NL1003366C2 - Inrichting en werkwijze voor het omhullen van produkten. - Google Patents

Inrichting en werkwijze voor het omhullen van produkten. Download PDF

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Publication number
NL1003366C2
NL1003366C2 NL1003366A NL1003366A NL1003366C2 NL 1003366 C2 NL1003366 C2 NL 1003366C2 NL 1003366 A NL1003366 A NL 1003366A NL 1003366 A NL1003366 A NL 1003366A NL 1003366 C2 NL1003366 C2 NL 1003366C2
Authority
NL
Netherlands
Prior art keywords
products
encapsulating
slide
pressing
lead frames
Prior art date
Application number
NL1003366A
Other languages
English (en)
Dutch (nl)
Inventor
Lambertus Franciscus Wil Haren
Albertus Franciscus Gera Driel
Wilhelmus Hendrikus Jo Harmsen
Stijn Klaas Tjeerd Zoethout
Robert Jan Willem Stemerdink
Original Assignee
Fico Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv filed Critical Fico Bv
Priority to NL1003366A priority Critical patent/NL1003366C2/nl
Priority to EP97201728A priority patent/EP0817245A1/de
Priority to SG1997002045A priority patent/SG55328A1/en
Priority to MYPI97002656A priority patent/MY127476A/en
Priority to US08/876,942 priority patent/US6071107A/en
Priority to KR1019970025139A priority patent/KR100473129B1/ko
Priority to CN97112786A priority patent/CN1171625A/zh
Priority to JP17768597A priority patent/JP4199319B2/ja
Priority to TW086108518A priority patent/TW399271B/zh
Application granted granted Critical
Publication of NL1003366C2 publication Critical patent/NL1003366C2/nl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C45/1468—Plants therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
NL1003366A 1996-06-18 1996-06-18 Inrichting en werkwijze voor het omhullen van produkten. NL1003366C2 (nl)

Priority Applications (9)

Application Number Priority Date Filing Date Title
NL1003366A NL1003366C2 (nl) 1996-06-18 1996-06-18 Inrichting en werkwijze voor het omhullen van produkten.
EP97201728A EP0817245A1 (de) 1996-06-18 1997-06-11 Vorrichtung und Verfahren zur Einkapselung von Produkten
SG1997002045A SG55328A1 (en) 1996-06-18 1997-06-13 Apparatus and method for encapsulating products
MYPI97002656A MY127476A (en) 1996-06-18 1997-06-13 Apparatus and method for encapsulating products
US08/876,942 US6071107A (en) 1996-06-18 1997-06-16 Apparatus for encapsulating products
KR1019970025139A KR100473129B1 (ko) 1996-06-18 1997-06-17 제품캡슐화장치및그방법
CN97112786A CN1171625A (zh) 1996-06-18 1997-06-17 封装产品的装置和方法
JP17768597A JP4199319B2 (ja) 1996-06-18 1997-06-18 製品をカプセル封入する装置と方法
TW086108518A TW399271B (en) 1996-06-18 1997-06-18 Apparatus and method for encapsulating products

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1003366A NL1003366C2 (nl) 1996-06-18 1996-06-18 Inrichting en werkwijze voor het omhullen van produkten.
NL1003366 1996-06-18

Publications (1)

Publication Number Publication Date
NL1003366C2 true NL1003366C2 (nl) 1997-12-19

Family

ID=19763033

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1003366A NL1003366C2 (nl) 1996-06-18 1996-06-18 Inrichting en werkwijze voor het omhullen van produkten.

Country Status (9)

Country Link
US (1) US6071107A (de)
EP (1) EP0817245A1 (de)
JP (1) JP4199319B2 (de)
KR (1) KR100473129B1 (de)
CN (1) CN1171625A (de)
MY (1) MY127476A (de)
NL (1) NL1003366C2 (de)
SG (1) SG55328A1 (de)
TW (1) TW399271B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1028907C2 (nl) * 2005-04-29 2006-10-31 Fico Bv Werkwijze en inrichting voor het aanvoeren en het afvoeren van dragers met elektronische componenten.

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW509615B (en) * 2000-04-21 2002-11-11 Apic Yamada Corp Resin molding machine and resin tablet feeding machine
KR100408457B1 (ko) * 2001-05-10 2003-12-06 삼성전자주식회사 반도체 칩 패키지 몰딩 장치용 클리닝 장치
US6736627B2 (en) * 2001-07-09 2004-05-18 Asm Technology Singapore Pte. Ltd. Mold cleaning apparatus
US20080057528A1 (en) * 2006-08-30 2008-03-06 Kimberly-Clark Worldwide, Inc. Detection of hydrogen peroxide released by enzyme-catalyzed oxidation of an analyte
JP2011103406A (ja) * 2009-11-11 2011-05-26 Nft:Kk 樹脂封止装置
DE102013109858A1 (de) * 2013-09-09 2015-03-12 Dieffenbacher GmbH Maschinen- und Anlagenbau Verfahren und Vorrichtung zur Reinigung eines Werkzeuges im Zuge der Herstellung von Formteilen
CN105744823B (zh) * 2014-12-12 2018-12-18 致茂电子(苏州)有限公司 电子组件承载盘的快速定位移载方法
CN104701227B (zh) * 2015-03-27 2017-12-29 江苏艾科瑞思封装自动化设备有限公司 用于集成电路封装设备的料片进给机构
JP6549478B2 (ja) * 2015-11-30 2019-07-24 Ｔｏｗａ株式会社 吐出装置、樹脂成形装置、吐出方法及び樹脂成型品の製造方法
CN106426751B (zh) * 2016-08-16 2018-10-30 昆山倚天自动化科技股份有限公司 一种注塑成型产品的收料设备
JP7492263B2 (ja) * 2021-06-24 2024-05-29 アピックヤマダ株式会社 圧縮成形装置及び圧縮成形方法
JP7852905B2 (ja) * 2022-01-19 2026-04-28 ヤマハロボティクス株式会社 樹脂封止装置
CN115744257B (zh) * 2022-11-28 2024-11-01 卓尔半导体设备(苏州)有限公司 塑封压机自动化上下料系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4580964A (en) * 1984-07-26 1986-04-08 Microdot Inc. Press loading apparatus
US5431179A (en) * 1993-02-16 1995-07-11 Tokyo Electron Limited Wafer drying apparatus and fire-extinguishing method therefor
EP0713246A1 (de) * 1994-11-18 1996-05-22 Fico B.V. Modulare Giessvorrichtung

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2655692A (en) * 1952-04-01 1953-10-20 Eastman Kodak Co Mold for framing lenses in a plastic mounting
US4684202A (en) * 1986-08-25 1987-08-04 General Motors Corporation Overmolded electrical connector
JPS6426420A (en) * 1987-07-23 1989-01-27 Nissha Printing Device for injection molding and simultaneous decorating and manufacture of injection-molded and simultaneously decorated product
WO1991008095A2 (en) * 1989-11-24 1991-06-13 Asm Fico Tooling B.V. Single-strip moulding apparatus
JP3205066B2 (ja) * 1992-07-29 2001-09-04 曙ブレーキ工業株式会社 摩擦材の予備成形生地の搬送方法及びその装置
US5527173A (en) * 1994-04-18 1996-06-18 Husky Injection Molding Systems Ltd. Apparatus for producing plastic articles with inserts
CA2122507C (en) * 1994-04-29 1998-01-06 Edmond J. Godin Apparatus and method of loading pieces into mould of injection moulding apparatus and unloading moulded composite article
JP2927687B2 (ja) * 1994-10-25 1999-07-28 株式会社バンダイ 成形方法及び成形装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4580964A (en) * 1984-07-26 1986-04-08 Microdot Inc. Press loading apparatus
US5431179A (en) * 1993-02-16 1995-07-11 Tokyo Electron Limited Wafer drying apparatus and fire-extinguishing method therefor
EP0713246A1 (de) * 1994-11-18 1996-05-22 Fico B.V. Modulare Giessvorrichtung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1028907C2 (nl) * 2005-04-29 2006-10-31 Fico Bv Werkwijze en inrichting voor het aanvoeren en het afvoeren van dragers met elektronische componenten.

Also Published As

Publication number Publication date
SG55328A1 (en) 1998-12-21
TW399271B (en) 2000-07-21
EP0817245A1 (de) 1998-01-07
JPH10107052A (ja) 1998-04-24
KR980005918A (ko) 1998-03-30
MY127476A (en) 2006-12-29
KR100473129B1 (ko) 2005-04-14
JP4199319B2 (ja) 2008-12-17
US6071107A (en) 2000-06-06
CN1171625A (zh) 1998-01-28

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Effective date: 20110101