MY205363A - Cutting apparatus - Google Patents

Cutting apparatus

Info

Publication number
MY205363A
MY205363A MYPI2020005203A MYPI2020005203A MY205363A MY 205363 A MY205363 A MY 205363A MY PI2020005203 A MYPI2020005203 A MY PI2020005203A MY PI2020005203 A MYPI2020005203 A MY PI2020005203A MY 205363 A MY205363 A MY 205363A
Authority
MY
Malaysia
Prior art keywords
cutting
water
mist
blade
duct
Prior art date
Application number
MYPI2020005203A
Inventor
Terashi Kentaro
Seo Junyong
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of MY205363A publication Critical patent/MY205363A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Sawing (AREA)

Abstract

A cutting apparatus (1) includes a cutting unit (20) including a spindle (23) fitted with a cutting blade (21), a blade cover (24) configured to cover the cutting blade (21), and a nozzle (25) configured to supply cutting water. The blade cover (24) includes a duct (26) configured to receive mist of the cutting water scattered by rotation of the cutting blade (21) at an inlet (261) and guide the mist of the cutting water to an outlet (262) side separated from the inlet (261), and a gas- liquid separating portion (27) disposed within the duct (26). The gas-liquid separating portion (27) includes a collision surface (271, 272, 274) with which the mist collides and a water storing portion (273) configured to store liquid dropping from the collision surface. The water storing portion (273) extends to the outlet (262) of the duct (26), and gas of the mist is exhausted from the outlet (262) after passing over a water surface of the water storing portion (273). (The most suitable drawing: Fig. 3)
MYPI2020005203A 2019-10-24 2020-10-05 Cutting apparatus MY205363A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019193785A JP7416600B2 (en) 2019-10-24 2019-10-24 cutting equipment

Publications (1)

Publication Number Publication Date
MY205363A true MY205363A (en) 2024-10-17

Family

ID=75637836

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2020005203A MY205363A (en) 2019-10-24 2020-10-05 Cutting apparatus

Country Status (5)

Country Link
JP (1) JP7416600B2 (en)
KR (1) KR102808809B1 (en)
MY (1) MY205363A (en)
SG (1) SG10202010111XA (en)
TW (1) TWI858164B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114654366A (en) * 2020-12-07 2022-06-24 株式会社迪思科 Cutting device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2694931B2 (en) * 1991-02-22 1997-12-24 株式会社東京精密 Dicing equipment
JP4337776B2 (en) 2004-06-09 2009-09-30 コニカミノルタビジネステクノロジーズ株式会社 Toner and toner production method
JP4634820B2 (en) 2005-02-24 2011-02-16 株式会社ディスコ Cutting equipment
JP5486225B2 (en) 2009-07-01 2014-05-07 株式会社ディスコ Cutting equipment
JP5511325B2 (en) * 2009-11-18 2014-06-04 株式会社ディスコ Cutting equipment
JP6388813B2 (en) 2014-10-17 2018-09-12 株式会社ディスコ Cutting equipment
JP2017213628A (en) * 2016-05-31 2017-12-07 株式会社ディスコ Cutting equipment

Also Published As

Publication number Publication date
KR20210048982A (en) 2021-05-04
TWI858164B (en) 2024-10-11
TW202117826A (en) 2021-05-01
JP7416600B2 (en) 2024-01-17
JP2021065983A (en) 2021-04-30
SG10202010111XA (en) 2021-05-28
KR102808809B1 (en) 2025-05-15

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