NL270559A - - Google Patents
Info
- Publication number
- NL270559A NL270559A NL270559DA NL270559A NL 270559 A NL270559 A NL 270559A NL 270559D A NL270559D A NL 270559DA NL 270559 A NL270559 A NL 270559A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/132—Containers comprising a conductive base serving as an interconnection having other interconnections through an insulated passage in the conductive base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07336—Soldering or alloying
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES0071282 | 1960-11-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL270559A true NL270559A (2) | 1900-01-01 |
Family
ID=7502355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL270559D NL270559A (2) | 1960-11-16 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3254393A (2) |
| CH (1) | CH393545A (2) |
| DE (1) | DE1439056A1 (2) |
| GB (1) | GB930352A (2) |
| NL (1) | NL270559A (2) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3492545A (en) * | 1968-03-18 | 1970-01-27 | Westinghouse Electric Corp | Electrically and thermally conductive malleable layer embodying lead foil |
| US3590467A (en) * | 1968-11-15 | 1971-07-06 | Corning Glass Works | Method for bonding a crystal to a solid delay medium |
| US4529836A (en) * | 1983-07-15 | 1985-07-16 | Sperry Corporation | Stress absorption matrix |
| DE3446780A1 (de) * | 1984-12-21 | 1986-07-03 | Brown, Boveri & Cie Ag, 6800 Mannheim | Verfahren und verbindungswerkstoff zum metallischen verbinden von bauteilen |
| US5436407A (en) * | 1994-06-13 | 1995-07-25 | Integrated Packaging Assembly Corporation | Metal semiconductor package with an external plastic seal |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2258681A (en) * | 1939-04-15 | 1941-10-14 | Aluminum Co Of America | Method of joining |
| US2362893A (en) * | 1942-04-04 | 1944-11-14 | Metals & Controls Corp | Solder |
| US2497665A (en) * | 1945-02-07 | 1950-02-14 | Brush Dev Co | Piezoelectric device |
| US2530110A (en) * | 1944-06-02 | 1950-11-14 | Sperry Corp | Nonlinear circuit device utilizing germanium |
| US2623273A (en) * | 1945-05-05 | 1952-12-30 | Indium Corp America | Soldered joint and method of making same |
| US2474643A (en) * | 1947-06-04 | 1949-06-28 | Carboloy Company Inc | Method of brazing cemented carbides to steel |
| BE555318A (2) * | 1956-03-07 | |||
| US2922092A (en) * | 1957-05-09 | 1960-01-19 | Westinghouse Electric Corp | Base contact members for semiconductor devices |
| US2917686A (en) * | 1957-08-19 | 1959-12-15 | Westinghouse Electric Corp | Semiconductor rectifier device |
| US3089067A (en) * | 1957-09-30 | 1963-05-07 | Gen Motors Corp | Semiconductor device |
| US3046651A (en) * | 1958-03-14 | 1962-07-31 | Honeywell Regulator Co | Soldering technique |
| US3002135A (en) * | 1958-06-11 | 1961-09-26 | Hughes Aircraft Co | Semiconductor device |
| NL241491A (2) * | 1958-07-21 | |||
| US3020454A (en) * | 1959-11-09 | 1962-02-06 | Solid State Products Inc | Sealing of electrical semiconductor devices |
-
0
- NL NL270559D patent/NL270559A/xx unknown
-
1960
- 1960-11-16 DE DE19601439056 patent/DE1439056A1/de active Pending
-
1961
- 1961-10-02 CH CH1139561A patent/CH393545A/de unknown
- 1961-10-31 US US148958A patent/US3254393A/en not_active Expired - Lifetime
- 1961-11-16 GB GB41021/61A patent/GB930352A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE1439056A1 (de) | 1969-10-16 |
| GB930352A (en) | 1963-07-03 |
| US3254393A (en) | 1966-06-07 |
| CH393545A (de) | 1965-06-15 |