MY206409A - System and method for improved electronic component interconnections - Google Patents

System and method for improved electronic component interconnections

Info

Publication number
MY206409A
MY206409A MYPI2020002327A MYPI2020002327A MY206409A MY 206409 A MY206409 A MY 206409A MY PI2020002327 A MYPI2020002327 A MY PI2020002327A MY PI2020002327 A MYPI2020002327 A MY PI2020002327A MY 206409 A MY206409 A MY 206409A
Authority
MY
Malaysia
Prior art keywords
electronic component
improved electronic
methods
component interconnections
systems
Prior art date
Application number
MYPI2020002327A
Inventor
Andrew Stemmermann
Original Assignee
Sunray Scient Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sunray Scient Inc filed Critical Sunray Scient Inc
Publication of MY206409A publication Critical patent/MY206409A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0169—Using a temporary frame during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

Systems (100) and methods for improved interconnections for electronic components (150) using ACAs are provided. The methods involve using magnets (120) specific for each component to be connected and optimized in terms of size and strength and position relative to the substrate (140) and component (150). Also provided are ovens adapted for use with the methods and systems (100) and kits providing the parts of the system for use with existing ovens. The most suitable drawing: Fig. 1
MYPI2020002327A 2017-11-15 2018-11-15 System and method for improved electronic component interconnections MY206409A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762586815P 2017-11-15 2017-11-15
PCT/US2018/061395 WO2019099754A1 (en) 2017-11-15 2018-11-15 System and method for improved electronic component interconnections

Publications (1)

Publication Number Publication Date
MY206409A true MY206409A (en) 2024-12-16

Family

ID=64901646

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2020002327A MY206409A (en) 2017-11-15 2018-11-15 System and method for improved electronic component interconnections

Country Status (9)

Country Link
EP (1) EP3711463A1 (en)
JP (2) JP7193168B2 (en)
KR (2) KR102668129B1 (en)
CN (2) CN119855066A (en)
AU (2) AU2018368939B2 (en)
CA (1) CA3082894A1 (en)
MY (1) MY206409A (en)
SG (1) SG11202004250RA (en)
WO (1) WO2019099754A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111586979B (en) * 2020-05-20 2021-05-18 江西省开德电子科技有限公司 Equipment for assisting in manufacturing electronic parts of integrated circuit board

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5169471A (en) 1991-07-29 1992-12-08 Strasser Gene W Auto electrical connecting circuit board assembly
US5429701A (en) 1992-04-14 1995-07-04 Industrial Technology Research Institute Method of electrically interconnecting conductors
JPH0669643A (en) * 1992-08-19 1994-03-11 Sony Corp Connecting method and connector of conductor and anisotropic conductive film for use therein
WO1994030034A1 (en) 1993-06-16 1994-12-22 Nihon Almit Co., Ltd. Method of electrical connection and electric circuit mounting board, and paste for executing the method
JPH1140224A (en) * 1997-07-11 1999-02-12 Jsr Corp Anisotropic conductive sheet
AUPR424701A0 (en) * 2001-04-05 2001-05-17 Beson, Robert Magnetic holding device
US20050039323A1 (en) * 2003-08-22 2005-02-24 Simens Medical Solutions Usa, Inc. Transducers with electically conductive matching layers and methods of manufacture
JP4393538B2 (en) * 2007-07-25 2010-01-06 新光電気工業株式会社 Magnetic solder ball arrangement apparatus and arrangement method
US8313958B2 (en) * 2010-05-12 2012-11-20 Intel Corporation Magnetic microelectronic device attachment
US8256618B2 (en) * 2010-08-11 2012-09-04 All About Packaging, Inc. Magnetic storage device and a method of assembling the device
US20120106111A1 (en) 2010-10-31 2012-05-03 Joseph Mazzochette Anisotropic electrically and thermally conductive adhesive with magnetic nano-particles
US9349628B2 (en) * 2013-02-25 2016-05-24 Advanced Micro Devices, Inc. Method and an alignment plate for engaging a stiffener frame and a circuit board
US9365749B2 (en) 2013-05-31 2016-06-14 Sunray Scientific, Llc Anisotropic conductive adhesive with reduced migration
US20160254244A1 (en) * 2013-05-31 2016-09-01 Sunray Scientific, Llc Systems and Methods Utilizing Anisotropic Conductive Adhesives

Also Published As

Publication number Publication date
JP7440120B2 (en) 2024-02-28
KR20240074921A (en) 2024-05-28
KR102993777B1 (en) 2026-07-22
EP3711463A1 (en) 2020-09-23
JP2021503186A (en) 2021-02-04
WO2019099754A1 (en) 2019-05-23
CN119855066A (en) 2025-04-18
AU2018368939B2 (en) 2023-08-31
JP7193168B2 (en) 2022-12-20
SG11202004250RA (en) 2020-06-29
AU2018368939A1 (en) 2020-06-25
KR102668129B1 (en) 2024-05-23
JP2023025166A (en) 2023-02-21
AU2023274124A1 (en) 2023-12-21
CA3082894A1 (en) 2019-05-23
AU2023274124B2 (en) 2025-09-11
CN111512708A (en) 2020-08-07
CN111512708B (en) 2024-12-06
KR20200111162A (en) 2020-09-28

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