NL7008966A - - Google Patents

Info

Publication number: NL7008966A
Authority: NL; Netherlands

Application number

NL7008966A

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1969-06-20

Filing date

1970-06-18

Publication date

1970-12-22

1969-06-20 Priority claimed from DE19691931335 external-priority patent/DE1931335C3/de

1970-06-18 Application filed filed Critical

1970-12-22 Publication of NL7008966A publication Critical patent/NL7008966A/xx

Links

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C3/00—Abrasive blasting machines or devices; Plants
- B24C3/32—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks
- B24C3/322—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks for electrical components
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Processing Of Stones Or Stones Resemblance Materials (AREA)
Crystals, And After-Treatments Of Crystals (AREA)
Dicing (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Mechanical Treatment Of Semiconductor (AREA)

NL7008966A 1969-06-20 1970-06-18 NL7008966A (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DE19691931335 DE1931335C3 (de)		1969-06-20	Verfahren zum Abtrennen eines Körpers von einem scheibenförmigen Kristall und Vorrichtung zur Durchführung dieses Verfahrens

Publications (1)

Publication Number	Publication Date
NL7008966A true NL7008966A (de)	1970-12-22

Family

ID=5737534

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
NL7008966A NL7008966A (de)	1969-06-20	1970-06-18

Country Status (9)

Country	Link
US (1)	US3694972A (de)
JP (1)	JPS5013510B1 (de)
AT (1)	AT315241B (de)
CH (1)	CH504783A (de)
FR (1)	FR2046967B1 (de)
GB (1)	GB1259249A (de)
NL (1)	NL7008966A (de)
SE (1)	SE351523B (de)
ZA (1)	ZA704234B (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3778935A (en) *	1972-01-26	1973-12-18	Pennwalt Corp	Abrading apparatus with rotary index table
CH566643A5 (de) *	1973-10-11	1975-09-15	Bbc Brown Boveri & Cie
US3888054A (en) *	1973-11-16	1975-06-10	Western Electric Co	Method for abrasive cutting in a liquid
US3866357A (en) *	1974-06-06	1975-02-18	Pennwalt Corp	Abrading apparatus
DE2522346C3 (de) *	1975-05-20	1978-10-26	Siemens Ag, 1000 Berlin Und 8000 Muenchen	Verfahren zum Herstellen von Halbleiterbauelementen
CA1252711A (en) *	1984-09-27	1989-04-18	Richard A. Herrington	Ultra-high pressure abrasive jet cutting of glass
US4702042A (en) *	1984-09-27	1987-10-27	Libbey-Owens-Ford Co.	Cutting strengthened glass
US4656791A (en) *	1984-09-27	1987-04-14	Libbey-Owens-Ford Company	Abrasive fluid jet cutting support
JPS61159371A (ja) *	1984-12-28	1986-07-19	Fuji Seiki Seizosho:Kk	Ｉｃの基板用シリコンウェーハのブラスト装置
US5052155A (en) *	1989-08-10	1991-10-01	Emc Technology, Inc.	Apparatus for the treatment of articles by high velocity impacting thereof with a particulate abrasive material
DE4235091C2 (de) *	1992-10-17	2001-09-06	Trumpf Sachsen Gmbh	Flüssigkeits- und Abrasivmittelzuführung für eine Fluidstrahlschneidanlage
US6705925B1 (en) *	2000-10-20	2004-03-16	Lightwave Microsystems	Apparatus and method to dice integrated circuits from a wafer using a pressurized jet
KR20050054944A (ko) *	2002-09-13	2005-06-10	투와-인터콘 테크놀로지 인크.	기판의 제트 싱귤레이션
US7153186B2 (en) *	2002-09-13	2006-12-26	Towa Intercon Technology, Inc.	Jet singulation
EP1873824B1 (de) *	2002-09-13	2009-03-11	Towa-Intercon Technology, Inc.	Vereinzelung eines Substrats mittels Strahl
DE10337920B4 (de) *	2003-08-18	2008-08-28	Schott Ag	Verfahren zur Herstellung einer Mehrzahl von Bauteilen und Zwischenprodukt in Form eines Schichtverbundes
US20060180579A1 (en) *	2005-02-11	2006-08-17	Towa Intercon Technology, Inc.	Multidirectional cutting chuck
JP4791787B2 (ja) *	2005-09-22	2011-10-12	Ｔｏｗａ株式会社	アブレイシブウォータジェットを使用した切断装置
JP2008284635A (ja) *	2007-05-16	2008-11-27	Disco Abrasive Syst Ltd	ウォータジェット加工方法
JP2008307639A (ja) *	2007-06-14	2008-12-25	Disco Abrasive Syst Ltd	ウォータジェット加工方法
JP6022862B2 (ja) *	2012-05-08	2016-11-09	株式会社不二製作所	硬質脆性基板の切り出し方法及び切り出し装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US587892A (en) *		1897-08-10		M a t iiia s w a l t e k
US1664159A (en) *	1926-04-23	1928-03-27	Elroy A Chase	Apparatus for producing ornamental background on stone
GB794528A (en) *	1955-10-07	1958-05-07	William Howard Mead	Improvements in receivers for particulate material
US3205104A (en) *	1961-07-10	1965-09-07	Litton Industries Inc	Fabrication of interdigital delay lines
US3187412A (en) *	1963-04-26	1965-06-08	Gen Electric	Method of mounting and aligning transducers on delay lines
US3262234A (en) *	1963-10-04	1966-07-26	Int Rectifier Corp	Method of forming a semiconductor rim by sandblasting
US3453781A (en) *	1966-03-30	1969-07-08	Ibm	Tailoring microminiature components
US3516204A (en) *	1967-08-21	1970-06-23	Pennwalt Corp	Abrading apparatus

1970
- 1970-06-15 CH CH897770A patent/CH504783A/de not_active IP Right Cessation
- 1970-06-17 AT AT546470A patent/AT315241B/de not_active IP Right Cessation
- 1970-06-18 NL NL7008966A patent/NL7008966A/xx unknown
- 1970-06-19 FR FR7022770A patent/FR2046967B1/fr not_active Expired
- 1970-06-19 GB GB1259249D patent/GB1259249A/en not_active Expired
- 1970-06-20 JP JP5399070A patent/JPS5013510B1/ja active Pending
- 1970-06-22 SE SE08611/70A patent/SE351523B/xx unknown
- 1970-06-22 ZA ZA704234A patent/ZA704234B/xx unknown
- 1970-06-26 US US50181A patent/US3694972A/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
FR2046967B1 (de)	1974-09-20
FR2046967A1 (de)	1971-03-12
GB1259249A (de)	1972-01-05
JPS5013510B1 (de)	1975-05-20
DE1931335A1 (de)	1970-12-23
AT315241B (de)	1974-05-10
SE351523B (de)	1972-11-27
US3694972A (en)	1972-10-03
DE1931335B2 (de)	1976-03-11
ZA704234B (en)	1971-03-31
CH504783A (de)	1971-03-15

Publication	Publication Date	Title
AU2270770A (de)	1972-06-01
FR2046967B1 (de)	1974-09-20
AU465452B2 (de)	1975-09-11
AU429630B2 (de)	1972-10-26
CS151028B2 (de)	1973-09-17
AU5712069A (de)	1971-01-07
AU5113869A (de)	1971-04-29
CS151048B2 (de)	1973-09-17
AU417208B2 (de)	1971-10-14
AU428129B2 (de)	1972-09-12
AU410358B2 (de)	1971-02-09
AU425297B2 (de)	1972-03-26
AU442380B2 (de)	1973-11-05
AU470661B1 (de)	1970-10-05
AT308690B (de)	1973-06-15
AU428074B2 (de)	1972-09-11
AU442285B2 (de)	1973-11-02
AU438128B2 (de)	1973-07-16
AU442322B2 (de)	1973-11-02
AU442535B2 (de)	1973-11-12
AU442554B2 (de)	1973-11-13
AU442357B2 (de)	1973-11-07
CS151574B2 (de)	1973-10-19
AR203167Q (de)	1975-08-22
AU6254169A (de)	1969-12-04