NL272139A - - Google Patents

Info

Publication number
NL272139A
NL272139A NL272139DA NL272139A NL 272139 A NL272139 A NL 272139A NL 272139D A NL272139D A NL 272139DA NL 272139 A NL272139 A NL 272139A
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of NL272139A publication Critical patent/NL272139A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
    • C04B37/005—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of glass or ceramic material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/04—Ceramic interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/10—Glass interlayers, e.g. frit or flux
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/66—Forming laminates or joined articles showing high dimensional accuracy, e.g. indicated by the warpage
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/76—Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/80—Joining the largest surface of one substrate with a smaller surface of the other substrate, e.g. butt joining or forming a T-joint
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Products (AREA)
  • Lead Frames For Integrated Circuits (AREA)
NL272139D 1960-12-15 NL272139A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US76046A US3220095A (en) 1960-12-15 1960-12-15 Method for forming enclosures for semiconductor devices

Publications (1)

Publication Number Publication Date
NL272139A true NL272139A (de) 1900-01-01

Family

ID=22129611

Family Applications (1)

Application Number Title Priority Date Filing Date
NL272139D NL272139A (de) 1960-12-15

Country Status (5)

Country Link
US (1) US3220095A (de)
DE (1) DE1239020B (de)
FR (1) FR1307782A (de)
GB (1) GB991940A (de)
NL (1) NL272139A (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3435516A (en) * 1959-05-06 1969-04-01 Texas Instruments Inc Semiconductor structure fabrication
DE1416437B2 (de) * 1961-09-21 1970-06-11 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Trägerplatte für mikrominiaturisierte Schaltelemente und Verfahren zu ihrer Herstellung
US3335336A (en) * 1962-06-04 1967-08-08 Nippon Electric Co Glass sealed ceramic housings for semiconductor devices
US3341649A (en) * 1964-01-17 1967-09-12 Signetics Corp Modular package for semiconductor devices
US3324357A (en) * 1964-01-29 1967-06-06 Int Standard Electric Corp Multi-terminal semiconductor device having active element directly mounted on terminal leads
US3312771A (en) * 1964-08-07 1967-04-04 Nat Beryllia Corp Microelectronic package
DE1514273B2 (de) * 1964-08-21 1974-08-22 Nippon Electric Co., Ltd., Tokio Halbleiteranordmng
US3382342A (en) * 1964-09-03 1968-05-07 Gti Corp Micromodular package and method of sealing same
US3333167A (en) * 1964-10-08 1967-07-25 Dreyfus Jean-Paul Leon Housing for transistor die
US3340347A (en) * 1964-10-12 1967-09-05 Corning Glass Works Enclosed electronic device
US3349481A (en) * 1964-12-29 1967-10-31 Alpha Microelectronics Company Integrated circuit sealing method and structure
US3497947A (en) * 1967-08-18 1970-03-03 Frank J Ardezzone Miniature circuit connection and packaging techniques
US3574929A (en) * 1969-06-02 1971-04-13 Bourns Inc Adustable resistors and method
US3730969A (en) * 1972-03-06 1973-05-01 Rca Corp Electronic device package
US4326214A (en) * 1976-11-01 1982-04-20 National Semiconductor Corporation Thermal shock resistant package having an ultraviolet light transmitting window for a semiconductor chip

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2735162A (en) * 1956-02-21 Method of making heating elements
US2089541A (en) * 1933-10-30 1937-08-10 Dallenbach Walter Electrode lead-in for metal vacuum vessels
US2306054A (en) * 1938-02-19 1942-12-22 Corning Glass Works Glass heating and working
US2235504A (en) * 1939-04-19 1941-03-18 Westinghouse Electric & Mfg Co Ignitron starter
US2568881A (en) * 1948-12-28 1951-09-25 Steatite Res Corp Ceramic parts for electrical devices having magnetic properties and method of making
USRE25161E (en) * 1953-03-24 1962-04-17 Filament bar casing and method
US2937410A (en) * 1954-09-03 1960-05-24 Edith M Davies Method of molding capacitors in printed circuits
CH320932A (fr) * 1954-11-01 1957-04-15 Omega Brandt & Freres Sa Louis Ampoule pour organes électroniques, notamment pour transistors
US2830238A (en) * 1955-09-30 1958-04-08 Hughes Aircraft Co Heat dissipating semiconductor device
US2880383A (en) * 1956-10-05 1959-03-31 Motorola Inc High frequency transistor package
BE566982A (de) * 1957-04-24
GB920607A (de) * 1958-11-29
US2971138A (en) * 1959-05-18 1961-02-07 Rca Corp Circuit microelement

Also Published As

Publication number Publication date
DE1239020B (de) 1967-04-20
GB991940A (en) 1965-05-12
FR1307782A (fr) 1962-10-26
US3220095A (en) 1965-11-30

Similar Documents

Publication Publication Date Title
DE7626244U1 (de)
AT12687B (de)
AT11472B (de)
GB322309A (de)
AT11578B (de)
AT15472B (de)
AT1395B (de)
AT14210B (de)
DE7738634U1 (de)
AT11404B (de)
AT11700B (de)
AT11435B (de)
AT11454B (de)
AT11475B (de)
AT12752B (de)
AT11687B (de)
AT11906B (de)
AT11892B (de)
AT11345B (de)
AT11810B (de)
AT11588B (de)
AT10880B (de)
AT11854B (de)
AT2551B (de)
AT11674B (de)