MY209873A - Method of processing workpiece - Google Patents

Method of processing workpiece

Info

Publication number
MY209873A
MY209873A MYPI2021003937A MYPI2021003937A MY209873A MY 209873 A MY209873 A MY 209873A MY PI2021003937 A MYPI2021003937 A MY PI2021003937A MY PI2021003937 A MYPI2021003937 A MY PI2021003937A MY 209873 A MY209873 A MY 209873A
Authority
MY
Malaysia
Prior art keywords
workpiece
sides
processing
orientation
sets
Prior art date
Application number
MYPI2021003937A
Inventor
Maeda Tsutomu
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of MY209873A publication Critical patent/MY209873A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
    • B23Q17/2428—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves for measuring existing positions of tools or workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/25—Movable or adjustable work or tool supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/20—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring workpiece characteristics, e.g. contour, dimension, hardness

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

There is provided a method of processing a plate- shaped workpiece (11) having a first rectangular surface (11a) having four sides (11c, 11d, 11e, 11f) and a second rectangular surface (11b) positioned opposite the first surface (11a). The method includes an acquiring step (ST11) for, while the second surface (11b) of the workpiece (11) is being held on a holding surface (40a) of a chuck table (36), acquiring an orientation of the four sides (11c, 11d, 11e, 11f) of the workpiece (11) in an XY plane parallel to the holding surface (40a) and four sets of XY coordinates indicating positions of the four sides (11c, 11d, 11e, 11f) in the XY plane, from displacement information obtained by measuring a height of an area including the four sides (11c, 11d, 11e, 11f) of the workpiece (11), and a processing step (ST15) for processing the workpiece (11) on the basis of the orientation of the sides and the four sets of XY coordinates. The most suitable drawing: FIG. 2.
MYPI2021003937A 2020-08-20 2021-07-12 Method of processing workpiece MY209873A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020139125A JP7467003B2 (en) 2020-08-20 2020-08-20 Method for processing workpiece

Publications (1)

Publication Number Publication Date
MY209873A true MY209873A (en) 2025-08-08

Family

ID=80283219

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2021003937A MY209873A (en) 2020-08-20 2021-07-12 Method of processing workpiece

Country Status (6)

Country Link
JP (1) JP7467003B2 (en)
KR (1) KR102870642B1 (en)
CN (1) CN114074224B (en)
MY (1) MY209873A (en)
PH (1) PH12021050310A1 (en)
TW (1) TWI886318B (en)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3338120B2 (en) * 1993-05-14 2002-10-28 株式会社ハイロックス A method for determining the height of an arbitrary part of a minute object by optical means without contact
JP3190612B2 (en) * 1998-01-26 2001-07-23 日本ニユクリア・フユエル株式会社 Laser welding equipment
JP2006093333A (en) 2004-09-22 2006-04-06 Disco Abrasive Syst Ltd Cutting method
WO2007105417A1 (en) * 2006-03-06 2007-09-20 Nippon Mining & Metals Co., Ltd. Method for determining machining plane of planar material, machining method and device for determining machining plane and flat surface machining device
JP6148075B2 (en) * 2013-05-31 2017-06-14 株式会社ディスコ Laser processing equipment
JP6262039B2 (en) * 2014-03-17 2018-01-17 株式会社ディスコ Processing method of plate
JP2017116401A (en) 2015-12-24 2017-06-29 凸版印刷株式会社 Substrate position adjustment device and substrate position adjustment method
CN106426189B (en) * 2016-07-13 2019-09-20 福建工程学院 Automatic Deviation Correction Method for Grinding and Polishing Robot Workpiece Clamping
JP6870974B2 (en) * 2016-12-08 2021-05-12 株式会社ディスコ How to divide the work piece
JP6889574B2 (en) 2017-03-03 2021-06-18 株式会社キーエンス Robot setting device, robot setting method, robot setting program, computer-readable recording medium, and recording equipment
JP7436251B2 (en) 2020-03-16 2024-02-21 ファスフォードテクノロジ株式会社 Die bonding equipment and semiconductor device manufacturing method

Also Published As

Publication number Publication date
KR102870642B1 (en) 2025-10-13
TWI886318B (en) 2025-06-11
TW202224006A (en) 2022-06-16
JP2022035060A (en) 2022-03-04
KR20220023290A (en) 2022-03-02
CN114074224B (en) 2026-04-21
PH12021050310A1 (en) 2022-03-07
JP7467003B2 (en) 2024-04-15
CN114074224A (en) 2022-02-22

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