MY206285A - Inspection table - Google Patents

Inspection table

Info

Publication number
MY206285A
MY206285A MYPI2020000383A MYPI2020000383A MY206285A MY 206285 A MY206285 A MY 206285A MY PI2020000383 A MYPI2020000383 A MY PI2020000383A MY PI2020000383 A MYPI2020000383 A MY PI2020000383A MY 206285 A MY206285 A MY 206285A
Authority
MY
Malaysia
Prior art keywords
sensor
processing apparatus
inspection
base
electric power
Prior art date
Application number
MYPI2020000383A
Inventor
Chye YEW Leng
Wei LEE Zhi
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of MY206285A publication Critical patent/MY206285A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
    • B25H1/00—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby
    • B25H1/10—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby with provision for adjusting holders for tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/20—Cutting beds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/024—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/0002—Arrangements for supporting, fixing or guiding the measuring instrument or the object to be measured
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Dicing (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Testing Or Calibration Of Command Recording Devices (AREA)

Abstract

An inspection table (200) to be used for the inspection of a processing apparatus (2). The inspection table (200) includes a base portion (201) adapted to be detachably supported to a holding surface (33) of a chuck table (30) or to a table base (20) included in the processing apparatus (2), a sensor fixed to the base portion (201) and adapted to be driven by electric power, an information transmitting portion for transmitting information detected by the sensor, and a battery (212) for supplying electric power to the sensor and the information transmitting portion (208). The sensor is a pressure sensor (202), an inclination sensor (203), a temperature sensor (204), a light quantity sensor (205), or an image sensor (206). The sensor is used to measure or record a pressure, inclination, temperature, light quantity, or outward appearance image related to the chuck table (30), processing unit (60), table base (20), or moving unit included in the processing apparatus (2). (The most suitable drawing: FIG. 6)
MYPI2020000383A 2019-02-05 2020-01-23 Inspection table MY206285A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019018421A JP7349247B2 (en) 2019-02-05 2019-02-05 inspection table

Publications (1)

Publication Number Publication Date
MY206285A true MY206285A (en) 2024-12-06

Family

ID=71901042

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2020000383A MY206285A (en) 2019-02-05 2020-01-23 Inspection table

Country Status (6)

Country Link
JP (1) JP7349247B2 (en)
KR (1) KR102790705B1 (en)
CN (1) CN111524828B (en)
MY (1) MY206285A (en)
SG (1) SG10202000758WA (en)
TW (1) TWI829859B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7612369B2 (en) * 2020-10-12 2025-01-14 株式会社ディスコ Grinding Equipment
JP7550633B2 (en) * 2020-12-21 2024-09-13 株式会社ディスコ DICING APPARATUS AND METHOD FOR INSPECTING DICING APPARATUS
JP2022105448A (en) * 2021-01-04 2022-07-14 株式会社ディスコ Inspection device and processing device
CN114179046B (en) * 2021-11-30 2022-10-14 深圳市华腾半导体设备有限公司 Electric conduction workbench capable of realizing free rotation

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0627252A (en) * 1992-07-07 1994-02-04 Tokyo Electron Yamanashi Kk Device for aligning object to be treated
US20050224899A1 (en) * 2002-02-06 2005-10-13 Ramsey Craig C Wireless substrate-like sensor
KR100701080B1 (en) * 2005-10-07 2007-03-29 세메스 주식회사 Teaching inspection apparatus and method, substrate transfer system provided with teaching inspection apparatus, and teaching method thereof
JP4726070B2 (en) * 2006-05-23 2011-07-20 東京エレクトロン株式会社 Substrate processing apparatus, apparatus inspection method, apparatus inspection program, and recording medium recording the program
JP5068611B2 (en) 2007-09-13 2012-11-07 株式会社ディスコ Method and apparatus for confirming processing water in processing apparatus
JP2010016069A (en) * 2008-07-02 2010-01-21 Hitachi High-Tech Control Systems Corp Wafer alignment unit, and method of correcting output value of line sensor of wafer alignment unit
JP2011221006A (en) * 2010-03-23 2011-11-04 Tokyo Electron Ltd Wafer type temperature detection sensor and method of manufacturing the same
JP2014116432A (en) * 2012-12-07 2014-06-26 Disco Abrasive Syst Ltd Processing device
JP6340277B2 (en) * 2014-07-18 2018-06-06 株式会社ディスコ Processing equipment
JP6610026B2 (en) * 2015-06-23 2019-11-27 三星ダイヤモンド工業株式会社 Scribing equipment
JP6726473B2 (en) * 2016-02-15 2020-07-22 株式会社ディスコ Chuck table mechanism
JP6678468B2 (en) 2016-02-17 2020-04-08 株式会社ディスコ Nozzle adjustment jig
JP6625007B2 (en) 2016-04-27 2019-12-25 株式会社ディスコ Measurement jig
JP6689672B2 (en) 2016-05-25 2020-04-28 信越ポリマー株式会社 Substrate storage container, management system thereof, and substrate storage container management method
JP6820189B2 (en) * 2016-12-01 2021-01-27 東京エレクトロン株式会社 Joining equipment, joining systems, joining methods, programs and computer storage media
JP2018121031A (en) * 2017-01-27 2018-08-02 株式会社ディスコ Laser processing equipment

Also Published As

Publication number Publication date
JP2020124773A (en) 2020-08-20
TWI829859B (en) 2024-01-21
KR20200096737A (en) 2020-08-13
SG10202000758WA (en) 2020-09-29
CN111524828B (en) 2025-09-26
KR102790705B1 (en) 2025-04-02
TW202030783A (en) 2020-08-16
JP7349247B2 (en) 2023-09-22
CN111524828A (en) 2020-08-11

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