MY197838A - Semiconductor-processing temporary-adhesive tape - Google Patents

Semiconductor-processing temporary-adhesive tape

Info

Publication number
MY197838A
MY197838A MYPI2019005133A MYPI2019005133A MY197838A MY 197838 A MY197838 A MY 197838A MY PI2019005133 A MYPI2019005133 A MY PI2019005133A MY PI2019005133 A MYPI2019005133 A MY PI2019005133A MY 197838 A MY197838 A MY 197838A
Authority
MY
Malaysia
Prior art keywords
semiconductor
adhesive tape
layer
processing temporary
base
Prior art date
Application number
MYPI2019005133A
Inventor
Goto Yusuke
Uchiyama Tomoaki
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY197838A publication Critical patent/MY197838A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Laminated Bodies (AREA)

Abstract

A semiconductor-processing temporary-adhesive tape (1), comprising: a base (2); and a temporaryadhesive layer (3) provided on one side of the base (2), wherein the base (2) is composed of a multilayer structure, at least one of which is a layer A containing a cyclic olefin polymer with a proportion of 80% by mass or more, and separately from the layer A, said multilayer structure has a layer B containing a linear low-density polyethylene or a high-density polyethylene. (Fig. 1)
MYPI2019005133A 2017-03-10 2018-03-07 Semiconductor-processing temporary-adhesive tape MY197838A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017046435A JP6667468B2 (en) 2017-03-10 2017-03-10 Adhesive tape for semiconductor processing
PCT/JP2018/008737 WO2018164175A1 (en) 2017-03-10 2018-03-07 Adhesive tape for semiconductor processing

Publications (1)

Publication Number Publication Date
MY197838A true MY197838A (en) 2023-07-20

Family

ID=63448766

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019005133A MY197838A (en) 2017-03-10 2018-03-07 Semiconductor-processing temporary-adhesive tape

Country Status (7)

Country Link
JP (1) JP6667468B2 (en)
KR (1) KR102267114B1 (en)
CN (1) CN110073470B (en)
MY (1) MY197838A (en)
SG (1) SG11201907365RA (en)
TW (1) TWI705119B (en)
WO (1) WO2018164175A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020230209A1 (en) 2019-05-10 2020-11-19 昭和電工マテリアルズ株式会社 Method for evaluating pickup performance, integrated dicing/die-bonding film, method for evaluating and selecting integrated dicing/die-bonding film, and method for manufacturing semiconductor device
CN116157486A (en) * 2020-07-22 2023-05-23 三井化学东赛璐株式会社 Adhesive film for back grinding and method for producing electronic device
JP7556965B2 (en) * 2020-07-22 2024-09-26 アールエム東セロ株式会社 Manufacturing method of electronic device
KR102809581B1 (en) * 2020-07-22 2025-05-20 미쓰이 가가쿠 토세로 가부시키가이샤 Method of manufacturing electronic devices

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1140520A (en) 1997-07-23 1999-02-12 Toshiba Corp Method of dividing wafer and method of manufacturing semiconductor device
JP2001240842A (en) 2000-02-28 2001-09-04 Nitto Denko Corp UV-curable pressure-sensitive adhesive composition and pressure-sensitive adhesive sheets
JP3408805B2 (en) 2000-09-13 2003-05-19 浜松ホトニクス株式会社 Cutting origin region forming method and workpiece cutting method
TW568825B (en) * 2001-07-10 2004-01-01 Rung-Wei Jeng Intelligent iterative learning method for controlling filling and pressure-maintaining of injection molding device
WO2013136897A1 (en) * 2012-03-12 2013-09-19 リンテック株式会社 Back-grind-sheet substrate and adhesive sheet, method for producing substrate and sheet, and method for producing workpiece
JP6253327B2 (en) * 2013-09-27 2017-12-27 グンゼ株式会社 Dicing substrate film

Also Published As

Publication number Publication date
WO2018164175A1 (en) 2018-09-13
JP6667468B2 (en) 2020-03-18
CN110073470A (en) 2019-07-30
KR20190085059A (en) 2019-07-17
JP2018152420A (en) 2018-09-27
CN110073470B (en) 2023-10-17
SG11201907365RA (en) 2019-09-27
TWI705119B (en) 2020-09-21
TW201833276A (en) 2018-09-16
KR102267114B1 (en) 2021-06-21

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