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Application filed by Huawei Tech Co LtdfiledCriticalHuawei Tech Co Ltd
Priority to MYPI2021001512ApriorityCriticalpatent/MY209928A/en
Publication of MY209928ApublicationCriticalpatent/MY209928A/en
Embodiments of this application disclose a Universal Serial Bus, USB, Type-C connector (100), including at least one first conductive terminal (1) and at least one second conductive terminal (2), where a first electroplated layer (11) is disposed on an outer surface of the first conductive terminal (1), a second electroplated layer (21) is disposed on an outer surface of the second conductive terminal (2), and a material of the second electroplated layer (21) is different from a material of the first electroplated layer (11). Electroplating costs of the electrical connector are reduced while corrosion resistance of the electrical connector is ensured. The embodiments of this application further disclose a mobile terminal and an electrical connector manufacturing method. The most illustrative drawing: Figure 4.
MYPI2021001512A2019-12-202019-12-20Electrical connector, mobile terminal, and electrical connector manufacturing method
MY209928A
(en)
Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as dielectric substrate
Composite material, method for forming the composite material, electrode plated with the composite material, and connection structure having the composite material