MY205427A - Rectangular workpiece processing method - Google Patents

Rectangular workpiece processing method

Info

Publication number
MY205427A
MY205427A MYPI2019002916A MYPI2019002916A MY205427A MY 205427 A MY205427 A MY 205427A MY PI2019002916 A MYPI2019002916 A MY PI2019002916A MY PI2019002916 A MYPI2019002916 A MY PI2019002916A MY 205427 A MY205427 A MY 205427A
Authority
MY
Malaysia
Prior art keywords
planned dividing
dividing lines
package substrate
processed grooves
holes
Prior art date
Application number
MYPI2019002916A
Inventor
Yamada Chisato
Omuro Yoshihiro
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of MY205427A publication Critical patent/MY205427A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A method of processing a package substrate (1) having a plurality of planned dividing lines (24) formed on a top surface (2B) thereof and having respective top surface side processed grooves (27) formed along the planned dividing lines (24). The method includes a through hole forming step of forming respective processed grooves (9) adjacent to a pair of opposite sides of the package substrate (1) and forming through holes (8) at respective points of intersection of the top surface side processed grooves (27) and the processed grooves (9); a planned dividing line position detecting step of imaging the through holes (8) by an imaging unit, and detecting the positions of the planned dividing lines (24) on the basis of the positions of the through holes (8); and a processing step of processing the package substrate (1) along the planned dividing lines (24) from the undersurface (2A) of the package substrate (1) on the basis of the positions of the planned dividing lines (24). (The most suitable drawing: FIG. 12)
MYPI2019002916A 2018-06-05 2019-05-23 Rectangular workpiece processing method MY205427A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018108062A JP7144200B2 (en) 2018-06-05 2018-06-05 Machining method for rectangular workpiece

Publications (1)

Publication Number Publication Date
MY205427A true MY205427A (en) 2024-10-21

Family

ID=68772852

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019002916A MY205427A (en) 2018-06-05 2019-05-23 Rectangular workpiece processing method

Country Status (3)

Country Link
JP (1) JP7144200B2 (en)
CN (1) CN110571146B (en)
MY (1) MY205427A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7798568B2 (en) * 2021-12-29 2026-01-14 株式会社ディスコ Package substrate processing method
CN120854356B (en) * 2024-04-16 2026-04-07 沈阳和研科技股份有限公司 Mini-LED or Micro-LED packaging cutting path alignment method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06232255A (en) * 1993-01-29 1994-08-19 Disco Abrasive Syst Ltd Wafer dicing method
JP4214790B2 (en) * 2003-02-10 2009-01-28 株式会社村田製作所 Dicing method
JP2013058653A (en) * 2011-09-09 2013-03-28 Disco Abrasive Syst Ltd Method for dividing plate-like object
JP6257291B2 (en) * 2013-12-04 2018-01-10 株式会社ディスコ Processing method of package substrate
JP6328513B2 (en) * 2014-07-28 2018-05-23 株式会社ディスコ Wafer processing method

Also Published As

Publication number Publication date
CN110571146A (en) 2019-12-13
JP2019212773A (en) 2019-12-12
CN110571146B (en) 2024-03-15
JP7144200B2 (en) 2022-09-29

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