-23
CN109315064A (en) 2019-02-05
EP3456160B1 (en) 2019-07-03
WO2017194200A3 (en) 2018-01-11
CN109315064B (en) 2021-10-19
EP3456160A2 (en) 2019-03-20
WO2017194200A2 (en) 2017-11-16
SG11201809748RA (en) 2018-12-28

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