NL135880C - Halfgeleiderbouwelement met een in een huis ingesloten plaatvormig halfgeleiderelement - Google Patents

Halfgeleiderbouwelement met een in een huis ingesloten plaatvormig halfgeleiderelement

Info

Publication number
NL135880C
NL135880C NL278357A NL278357A NL135880C NL 135880 C NL135880 C NL 135880C NL 278357 A NL278357 A NL 278357A NL 278357 A NL278357 A NL 278357A NL 135880 C NL135880 C NL 135880C
Authority
NL
Netherlands
Prior art keywords
housing
plate
element enclosed
semiconductor element
semiconductor component
Prior art date
Application number
NL278357A
Other languages
English (en)
Dutch (nl)
Other versions
NL278357A (nl
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of NL278357A publication Critical patent/NL278357A/nl
Application granted granted Critical
Publication of NL135880C publication Critical patent/NL135880C/nl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/136—Containers comprising a conductive base serving as an interconnection having other interconnections perpendicular to the conductive base
NL278357A 1961-07-12 1962-05-11 Halfgeleiderbouwelement met een in een huis ingesloten plaatvormig halfgeleiderelement NL135880C (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES74774A DE1263190B (de) 1961-07-12 1961-07-12 Halbleiteranordnung mit einem in ein Gehaeuse eingeschlossenen Halbleiterkoerper
DES0076864 1961-11-28

Publications (2)

Publication Number Publication Date
NL278357A NL278357A (nl) 1964-11-10
NL135880C true NL135880C (nl) 1972-11-18

Family

ID=25996516

Family Applications (1)

Application Number Title Priority Date Filing Date
NL278357A NL135880C (nl) 1961-07-12 1962-05-11 Halfgeleiderbouwelement met een in een huis ingesloten plaatvormig halfgeleiderelement

Country Status (7)

Country Link
US (2) US3280384A (de)
BE (2) BE620067A (de)
CH (1) CH409149A (de)
DE (1) DE1263190B (de)
FR (2) FR1374981A (de)
GB (2) GB970895A (de)
NL (1) NL135880C (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3378735A (en) * 1963-06-12 1968-04-16 Siemens Ag Semiconductor device housing with spring contact means and improved thermal characteristics
DE1270184B (de) * 1964-08-26 1968-06-12 Siemens Ag Halbleiterbauelement
DE1279240B (de) * 1964-10-17 1968-10-03 Siemens Ag Folienzwischenlage fuer elektrische Druckkontakt-Verbindungen
DE1279200B (de) * 1964-10-31 1968-10-03 Siemens Ag Halbleiterbauelement
US3377525A (en) * 1965-12-03 1968-04-09 Gen Electric Electrically insulated mounting bracket for encased semicon-ductor device
US3414775A (en) * 1967-03-03 1968-12-03 Ibm Heat dissipating module assembly and method
JPS5030428B1 (de) * 1969-03-31 1975-10-01
US3673478A (en) * 1969-10-31 1972-06-27 Hitachi Ltd A semiconductor pellet fitted on a metal body
GB1337283A (en) * 1969-12-26 1973-11-14 Hitachi Ltd Method of manufacturing a semiconductor device
US4686499A (en) * 1984-09-28 1987-08-11 Cincinnati Microwave, Inc. Police radar warning receiver with cantilevered PC board structure
DE102005047566C5 (de) * 2005-10-05 2011-06-09 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einem Leistungshalbleiterbauelement und mit einem Gehäuse sowie Herstellungsverfahren hierzu
CN100410007C (zh) * 2006-01-26 2008-08-13 宜兴市科兴合金材料有限公司 钼坯压延法制钼圆片工艺
CN106734490A (zh) * 2017-01-17 2017-05-31 宜兴市科兴合金材料有限公司 一种用于钼圆片的压延机

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE534817A (de) * 1954-01-14 1900-01-01
BE536185A (de) * 1954-03-05 1900-01-01
DE1039648B (de) * 1955-04-30 1958-09-25 Siemens Ag Flaechengleichrichter bzw. -transistor
US2863105A (en) * 1955-11-10 1958-12-02 Hoffman Electronics Corp Rectifying device
US2956214A (en) * 1955-11-30 1960-10-11 Bogue Elec Mfg Co Diode
AT203550B (de) * 1957-03-01 1959-05-25 Western Electric Co Halbleitereinrichtung und Verfahren zu deren Herstellung
NL241492A (de) * 1958-07-21
US3059157A (en) * 1958-11-14 1962-10-16 Texas Instruments Inc Semiconductor rectifier
DE1251874B (de) * 1960-10-17
US3188536A (en) * 1960-11-14 1965-06-08 Gen Motors Corp Silicon rectifier encapsulation
DE1248811B (de) * 1961-03-28
BE637603A (de) * 1962-09-21

Also Published As

Publication number Publication date
DE1263190B (de) 1968-03-14
CH409149A (de) 1966-03-15
FR1374981A (fr) 1964-10-16
NL278357A (nl) 1964-11-10
US3280384A (en) 1966-10-18
BE625268R (fr) 1963-05-27
US3280387A (en) 1966-10-18
BE620067A (fr) 1963-01-11
GB970896A (en) 1964-09-23
GB970895A (en) 1964-09-23
FR90701E (fr) 1968-02-02

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