MY201719A - Electrode for the electroplating or electrodeposition of a metal - Google Patents
Electrode for the electroplating or electrodeposition of a metalInfo
- Publication number
- MY201719A MY201719A MYPI2020007065A MYPI2020007065A MY201719A MY 201719 A MY201719 A MY 201719A MY PI2020007065 A MYPI2020007065 A MY PI2020007065A MY PI2020007065 A MYPI2020007065 A MY PI2020007065A MY 201719 A MY201719 A MY 201719A
- Authority
- MY
- Malaysia
- Prior art keywords
- electrode
- metal
- electrodeposition
- electroplating
- layer
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1225—Deposition of multilayers of inorganic material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Electrochemistry (AREA)
- Thermal Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Electrodes For Compound Or Non-Metal Manufacture (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Paints Or Removers (AREA)
- Electrolytic Production Of Metals (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to an electrode for electroplating or electrodeposition of a metal and to the method for obtaining the same. The electrode comprises a conductive substrate, at least one layer of an electrochemically active coating placed on said substrate, and at least one topcoating layer of valve metal.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT102018000007835A IT201800007835A1 (en) | 2018-08-03 | 2018-08-03 | ELECTRODE FOR GALVANOTECHNICS OR THE ELECTRODEPOSITION OF A METAL |
| PCT/EP2019/069443 WO2020025351A1 (en) | 2018-08-03 | 2019-07-18 | Electrode for the electroplating or electrodeposition of a metal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY201719A true MY201719A (en) | 2024-03-14 |
Family
ID=63762930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2020007065A MY201719A (en) | 2018-08-03 | 2019-07-18 | Electrode for the electroplating or electrodeposition of a metal |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US20210269931A1 (en) |
| EP (1) | EP3830319A1 (en) |
| JP (1) | JP7426984B2 (en) |
| KR (1) | KR102754971B1 (en) |
| CN (1) | CN112513340B (en) |
| AU (1) | AU2019316092B2 (en) |
| CA (1) | CA3105586A1 (en) |
| IT (1) | IT201800007835A1 (en) |
| MY (1) | MY201719A (en) |
| PH (1) | PH12021550107A1 (en) |
| SG (1) | SG11202012983PA (en) |
| TW (1) | TWI802731B (en) |
| WO (1) | WO2020025351A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12002631B2 (en) * | 2021-10-20 | 2024-06-04 | KYOCERA AVX Components Corporation | Electrodeposited dielectric for a solid electrolytic capacitor |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5004626A (en) * | 1986-10-27 | 1991-04-02 | Huron Technologies, Inc. | Anodes and method of making |
| US5419824A (en) * | 1992-11-12 | 1995-05-30 | Weres; Oleh | Electrode, electrode manufacturing process and electrochemical cell |
| JPH06306670A (en) * | 1993-04-27 | 1994-11-01 | Daiso Co Ltd | Production of electrode for generating oxygen |
| US6527939B1 (en) | 1999-06-28 | 2003-03-04 | Eltech Systems Corporation | Method of producing copper foil with an anode having multiple coating layers |
| US7247229B2 (en) * | 1999-06-28 | 2007-07-24 | Eltech Systems Corporation | Coatings for the inhibition of undesirable oxidation in an electrochemical cell |
| US6589405B2 (en) * | 2000-05-15 | 2003-07-08 | Oleh Weres | Multilayer oxide coated valve metal electrode for water purification |
| US7156962B2 (en) * | 2001-06-21 | 2007-01-02 | Sanyo Electric Co., Ltd. | Electrolyzing electrode and production method therefor and electrolysis method using electrolyzing electrode and electrolysis solution producing device |
| JP4873695B2 (en) * | 2006-04-14 | 2012-02-08 | ダイソー株式会社 | Hollow electrode with electrodeposition film |
| WO2010073916A1 (en) * | 2008-12-26 | 2010-07-01 | 日本パーカライジング株式会社 | Method of electrolytic ceramic coating for metal, electrolysis solution for electrolytic ceramic coating for metal, and metallic material |
| DE102013202143A1 (en) * | 2013-02-08 | 2014-08-14 | Bayer Materialscience Ag | Catalyst coating and process for its preparation |
| TWI595119B (en) * | 2016-08-17 | 2017-08-11 | Boardtek Electronics Corp | Photocatalyst and its anode |
| CN107369829A (en) * | 2017-06-30 | 2017-11-21 | 陕西科技大学 | A kind of preparation method of lithium ion battery Mao Danzhuan niobium oxide electrode materials |
-
2018
- 2018-08-03 IT IT102018000007835A patent/IT201800007835A1/en unknown
-
2019
- 2019-07-18 AU AU2019316092A patent/AU2019316092B2/en active Active
- 2019-07-18 CN CN201980051126.2A patent/CN112513340B/en active Active
- 2019-07-18 KR KR1020217006585A patent/KR102754971B1/en active Active
- 2019-07-18 MY MYPI2020007065A patent/MY201719A/en unknown
- 2019-07-18 CA CA3105586A patent/CA3105586A1/en active Pending
- 2019-07-18 EP EP19739663.3A patent/EP3830319A1/en active Pending
- 2019-07-18 JP JP2021504802A patent/JP7426984B2/en active Active
- 2019-07-18 WO PCT/EP2019/069443 patent/WO2020025351A1/en not_active Ceased
- 2019-07-18 US US17/258,601 patent/US20210269931A1/en active Pending
- 2019-07-18 SG SG11202012983PA patent/SG11202012983PA/en unknown
- 2019-08-02 TW TW108127436A patent/TWI802731B/en active
-
2021
- 2021-01-14 PH PH12021550107A patent/PH12021550107A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP3830319A1 (en) | 2021-06-09 |
| BR112021001637A2 (en) | 2021-05-04 |
| SG11202012983PA (en) | 2021-02-25 |
| US20210269931A1 (en) | 2021-09-02 |
| JP7426984B2 (en) | 2024-02-02 |
| CA3105586A1 (en) | 2020-02-06 |
| CN112513340B (en) | 2024-08-27 |
| JP2021533257A (en) | 2021-12-02 |
| CN112513340A (en) | 2021-03-16 |
| AU2019316092B2 (en) | 2025-01-30 |
| TWI802731B (en) | 2023-05-21 |
| KR20210035897A (en) | 2021-04-01 |
| WO2020025351A1 (en) | 2020-02-06 |
| TW202010876A (en) | 2020-03-16 |
| PH12021550107A1 (en) | 2021-09-27 |
| KR102754971B1 (en) | 2025-01-21 |
| IT201800007835A1 (en) | 2020-02-03 |
| AU2019316092A1 (en) | 2021-01-28 |
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