NL7200742A - - Google Patents

Info

Publication number: NL7200742A
Authority: NL; Netherlands

Application number

NL7200742A

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1971-01-19

Filing date

1972-01-19

Publication date

1972-07-21

1972-01-19 Application filed filed Critical

1972-07-21 Publication of NL7200742A publication Critical patent/NL7200742A/xx

Links

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/66—Conductive materials thereof
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07231—Techniques
- H10W72/07236—Soldering or alloying

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Chemical & Material Sciences (AREA)
Dispersion Chemistry (AREA)
ing And Chemical Polishing (AREA)
Manufacturing Of Printed Circuit Boards (AREA)
Other Surface Treatments For Metallic Materials (AREA)
Ceramic Products (AREA)
Chemically Coating (AREA)

NL7200742A 1971-01-19 1972-01-19 NL7200742A (it)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DE2102421A DE2102421C3 (de)	1971-01-19	1971-01-19	Verfahren zur Herstellung einer strukturierten metallischen Schicht auf einem keramischen Grundkörper

Publications (1)

Publication Number	Publication Date
NL7200742A true NL7200742A (it)	1972-07-21

Family

ID=5796328

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
NL7200742A NL7200742A (it)	1971-01-19	1972-01-19

Country Status (10)

Country	Link
US (1)	US3829316A (it)
JP (1)	JPS5535468B1 (it)
AT (1)	AT317337B (it)
CA (1)	CA985606A (it)
CH (1)	CH576003A5 (it)
DE (1)	DE2102421C3 (it)
FR (1)	FR2122450B1 (it)
GB (1)	GB1327670A (it)
IT (1)	IT946536B (it)
NL (1)	NL7200742A (it)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5293963A (en) *	1976-02-03	1977-08-08	Nippon Electric Co	Method of producing thick film wiring circuit substrate
US4376815A (en) *	1979-10-22	1983-03-15	Oddi Michael J	Method of applying photoresist by screening in the formation of printed circuits
US4352714A (en) *	1980-09-29	1982-10-05	Union Carbide Corporation	Method for making a metal-to-ceramic insulator seal for electrochemical cells
DE3235675A1 (de) *	1982-09-27	1984-03-29	Siemens AG, 1000 Berlin und 8000 München	Verfahren zur herstellung von halbleiterchip-filmtraegern
DE3235702C2 (de) *	1982-09-27	1985-01-17	Siemens AG, 1000 Berlin und 8000 München	Verfahren zur Herstellung von Filmträgern für Halbleiterchips
JPH074995B2 (ja) *	1986-05-20	1995-01-25	株式会社東芝	Ｉｃカ−ド及びその製造方法
DE3907004A1 (de) *	1989-03-04	1990-09-06	Contraves Ag	Verfahren zum herstellen von duennschichtschaltungen
US5345529A (en) *	1993-07-06	1994-09-06	At&T Bell Laboratories	Method for assembly of an optical fiber connective device
US5416872A (en) *	1993-07-06	1995-05-16	At&T Corp.	Arrangement for interconnecting an optical fiber an optoelectronic component
JPH0714597U (ja) *	1993-08-17	1995-03-10	ワデン工業株式会社	発熱体

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB1121668A (en) *	1965-12-07	1968-07-31	Hermsdorf Keramik Veb	Method for the production of etch-resist masks on substrates

1971
- 1971-01-19 DE DE2102421A patent/DE2102421C3/de not_active Expired
- 1971-09-03 CH CH1291471A patent/CH576003A5/xx not_active IP Right Cessation
- 1971-10-01 AT AT852171A patent/AT317337B/de not_active IP Right Cessation
- 1971-11-05 GB GB5150371A patent/GB1327670A/en not_active Expired
- 1971-12-29 US US00213427A patent/US3829316A/en not_active Expired - Lifetime
1972
- 1972-01-13 IT IT19320/72A patent/IT946536B/it active
- 1972-01-17 FR FR7201383A patent/FR2122450B1/fr not_active Expired
- 1972-01-18 CA CA132,663A patent/CA985606A/en not_active Expired
- 1972-01-19 NL NL7200742A patent/NL7200742A/xx unknown
- 1972-01-19 JP JP754272A patent/JPS5535468B1/ja active Pending

Also Published As

Publication number	Publication date
US3829316A (en)	1974-08-13
DE2102421A1 (de)	1973-06-14
IT946536B (it)	1973-05-21
GB1327670A (en)	1973-08-22
AT317337B (de)	1974-08-26
JPS5535468B1 (it)	1980-09-13
CA985606A (en)	1976-03-16
CH576003A5 (it)	1976-05-31
DE2102421C3 (de)	1979-09-06
FR2122450B1 (it)	1975-06-13
FR2122450A1 (it)	1972-09-01
DE2102421B2 (de)	1979-01-11

Publication	Publication Date	Title
FR2141720B1 (it)	1973-07-13
JPS5535468B1 (it)	1980-09-13
FR2141042A5 (it)	1973-01-19
FR2131898B1 (it)	1975-06-06
CS154427B1 (it)	1974-04-30
CS148198B1 (it)	1973-02-22
AU2706571A (it)	1971-07-15
CS153876B1 (it)	1974-03-29
CS152171B1 (it)	1973-12-19
CS154971B1 (it)	1974-04-30
CS152502B1 (it)	1974-02-22
CS149542B1 (it)	1973-07-25
CS152629B1 (it)	1974-02-22
CS151123B1 (it)	1973-09-17
CS155722B1 (it)	1974-06-24
CS148271B1 (it)	1973-02-22
CS154429B1 (it)	1974-04-30
CH560671A5 (it)	1975-04-15
CH560855A5 (it)	1975-04-15
CH540071D (it)
CH563095A5 (it)	1975-06-13
CH571047A5 (it)	1975-12-31
CH579302B5 (it)	1976-08-31
CH566725A5 (it)	1975-09-30
CH582148A5 (it)	1976-11-30