MY198686A - Testing chuck - Google Patents

Testing chuck

Info

Publication number
MY198686A
MY198686A MYPI2019003837A MYPI2019003837A MY198686A MY 198686 A MY198686 A MY 198686A MY PI2019003837 A MYPI2019003837 A MY PI2019003837A MY PI2019003837 A MYPI2019003837 A MY PI2019003837A MY 198686 A MY198686 A MY 198686A
Authority
MY
Malaysia
Prior art keywords
temperature
passage
carrying platform
chip carrying
cover
Prior art date
Application number
MYPI2019003837A
Inventor
Chih-Chung Yu
Bo Sian Lee
Original Assignee
Mpi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mpi Corp filed Critical Mpi Corp
Publication of MY198686A publication Critical patent/MY198686A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2862—Chambers or ovens; Tanks

Landscapes

  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Toxicology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)

Abstract

A testing chuck (100) includes a temperature controlling unit (110), a chip carrying platform (120), a cover (130) and a low-temperature clean gas source (140). The temperature controlling unit (110), which has a supporting surface (111), is configured to maintain the supporting surface (111) at a first temperature. The chip carrying platform (120) is at least partially located on the supporting surface (111) and provided with a testing region (TR) for carrying a device under test. The cover (130) has a chamber (C) for accommodating the chip carrying platform (120). At least one passage (P) is provided between the inner wall of the chamber (C) and the chip carrying platform (120). The cover (130) further has a first opening (OP1) communicating with the passage (P) and exposing the testing region (TR). The low-temperature clean gas source (140), which communicates with the passage (P), is configured to provide low-temperature clean gas (CDA) with a second temperature to reach the first opening (OP1) through the passage (P). (Most illustrative figure: FIG. 3)
MYPI2019003837A 2018-07-05 2019-07-02 Testing chuck MY198686A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW107123360A TWI688780B (en) 2018-07-05 2018-07-05 Testing chuck

Publications (1)

Publication Number Publication Date
MY198686A true MY198686A (en) 2023-09-16

Family

ID=68943864

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019003837A MY198686A (en) 2018-07-05 2019-07-02 Testing chuck

Country Status (3)

Country Link
DE (1) DE102019117470A1 (en)
MY (1) MY198686A (en)
TW (1) TWI688780B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114184939B (en) * 2021-12-30 2024-06-11 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） Chip clamping device suitable for ultralow temperature environment
CN114252723B (en) * 2022-02-28 2022-06-10 杭州长川科技股份有限公司 Temperature control test board
CN117091316B (en) * 2023-10-19 2024-01-26 成都电科星拓科技有限公司 High-low temperature working condition simulation module, chip reliability automatic test system and method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7663388B2 (en) * 2007-03-30 2010-02-16 Essai, Inc. Active thermal control unit for maintaining the set point temperature of a DUT
US7876116B1 (en) * 2009-09-29 2011-01-25 Win Way Technology Co., Ltd. Compliant chuck for semiconducting device testing and chiller thereof
TWM414066U (en) * 2011-03-25 2011-10-11 Tairone Energy Saving Technology Co Ltd Heat dissipating device with cooling chip
CN105444894A (en) * 2015-12-01 2016-03-30 中国科学院上海技术物理研究所 Vacuum packaging assembly for non-refrigeration infrared detector
US10249526B2 (en) * 2016-03-04 2019-04-02 Applied Materials, Inc. Substrate support assembly for high temperature processes

Also Published As

Publication number Publication date
TW202006384A (en) 2020-02-01
TWI688780B (en) 2020-03-21
DE102019117470A1 (en) 2020-01-09

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