MY202192A - Epoxy resin composition for sealing ball grid array package, epoxy resin cured product and electronic component device - Google Patents

Epoxy resin composition for sealing ball grid array package, epoxy resin cured product and electronic component device

Info

Publication number
MY202192A
MY202192A MYPI2020003281A MYPI2020003281A MY202192A MY 202192 A MY202192 A MY 202192A MY PI2020003281 A MYPI2020003281 A MY PI2020003281A MY PI2020003281 A MYPI2020003281 A MY PI2020003281A MY 202192 A MY202192 A MY 202192A
Authority
MY
Malaysia
Prior art keywords
epoxy resin
grid array
ball grid
array package
resin composition
Prior art date
Application number
MYPI2020003281A
Inventor
Dongchul Kang
Kenta Ishibashi
Keichi Hori
Masashi Yamaura
Mika Tanaka
Takuya Kodama
Original Assignee
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Corp filed Critical Resonac Corp
Publication of MY202192A publication Critical patent/MY202192A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)

Abstract

An epoxy resin composition for sealing a ball grid array package includes: an epoxy resin comprising a bisphenol F-type epoxy resin; a curing agent; an inorganic filler including alumina particles and free of silica particles, or including alumina particles and further including silica particles at a content of from higher than 0% by mass to 15% by mass with respect to a total amount of the alumina particles and the silica particles; and a plasticizer; wherein a content of the inorganic filler is from 75% by volume to 84% by volume.
MYPI2020003281A 2017-12-28 2018-12-10 Epoxy resin composition for sealing ball grid array package, epoxy resin cured product and electronic component device MY202192A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017254882 2017-12-28
PCT/JP2018/045350 WO2019131097A1 (en) 2017-12-28 2018-12-10 Encapsulating epoxy resin composition for ball grid array package, cured epoxy resin object, and electronic component/device

Publications (1)

Publication Number Publication Date
MY202192A true MY202192A (en) 2024-04-16

Family

ID=67067153

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2020003281A MY202192A (en) 2017-12-28 2018-12-10 Epoxy resin composition for sealing ball grid array package, epoxy resin cured product and electronic component device

Country Status (6)

Country Link
JP (1) JP7276151B2 (en)
KR (1) KR20200094792A (en)
CN (1) CN111527144A (en)
MY (1) MY202192A (en)
TW (1) TWI820067B (en)
WO (1) WO2019131097A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7486941B2 (en) * 2019-12-10 2024-05-20 日東シンコー株式会社 Resin composition and thermally conductive sheet
CN113308229A (en) * 2021-05-21 2021-08-27 江苏联瑞新材料股份有限公司 Preparation method of high-thermal-conductivity spherical powder for ball grid array packaging
CN117736550A (en) * 2022-09-15 2024-03-22 华为技术有限公司 Resin composition, preparation method and application thereof
WO2025253852A1 (en) * 2024-06-07 2025-12-11 味の素株式会社 Resin composition

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4188634B2 (en) 2001-07-30 2008-11-26 スミトモ ベークライト シンガポール プライベート リミテッド Epoxy resin composition
JP2006028264A (en) * 2004-07-13 2006-02-02 Hitachi Chem Co Ltd Epoxy resin molding material for sealing and electronic component device
JP6282390B2 (en) * 2010-12-16 2018-02-21 日立化成株式会社 Epoxy resin molding material for sealing and semiconductor device using the same
JP2012224799A (en) * 2011-04-22 2012-11-15 Sumitomo Bakelite Co Ltd Liquid sealing resin composition and semiconductor device using the same
KR20180104168A (en) * 2011-05-13 2018-09-19 히타치가세이가부시끼가이샤 Epoxy resin molding material for encapsulation and electronic component device
JP2013006893A (en) * 2011-06-22 2013-01-10 Hitachi Chemical Co Ltd High thermal conductivity resin composition, high thermal conductivity cured product, adhesive film, sealing film, and semiconductor device using them
JP2014129485A (en) * 2012-12-28 2014-07-10 Hitachi Chemical Co Ltd Epoxy resin composition and electronic component device
JP6646360B2 (en) * 2015-04-24 2020-02-14 日東電工株式会社 Sealing resin sheet and electronic device
JP6712895B2 (en) 2016-04-15 2020-06-24 京セラ株式会社 Powder-granular resin composition for semiconductor encapsulation and semiconductor device
JP2017203132A (en) 2016-05-13 2017-11-16 日立化成株式会社 Epoxy resin composition, epoxy resin cured product and electronic component device

Also Published As

Publication number Publication date
WO2019131097A1 (en) 2019-07-04
JPWO2019131097A1 (en) 2020-12-17
JP7276151B2 (en) 2023-05-18
KR20200094792A (en) 2020-08-07
TW201930454A (en) 2019-08-01
CN111527144A (en) 2020-08-11
TWI820067B (en) 2023-11-01

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