NL7102435A - - Google Patents

Info

Publication number
NL7102435A
NL7102435A NL7102435A NL7102435A NL7102435A NL 7102435 A NL7102435 A NL 7102435A NL 7102435 A NL7102435 A NL 7102435A NL 7102435 A NL7102435 A NL 7102435A NL 7102435 A NL7102435 A NL 7102435A
Authority
NL
Netherlands
Application number
NL7102435A
Other versions
NL172606C (nl
NL172606B (nl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7102435A publication Critical patent/NL7102435A/xx
Publication of NL172606B publication Critical patent/NL172606B/xx
Application granted granted Critical
Publication of NL172606C publication Critical patent/NL172606C/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49799—Providing transitory integral holding or handling portion
NL7102435A 1970-02-26 1971-02-24 Werkwijze voor het vervaardigen van halfgeleiderinrichtingen, waarbij de door onderverdeling van een plaat halfgeleidermateriaal te verkrijgen halfgeleiderelementen met behoud van de plaats ten opzichte van elkaar tijdelijk bijeen worden gehouden op een dragerlichaam. NL172606C (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1437670A 1970-02-26 1970-02-26

Publications (3)

Publication Number Publication Date
NL7102435A true NL7102435A (fr) 1971-08-30
NL172606B NL172606B (nl) 1983-04-18
NL172606C NL172606C (nl) 1983-09-16

Family

ID=21765106

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7102435A NL172606C (nl) 1970-02-26 1971-02-24 Werkwijze voor het vervaardigen van halfgeleiderinrichtingen, waarbij de door onderverdeling van een plaat halfgeleidermateriaal te verkrijgen halfgeleiderelementen met behoud van de plaats ten opzichte van elkaar tijdelijk bijeen worden gehouden op een dragerlichaam.

Country Status (9)

Country Link
US (1) US3706409A (fr)
JP (1) JPS545262B1 (fr)
BE (1) BE763365A (fr)
DE (1) DE2108850C2 (fr)
FR (1) FR2080789B1 (fr)
GB (1) GB1349183A (fr)
IE (1) IE34943B1 (fr)
NL (1) NL172606C (fr)
SE (2) SE372138B (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2431987C2 (de) * 1974-07-03 1983-09-01 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Verbinden eines mit höckerförmigen Anschlußelektroden versehenen Halbleiterbauelements mit einem Träger
DE2436600A1 (de) * 1974-07-30 1976-02-19 Semikron Gleichrichterbau Verfahren zur erzielung einer oberflaechenstabilisierenden schutzschicht bei halbleiterbauelementen
US4140265A (en) * 1975-06-26 1979-02-20 Kollmorgen Technologies Corporation Method and apparatus for positioning the end of a conductive filament at a predetermined and repeatable geometric location for coupling to a predetermined terminal area of an element
JPS608426Y2 (ja) * 1976-12-08 1985-03-25 シャープ株式会社 半導体ウエハ−の保持基板
US4624724A (en) * 1985-01-17 1986-11-25 General Electric Company Method of making integrated circuit silicon die composite having hot melt adhesive on its silicon base
DE3621796A1 (de) * 1986-06-30 1988-01-07 Siemens Ag Verfahren zur verbesserung der nebensprechdaempfung bei einer optisch-elektronischen sensoranordnung
KR930010072B1 (ko) * 1990-10-13 1993-10-14 금성일렉트론 주식회사 Ccd패키지 및 그 제조방법
GB2263195B (en) * 1992-01-08 1996-03-20 Murata Manufacturing Co Component supply method
DE4426809A1 (de) * 1994-07-28 1996-02-08 Siemens Ag Verfahren zum Bestücken eines Trägers mit Chips, insbesondere zum Herstellen von Sensoren zur Luftmassenmessung
KR0141952B1 (ko) * 1994-12-19 1998-06-01 문정환 반도체 패키지 및 그 제조방법
JP3772954B2 (ja) * 1999-10-15 2006-05-10 株式会社村田製作所 チップ状部品の取扱方法
US7576656B2 (en) * 2005-09-15 2009-08-18 Alien Technology Corporation Apparatuses and methods for high speed bonding

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2762954A (en) * 1950-09-09 1956-09-11 Sylvania Electric Prod Method for assembling transistors
US3014447A (en) * 1956-06-08 1961-12-26 Sylvania Electric Prod Soldering machine and method
DE1163977B (de) * 1962-05-15 1964-02-27 Intermetall Sperrfreier Kontakt an einer Zone des Halbleiterkoerpers eines Halbleiterbauelementes
US3180551A (en) * 1963-03-27 1965-04-27 Kenneth L Richard Machine for soldering coils

Also Published As

Publication number Publication date
DE2108850C2 (de) 1983-11-24
SE389225B (sv) 1976-10-25
IE34943B1 (en) 1975-10-01
GB1349183A (en) 1974-03-27
SE372138B (fr) 1974-12-09
FR2080789B1 (fr) 1977-06-17
DE2108850A1 (de) 1971-09-09
IE34943L (en) 1971-08-26
FR2080789A1 (fr) 1971-11-19
US3706409A (en) 1972-12-19
BE763365A (fr) 1971-07-16
NL172606C (nl) 1983-09-16
NL172606B (nl) 1983-04-18
JPS545262B1 (fr) 1979-03-15

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Legal Events

Date Code Title Description
V1 Lapsed because of non-payment of the annual fee