MY207883A - Alignment mark setting method - Google Patents

Alignment mark setting method

Info

Publication number
MY207883A
MY207883A MYPI2021001313A MYPI2021001313A MY207883A MY 207883 A MY207883 A MY 207883A MY PI2021001313 A MYPI2021001313 A MY PI2021001313A MY PI2021001313 A MYPI2021001313 A MY PI2021001313A MY 207883 A MY207883 A MY 207883A
Authority
MY
Malaysia
Prior art keywords
marks
frame line
mark
alignment mark
circumscribing rectangle
Prior art date
Application number
MYPI2021001313A
Inventor
Omori Takafumi
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of MY207883A publication Critical patent/MY207883A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0614—Marking devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/301—Marks applied to devices, e.g. for alignment or identification for alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/501—Marks applied to devices, e.g. for alignment or identification for use before dicing

Landscapes

  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

An alignment mark (29) setting method includes imaging one or more marks (17) formed on a front surface (11a) side of a wafer (11), acquiring information constituting respective circumscribing rectangles (25,35) of the one or more marks (17) imaged, automatically adjusting the position and the size of the frame line (27) relative to the circumscribing rectangle (25,35) in such a manner that, according to designation of one mark or a plurality of marks (17), the center of the circumscribing rectangle (25,35) of the one mark or all of the plurality of marks (17) is moved to the center of the tetragonal frame line (27), the circumscribing rectangle (25,35) is accommodated in the frame line (27), and the spacing between the circumscribing rectangle (25,35) and the frame line (27) is adjusted to a predetermined distance, and registering a region (31) inclusive of the one mark or the plurality of marks (17) inside the frame line (27) adjusted in size, as an alignment mark (29), on the processing apparatus (2).
MYPI2021001313A 2020-04-03 2021-03-11 Alignment mark setting method MY207883A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020067834A JP7399576B2 (en) 2020-04-03 2020-04-03 Alignment mark setting method and processing equipment

Publications (1)

Publication Number Publication Date
MY207883A true MY207883A (en) 2025-03-25

Family

ID=77997563

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2021001313A MY207883A (en) 2020-04-03 2021-03-11 Alignment mark setting method

Country Status (6)

Country Link
JP (1) JP7399576B2 (en)
KR (1) KR102871156B1 (en)
CN (1) CN113496933B (en)
MY (1) MY207883A (en)
SG (1) SG10202103473PA (en)
TW (1) TWI858240B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114098230B (en) * 2021-10-26 2022-04-15 际华三五一三实业有限公司 Calibration method of automatic marking machine
JP7799463B2 (en) * 2021-12-06 2026-01-15 株式会社ディスコ processing equipment

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2617870B2 (en) 1993-10-04 1997-06-04 株式会社ディスコ Alignment method
JPH07321181A (en) * 1994-05-20 1995-12-08 Disco Abrasive Syst Ltd System for teaching of automatic setting key pattern
JP4744954B2 (en) * 2005-06-29 2011-08-10 富士フイルム株式会社 Substrate manufacturing method and exposure apparatus
JP6143336B2 (en) 2013-04-01 2017-06-07 株式会社ディスコ Key pattern detection method
JP6584886B2 (en) 2015-09-14 2019-10-02 株式会社ディスコ Split method
JP6703463B2 (en) * 2016-09-13 2020-06-03 株式会社ディスコ Adjustment method and device
JP7088771B2 (en) 2018-07-26 2022-06-21 株式会社ディスコ Alignment method

Also Published As

Publication number Publication date
TWI858240B (en) 2024-10-11
KR20210124062A (en) 2021-10-14
JP2021163951A (en) 2021-10-11
JP7399576B2 (en) 2023-12-18
SG10202103473PA (en) 2021-11-29
TW202139279A (en) 2021-10-16
CN113496933A (en) 2021-10-12
KR102871156B1 (en) 2025-10-14
CN113496933B (en) 2026-03-24

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