NL165355C - Werkwijze voor het maken van elektrische verbindingen. - Google Patents

Werkwijze voor het maken van elektrische verbindingen.

Info

Publication number
NL165355C
NL165355C NL7703929.A NL7703929A NL165355C NL 165355 C NL165355 C NL 165355C NL 7703929 A NL7703929 A NL 7703929A NL 165355 C NL165355 C NL 165355C
Authority
NL
Netherlands
Prior art keywords
electrical connections
making electrical
making
connections
electrical
Prior art date
Application number
NL7703929.A
Other languages
English (en)
Dutch (nl)
Other versions
NL7703929A (nl
NL165355B (nl
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of NL7703929A publication Critical patent/NL7703929A/xx
Publication of NL165355B publication Critical patent/NL165355B/xx
Application granted granted Critical
Publication of NL165355C publication Critical patent/NL165355C/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y10T29/4916—Simultaneous circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49174—Assembling terminal to elongated conductor
    • Y10T29/49181—Assembling terminal to elongated conductor by deforming

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Stroboscope Apparatuses (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
NL7703929.A 1976-04-09 1977-04-07 Werkwijze voor het maken van elektrische verbindingen. NL165355C (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/675,617 US4028798A (en) 1976-04-09 1976-04-09 Method of making electrical connections

Publications (3)

Publication Number Publication Date
NL7703929A NL7703929A (nl) 1977-10-11
NL165355B NL165355B (nl) 1980-10-15
NL165355C true NL165355C (nl) 1981-03-16

Family

ID=24711282

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7703929.A NL165355C (nl) 1976-04-09 1977-04-07 Werkwijze voor het maken van elektrische verbindingen.

Country Status (7)

Country Link
US (1) US4028798A (fr)
JP (1) JPS52124169A (fr)
BE (1) BE853378A (fr)
CA (1) CA1079939A (fr)
DE (1) DE2715660C3 (fr)
GB (1) GB1571545A (fr)
NL (1) NL165355C (fr)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4241387A (en) * 1977-12-09 1980-12-23 General Electric Company Lamp lead to wire attachment for integral string sets
US4243371A (en) * 1978-03-13 1981-01-06 General Electric Company Flash lamp array construction
US4253233A (en) * 1979-05-04 1981-03-03 General Electric Company Rapidly formed electrical connection
JPS569978A (en) * 1979-05-04 1981-01-31 Gen Electric Electric connecting socket
US4242719A (en) * 1979-06-01 1980-12-30 Interconnection Technology, Inc. Solder-weld P.C. board apparatus
US4249230A (en) * 1979-09-04 1981-02-03 Gte Products Corporation Photoflash unit utilizing circuit board having flashlamps clamped thereto
US4394709A (en) * 1980-03-19 1983-07-19 Gte Products Corporation Die-stamped circuit board assembly having relief means to prevent total switch deformation
US4353109A (en) * 1980-09-02 1982-10-05 General Electric Company Flash lamp array having combined shield and connector
US4344109A (en) * 1980-09-29 1982-08-10 General Electric Company Flash lamp array having printed circuit
US4344108A (en) * 1980-09-29 1982-08-10 General Electric Company Flash lamp array having printed circuit
US4493667A (en) * 1982-03-18 1985-01-15 Gte Products Corporation Multilamp photoflash array fabrication
DE3631947A1 (de) * 1986-09-19 1988-04-07 Ruf Kg Wilhelm Leiterbahnplatte
US4897919A (en) * 1986-10-27 1990-02-06 Black & Decker Inc. Method for producing a stamped substrate
US5229548A (en) * 1986-10-27 1993-07-20 Black & Decker Inc. Circuit board having a stamped substrate
US5035049A (en) * 1986-10-27 1991-07-30 Black & Decker Inc. Method for producing a stamped substrate
DE19531970A1 (de) * 1995-08-30 1997-03-06 Siemens Ag Verfahren zur Herstellung einer Verbindung zwischen zumindest zwei elektrischen Leitern, von denen einer auf einem Trägersubstrat angeordnet ist
US5783008A (en) * 1997-03-31 1998-07-21 Ford Global Technologies, Inc. Apparatus and method for embedding conductors in a non-planar substrate
US6019271A (en) * 1997-07-11 2000-02-01 Ford Motor Company Method for ultrasonic bonding flexible circuits
US7066628B2 (en) 2001-03-29 2006-06-27 Fiber Optic Designs, Inc. Jacketed LED assemblies and light strings containing same
US7056414B2 (en) * 1999-10-07 2006-06-06 Aisin Seiki Kabushiki Kaisha Connecting method for metal material and electric conductive plastic material and product thereby
JP2004045805A (ja) * 2002-07-12 2004-02-12 Yazaki Corp 光ファイバ接続用のフェルール及び光ファイバとフェルールの溶着方法
US7407079B2 (en) * 2003-10-23 2008-08-05 Orthodyne Electronics Corporation Automated filament attachment system for vacuum fluorescent display

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3384958A (en) * 1965-06-30 1968-05-28 Ibm Method of brazing
US3300851A (en) * 1964-01-02 1967-01-31 Gen Electric Method of making bonded wire circuits
US3674602A (en) * 1969-10-09 1972-07-04 Photocircuits Corp Apparatus for making wire scribed circuit boards
JPS4985563A (fr) * 1972-12-22 1974-08-16
US3883213A (en) * 1974-01-07 1975-05-13 Chomerics Inc Connectors
US3894226A (en) * 1974-09-26 1975-07-08 Gen Electric Photoflash lamp array having means for preventing electrical shorting

Also Published As

Publication number Publication date
DE2715660A1 (de) 1977-10-20
DE2715660B2 (de) 1980-03-13
CA1079939A (fr) 1980-06-24
DE2715660C3 (de) 1980-11-20
GB1571545A (en) 1980-07-16
NL7703929A (nl) 1977-10-11
BE853378A (fr) 1977-10-07
JPS52124169A (en) 1977-10-18
US4028798A (en) 1977-06-14
NL165355B (nl) 1980-10-15

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Legal Events

Date Code Title Description
V1 Lapsed because of non-payment of the annual fee