NL106735C - - Google Patents

Info

Publication number
NL106735C
NL106735C NL106735DA NL106735C NL 106735 C NL106735 C NL 106735C NL 106735D A NL106735D A NL 106735DA NL 106735 C NL106735 C NL 106735C
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Application granted granted Critical
Publication of NL106735C publication Critical patent/NL106735C/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/20Arrangements for cooling
    • H10W40/22Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/20Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10Containers or parts thereof
    • H10W76/12Containers or parts thereof characterised by their shape
    • H10W76/13Containers comprising a conductive base serving as an interconnection
    • H10W76/138Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
NL106735D 1955-04-30 NL106735C (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0043756 1955-04-30

Publications (1)

Publication Number Publication Date
NL106735C true NL106735C (de) 1900-01-01

Family

ID=7484862

Family Applications (4)

Application Number Title Priority Date Filing Date
NL106735D NL106735C (de) 1955-04-30
NL297250D NL297250A (de) 1955-04-30
NL206368D NL206368A (de) 1955-04-30
NL297249D NL297249A (de) 1955-04-30

Family Applications After (3)

Application Number Title Priority Date Filing Date
NL297250D NL297250A (de) 1955-04-30
NL206368D NL206368A (de) 1955-04-30
NL297249D NL297249A (de) 1955-04-30

Country Status (4)

Country Link
CH (1) CH344487A (de)
DE (1) DE1414324A1 (de)
GB (1) GB834000A (de)
NL (4) NL297249A (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3460002A (en) * 1965-09-29 1969-08-05 Microwave Ass Semiconductor diode construction and mounting
US5278728A (en) * 1992-06-25 1994-01-11 The Lincoln Electric Company Diode mounting

Also Published As

Publication number Publication date
NL206368A (de) 1900-01-01
NL297250A (de) 1900-01-01
NL297249A (de) 1900-01-01
GB834000A (en) 1960-05-04
DE1414324A1 (de) 1969-03-27
CH344487A (de) 1960-02-15

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