MY205710A - Cutting apparatus - Google Patents

Cutting apparatus

Info

Publication number
MY205710A
MY205710A MYPI2020002744A MYPI2020002744A MY205710A MY 205710 A MY205710 A MY 205710A MY PI2020002744 A MYPI2020002744 A MY PI2020002744A MY PI2020002744 A MYPI2020002744 A MY PI2020002744A MY 205710 A MY205710 A MY 205710A
Authority
MY
Malaysia
Prior art keywords
chuck table
unit
wafer
back side
holding surface
Prior art date
Application number
MYPI2020002744A
Inventor
Yamamoto Naoko
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of MY205710A publication Critical patent/MY205710A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A cutting apparatus (1) includes a chuck table (8), an inspecting unit for inspecting a holding surface (8a) of the chuck table (8) or the back side (109) of the wafer (100) held by a transfer unit, and a control unit (60). The inspecting unit includes an imaging unit (40) for imaging the holding surface (8a) of the chuck table (8) or the back side (109) of the wafer (100) held by the transfer unit. The control unit (60) includes a determining portion (66) for comparing a reference image of the holding surface (8a) of the chuck table (8) or the back side (109) of the wafer (100) as previously recorded and an actual image obtained by the imaging unit (40) and then determining whether or not any abnormality has occurred on the holding surface (8a) of the chuck table (8) or on the back side (109) of the wafer (100), according to a difference between the reference image and the actual image, in which, when the difference is greater than a threshold value, the determining portion (66) determines the occurrence of the abnormality. (The most suitable drawing: Fig. 2)
MYPI2020002744A 2019-06-26 2020-05-31 Cutting apparatus MY205710A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019118775A JP7408306B2 (en) 2019-06-26 2019-06-26 cutting equipment

Publications (1)

Publication Number Publication Date
MY205710A true MY205710A (en) 2024-11-07

Family

ID=73747725

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2020002744A MY205710A (en) 2019-06-26 2020-05-31 Cutting apparatus

Country Status (4)

Country Link
JP (1) JP7408306B2 (en)
DE (1) DE102020207902A1 (en)
MY (1) MY205710A (en)
TW (1) TW202101572A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11435391B2 (en) * 2020-01-22 2022-09-06 Nanya Technology Corporation Dual-sided wafer imaging apparatus and methods thereof
JP7648304B2 (en) 2021-05-11 2025-03-18 東京エレクトロン株式会社 Substrate inspection method and substrate inspection device
JP2024043556A (en) * 2022-09-19 2024-04-01 株式会社ディスコ Cutting method
CN118372382B (en) * 2024-06-26 2024-09-17 江苏华芯智造半导体有限公司 Intelligent semiconductor wafer cutting system based on machine vision
CN119369256B (en) * 2024-12-27 2025-06-27 东莞市屹泰水晶工艺有限公司 Accurate control process for polishing size of vehicle-mounted crystal product and online measurement system

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3464388B2 (en) 1998-07-01 2003-11-10 株式会社東芝 Semiconductor wafer splitting method
JP2000216227A (en) 1999-01-25 2000-08-04 Disco Abrasive Syst Ltd Chuck table inspection method
JP2008064595A (en) 2006-09-07 2008-03-21 Olympus Corp Substrate inspecting device
JP5473655B2 (en) 2010-02-10 2014-04-16 株式会社ディスコ Backside imaging table unit
JP6316702B2 (en) 2014-08-08 2018-04-25 株式会社ディスコ Processing apparatus and wafer processing method
JP2016055365A (en) 2014-09-08 2016-04-21 株式会社ディスコ Processing apparatus and display system
JP2016095244A (en) 2014-11-14 2016-05-26 株式会社ディスコ Judgment method of dirt on the chuck table
JP6879747B2 (en) 2017-01-16 2021-06-02 株式会社ディスコ Chuck table clogging detection method and processing equipment

Also Published As

Publication number Publication date
TW202101572A (en) 2021-01-01
JP7408306B2 (en) 2024-01-05
DE102020207902A1 (en) 2020-12-31
JP2021005633A (en) 2021-01-14

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