MY207411A - Jig conveyance member and surface treatment apparatus and method - Google Patents

Jig conveyance member and surface treatment apparatus and method

Info

Publication number
MY207411A
MY207411A MYPI2021002503A MYPI2021002503A MY207411A MY 207411 A MY207411 A MY 207411A MY PI2021002503 A MYPI2021002503 A MY PI2021002503A MY PI2021002503 A MYPI2021002503 A MY PI2021002503A MY 207411 A MY207411 A MY 207411A
Authority
MY
Malaysia
Prior art keywords
jig
coupling
holding part
conveyance member
jig holding
Prior art date
Application number
MYPI2021002503A
Inventor
Katsumi Ishii
Masahide Watanabe
Original Assignee
Almex Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Almex Tech Inc filed Critical Almex Tech Inc
Publication of MY207411A publication Critical patent/MY207411A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C23C18/163—Supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1664—Process features with additional means during the plating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Coating Apparatus (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

A jig conveyance member (100) has: a jig holding part (110) to which a workpiece holding jig (10) that holds a workpiece (W) in a hanging manner is detachably attached; a supporting part (120) that supports the jig holding part; and a coupling part (130) that couples the jig holding part (110) and the supporting part (120) together. The coupling part (130) releases the coupling between the jig holding part (110) and the supporting part (120) when an external force is being applied, couples the jig holding part (110) and the supporting part (120) together when the external force is released, and, when coupling, is capable of selecting one of a plurality of coupling positions in which the relative angle between the jig holding part (110) and the supporting part (120) differs in plan view. (Fig. 6)
MYPI2021002503A 2018-11-20 2019-11-13 Jig conveyance member and surface treatment apparatus and method MY207411A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018217662 2018-11-20
PCT/JP2019/044512 WO2020105524A1 (en) 2018-11-20 2019-11-13 Jig conveyance member and surface treatment apparatus and method

Publications (1)

Publication Number Publication Date
MY207411A true MY207411A (en) 2025-02-26

Family

ID=70773587

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2021002503A MY207411A (en) 2018-11-20 2019-11-13 Jig conveyance member and surface treatment apparatus and method

Country Status (7)

Country Link
JP (1) JP6909524B2 (en)
KR (1) KR20210092219A (en)
CN (1) CN113056576B (en)
MY (1) MY207411A (en)
PH (1) PH12021551141A1 (en)
TW (1) TWI725629B (en)
WO (1) WO2020105524A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112251693B (en) * 2020-09-08 2023-09-01 徐州瑞马智能技术有限公司 Perpendicular blowing type hot galvanizing device for foundation bolt with only part of length being plated

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5420424Y2 (en) * 1974-05-30 1979-07-24
JPH046223Y2 (en) * 1986-02-19 1992-02-20
JP2006093651A (en) 2004-08-26 2006-04-06 Ngk Spark Plug Co Ltd Wiring board manufacturing method and electroless plating apparatus for wiring board manufacturing
JP5164693B2 (en) * 2008-06-30 2013-03-21 木田精工株式会社 Plating equipment
JP5569713B2 (en) * 2009-05-29 2014-08-13 日立化成株式会社 Electroless copper plating apparatus for thickening, electroless copper plating method for thickening, and manufacturing method of multilayer printed wiring board
JP5602553B2 (en) * 2010-09-17 2014-10-08 アルメックスＰｅ株式会社 Surface treatment equipment
KR101500966B1 (en) * 2011-06-30 2015-03-10 아루멕쿠스 피이 가부시키가이샤 Surface treatment apparatus and jig for holding work
JP5833355B2 (en) * 2011-06-30 2015-12-16 アルメックスＰｅ株式会社 Surface treatment equipment
CN203049036U (en) * 2013-01-18 2013-07-10 瑞华高科技电子工业园(厦门)有限公司 Copper plating fixture for circuit boards
TWM464817U (en) * 2013-07-03 2013-11-01 Ampoc Far East Co Ltd Circuit board clamping device with flipping mechanism
JP6117891B2 (en) * 2015-10-29 2017-04-19 アルメックスＰｅ株式会社 Surface treatment equipment
MY195297A (en) * 2016-09-29 2023-01-12 Almex Pe Inc Workpiece Holding Jig and Method for Attaching Workpiece to Workpiece Holding Jig

Also Published As

Publication number Publication date
JP6909524B2 (en) 2021-07-28
WO2020105524A1 (en) 2020-05-28
CN113056576B (en) 2024-08-16
TWI725629B (en) 2021-04-21
TW202037546A (en) 2020-10-16
KR20210092219A (en) 2021-07-23
CN113056576A (en) 2021-06-29
JPWO2020105524A1 (en) 2021-03-18
PH12021551141A1 (en) 2021-10-25

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