MY201971A - Epoxy resin composition and cured product of same - Google Patents

Epoxy resin composition and cured product of same

Info

Publication number
MY201971A
MY201971A MYPI2020004496A MYPI2020004496A MY201971A MY 201971 A MY201971 A MY 201971A MY PI2020004496 A MYPI2020004496 A MY PI2020004496A MY PI2020004496 A MYPI2020004496 A MY PI2020004496A MY 201971 A MY201971 A MY 201971A
Authority
MY
Malaysia
Prior art keywords
epoxy resin
cured product
resin composition
weight
same
Prior art date
Application number
MYPI2020004496A
Inventor
Masaki Omura
Ken Hirota
Original Assignee
Nippon Steel Chemical & Mat Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical & Mat Co Ltd filed Critical Nippon Steel Chemical & Mat Co Ltd
Publication of MY201971A publication Critical patent/MY201971A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Provided is an epoxy resin composition that is particularly suitable for power semiconductor sealing and makes it possible to obtain an epoxy resin cured product that is particularly excellent in tracking resistance and also excellent in balance thereof with heat resistance and in thermal decomposition stability; and also provided are an epoxy resin cured product and a semiconductor. The epoxy resin composition includes, as essential components: (A) an epoxy resin represented by a general formula (1) below; (B) a non-aromatic epoxy resin or a non-silicone rubber having a 5% weight loss temperature of 260C or higher; (C) a curing agent; and (D) a curing accelerator, wherein the component (B) is contained in an amount of 1% by weight to 50% by weight with respect to a total amount of the components (A) to (D): [C1] where, n represents a number of 0 to 20 and G represents a glycidyl group.
MYPI2020004496A 2018-03-09 2019-02-25 Epoxy resin composition and cured product of same MY201971A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018042759 2018-03-09
PCT/JP2019/006964 WO2019171993A1 (en) 2018-03-09 2019-02-25 Epoxy resin composition and cured product of same

Publications (1)

Publication Number Publication Date
MY201971A true MY201971A (en) 2024-03-27

Family

ID=67845643

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2020004496A MY201971A (en) 2018-03-09 2019-02-25 Epoxy resin composition and cured product of same

Country Status (7)

Country Link
JP (1) JP7252196B2 (en)
KR (1) KR102717538B1 (en)
CN (1) CN111819242B (en)
MY (1) MY201971A (en)
SG (1) SG11202008706UA (en)
TW (1) TWI806976B (en)
WO (1) WO2019171993A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115298780B (en) * 2020-03-27 2025-08-01 日本贵弥功株式会社 Electrolytic capacitor
KR20240026887A (en) * 2021-06-30 2024-02-29 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 Epoxy resin, epoxy resin composition, and cured product thereof
WO2023008231A1 (en) * 2021-07-30 2023-02-02 日本化薬株式会社 Epoxy resin, curable resin composition, and cured products thereof
KR102702453B1 (en) * 2021-11-16 2024-09-04 국도화학 주식회사 Higher Arc resistance bio-based Epoxy resin material composition for heavy electric and method of manufacturing the same

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03151674A (en) 1989-11-08 1991-06-27 Sharp Corp Semiconductor device
JP4029456B2 (en) 1998-01-29 2008-01-09 日立化成工業株式会社 Flame-retardant non-halogen epoxy resin composition, prepreg using the same, and laminate for electric wiring board
JP2003020325A (en) 2001-07-06 2003-01-24 Asahi Kasei Corp Encapsulation material for semiconductor chips
JP2005194384A (en) * 2004-01-07 2005-07-21 Shin Etsu Chem Co Ltd Epoxy resin composition and semiconductor device
JP2005213299A (en) 2004-01-27 2005-08-11 Matsushita Electric Works Ltd Semiconductor sealing resin composition and semiconductor device using the same
JP2008143950A (en) 2006-12-06 2008-06-26 Nitto Denko Corp Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
JP2008239891A (en) * 2007-03-28 2008-10-09 Toto Kasei Co Ltd Novel epoxy resin, epoxy resin composition containing the same, and cured matter therefrom
JP2009275146A (en) 2008-05-15 2009-11-26 Nitto Denko Corp Epoxy resin composition for sealing semiconductor and semiconductor device using the same
WO2011074517A1 (en) 2009-12-14 2011-06-23 新日鐵化学株式会社 Epoxy resin, process for production thereof, epoxy resin composition using same, and cured product
CN103168060A (en) * 2011-01-07 2013-06-19 株式会社大赛璐 Curable epoxy resin composition
JP5507477B2 (en) * 2011-01-20 2014-05-28 パナソニック株式会社 Epoxy resin composition for semiconductor encapsulation and semiconductor device
JP2013203865A (en) 2012-03-28 2013-10-07 Kyocera Chemical Corp Resin composition for sealing semiconductor and semiconductor device
JP2013209503A (en) * 2012-03-30 2013-10-10 Nippon Steel & Sumikin Chemical Co Ltd Epoxy resin composition and cured product thereof
JP6161505B2 (en) * 2013-10-16 2017-07-12 株式会社クラレ Adhesive composition, and adhesive and adhesive processed product using the same
JP6406847B2 (en) * 2014-03-26 2018-10-17 新日鉄住金化学株式会社 Modified polyvalent hydroxy resin, epoxy resin, epoxy resin composition and cured product thereof
JP2017095524A (en) * 2014-03-28 2017-06-01 新日鉄住金化学株式会社 Epoxy resin, epoxy resin composition and cured article
JP6426966B2 (en) * 2014-10-06 2018-11-21 日鉄ケミカル＆マテリアル株式会社 Semiconductor sealing resin composition and semiconductor device
JP6808318B2 (en) * 2015-12-28 2021-01-06 日鉄ケミカル＆マテリアル株式会社 Manufacturing method of multivalent hydroxy resin and epoxy resin
TWI728084B (en) * 2016-03-30 2021-05-21 日商日鐵化學材料股份有限公司 Polyvalent hydroxy resin, its manufacturing method, epoxy resin, epoxy resin composition and its hardened product

Also Published As

Publication number Publication date
KR102717538B1 (en) 2024-10-16
TWI806976B (en) 2023-07-01
CN111819242A (en) 2020-10-23
TW201938681A (en) 2019-10-01
JPWO2019171993A1 (en) 2021-02-18
KR20200130372A (en) 2020-11-18
WO2019171993A1 (en) 2019-09-12
JP7252196B2 (en) 2023-04-04
SG11202008706UA (en) 2020-10-29
CN111819242B (en) 2023-09-26

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