MY210481A - Electroconductive paste and method for producing electronic component using same - Google Patents
Electroconductive paste and method for producing electronic component using sameInfo
- Publication number
- MY210481A MY210481A MYPI2022001593A MYPI2022001593A MY210481A MY 210481 A MY210481 A MY 210481A MY PI2022001593 A MYPI2022001593 A MY PI2022001593A MY PI2022001593 A MYPI2022001593 A MY PI2022001593A MY 210481 A MY210481 A MY 210481A
- Authority
- MY
- Malaysia
- Prior art keywords
- electroconductive paste
- same
- electronic component
- producing electronic
- electroconductive
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Conductive Materials (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
The present invention provides an electroconductive paste for gravure printing. The electroconductive paste contains an electroconductive powder, a dielectric powder, a binder resin, a solvent, and a dispersant. In the electroconductive paste, the dispersant includes a predetermined dicarboxylic acid-based dispersant. The electroconductive paste has a viscosity V40 at a shear velocity of 4s of 5 or less at 25C.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019174262A JP6810778B1 (en) | 2019-09-25 | 2019-09-25 | Conductive paste and manufacturing method of electronic parts using it |
| PCT/JP2020/033582 WO2021059925A1 (en) | 2019-09-25 | 2020-09-04 | Electroconductive paste and method for producing electronic component using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY210481A true MY210481A (en) | 2025-09-24 |
Family
ID=73993048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2022001593A MY210481A (en) | 2019-09-25 | 2020-09-04 | Electroconductive paste and method for producing electronic component using same |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP6810778B1 (en) |
| KR (1) | KR102808162B1 (en) |
| CN (1) | CN114503220B (en) |
| MY (1) | MY210481A (en) |
| TW (1) | TWI838578B (en) |
| WO (1) | WO2021059925A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7830855B2 (en) * | 2021-09-03 | 2026-03-17 | 住友金属鉱山株式会社 | Conductive paste for gravure printing, electronic components, and multilayer ceramic capacitors |
| CN118120032A (en) * | 2021-12-01 | 2024-05-31 | 株式会社村田制作所 | Paste for electronic component |
| JP2023144805A (en) * | 2022-03-28 | 2023-10-11 | 住友金属鉱山株式会社 | Evaluation device, evaluation system, evaluation method, and program |
| JP2023144806A (en) * | 2022-03-28 | 2023-10-11 | 住友金属鉱山株式会社 | Evaluation device, evaluation system, evaluation method, and program |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4158080B2 (en) * | 2002-01-30 | 2008-10-01 | 東洋紡績株式会社 | Conductive paste |
| JP4240284B2 (en) * | 2003-01-17 | 2009-03-18 | 東洋紡績株式会社 | Conductive paste |
| JP4021361B2 (en) * | 2003-04-23 | 2007-12-12 | 東邦チタニウム株式会社 | Nickel powder dispersion and method for preparing the same, and method for preparing conductive paste using the powder dispersion |
| JP5466769B2 (en) * | 2010-11-01 | 2014-04-09 | Dowaエレクトロニクス株式会社 | Low-temperature sinterable conductive paste, conductive film using the same, and method for forming conductive film |
| JP4832615B1 (en) * | 2010-11-01 | 2011-12-07 | Dowaエレクトロニクス株式会社 | Low-temperature sinterable conductive paste, conductive film using the same, and method for forming conductive film |
| JP5569747B2 (en) | 2011-02-18 | 2014-08-13 | 住友金属鉱山株式会社 | Gravure printing conductive paste used for multilayer ceramic capacitor internal electrode |
| JP2013251208A (en) * | 2012-06-01 | 2013-12-12 | Sekisui Chem Co Ltd | Conductive paste |
| JP6151017B2 (en) | 2012-12-20 | 2017-06-21 | Jfeミネラル株式会社 | Nickel ultrafine powder, conductive paste, and method for producing nickel ultrafine powder |
| KR102410080B1 (en) * | 2014-07-31 | 2022-06-16 | 스미토모 긴조쿠 고잔 가부시키가이샤 | Conductive paste |
| JP6948111B2 (en) * | 2016-02-09 | 2021-10-13 | ナミックス株式会社 | Resin compositions, conductive copper pastes, and semiconductor devices |
| JP6853606B2 (en) * | 2017-08-10 | 2021-03-31 | 株式会社ノリタケカンパニーリミテド | Conductive paste |
| TW201937511A (en) * | 2017-08-30 | 2019-09-16 | 日商住友金屬鑛山股份有限公司 | Conductive paste, electronic component, and multilayer ceramic capacitor |
| JP2019046782A (en) * | 2017-08-30 | 2019-03-22 | 住友金属鉱山株式会社 | Conductive paste, and method of manufacturing electronic component and multilayer ceramic capacitor |
| JP6511109B2 (en) * | 2017-10-10 | 2019-05-15 | 株式会社ノリタケカンパニーリミテド | Conductive paste |
-
2019
- 2019-09-25 JP JP2019174262A patent/JP6810778B1/en active Active
-
2020
- 2020-09-04 CN CN202080067677.0A patent/CN114503220B/en active Active
- 2020-09-04 MY MYPI2022001593A patent/MY210481A/en unknown
- 2020-09-04 KR KR1020227013562A patent/KR102808162B1/en active Active
- 2020-09-04 WO PCT/JP2020/033582 patent/WO2021059925A1/en not_active Ceased
- 2020-09-11 TW TW109131260A patent/TWI838578B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TW202112731A (en) | 2021-04-01 |
| CN114503220B (en) | 2024-12-24 |
| KR20220062656A (en) | 2022-05-17 |
| JP6810778B1 (en) | 2021-01-06 |
| TWI838578B (en) | 2024-04-11 |
| KR102808162B1 (en) | 2025-05-16 |
| CN114503220A (en) | 2022-05-13 |
| WO2021059925A1 (en) | 2021-04-01 |
| JP2021051916A (en) | 2021-04-01 |
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