NL7608309A - Half-geleiderinrichting voor een geintegreerde schakeling en werkwijze voor de vervaardiging daarvan. - Google Patents

Half-geleiderinrichting voor een geintegreerde schakeling en werkwijze voor de vervaardiging daarvan.

Info

Publication number
NL7608309A
NL7608309A NL7608309A NL7608309A NL7608309A NL 7608309 A NL7608309 A NL 7608309A NL 7608309 A NL7608309 A NL 7608309A NL 7608309 A NL7608309 A NL 7608309A NL 7608309 A NL7608309 A NL 7608309A
Authority
NL
Netherlands
Prior art keywords
semi
procedure
manufacturing
integrated circuit
conductor device
Prior art date
Application number
NL7608309A
Other languages
English (en)
Other versions
NL180264C (nl
NL180264B (nl
Original Assignee
Nippon Telegraph & Telephone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph & Telephone filed Critical Nippon Telegraph & Telephone
Publication of NL7608309A publication Critical patent/NL7608309A/nl
Publication of NL180264B publication Critical patent/NL180264B/nl
Application granted granted Critical
Publication of NL180264C publication Critical patent/NL180264C/nl

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00Interconnections in chips, wafers or substrates
    • H10W20/40Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/44Conductive materials thereof
    • H10W20/4451Semiconductor materials, e.g. polysilicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/01Manufacture or treatment
    • H10D64/011Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H10D64/0111Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors
    • H10D64/0113Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors the conductive layers comprising highly doped semiconductor materials, e.g. polysilicon layers or amorphous silicon layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/14Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase
    • H10P32/1408Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase from or through or into an external applied layer, e.g. photoresist or nitride layers
    • H10P32/1414Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase from or through or into an external applied layer, e.g. photoresist or nitride layers the applied layer being silicon, silicide or SIPOS, e.g. polysilicon or porous silicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/17Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material
    • H10P32/171Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material being group IV material
NLAANVRAGE7608309,A 1975-07-28 1976-07-27 Bipolaire transistor voor een geintegreerde halfgeleiderschakeling en werkwijzen voor het vervaardigen daarvan. NL180264C (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50091090A JPS5215262A (en) 1975-07-28 1975-07-28 Semiconductor device and its manufacturing method

Publications (3)

Publication Number Publication Date
NL7608309A true NL7608309A (nl) 1977-02-01
NL180264B NL180264B (nl) 1986-08-18
NL180264C NL180264C (nl) 1987-01-16

Family

ID=14016812

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE7608309,A NL180264C (nl) 1975-07-28 1976-07-27 Bipolaire transistor voor een geintegreerde halfgeleiderschakeling en werkwijzen voor het vervaardigen daarvan.

Country Status (7)

Country Link
US (1) US4128845A (nl)
JP (1) JPS5215262A (nl)
CA (1) CA1042559A (nl)
DE (1) DE2633714C2 (nl)
FR (1) FR2319978A1 (nl)
GB (1) GB1514370A (nl)
NL (1) NL180264C (nl)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5351985A (en) * 1976-10-22 1978-05-11 Hitachi Ltd Semiconductor wiring constitution
NL7703941A (nl) * 1977-04-12 1978-10-16 Philips Nv Werkwijze ter vervaardiging van een halfgelei- derinrichting en inrichting, vervaardigd door toepassing van de werkwijze.
US4160991A (en) * 1977-10-25 1979-07-10 International Business Machines Corporation High performance bipolar device and method for making same
US4190466A (en) * 1977-12-22 1980-02-26 International Business Machines Corporation Method for making a bipolar transistor structure utilizing self-passivating diffusion sources
NL190710C (nl) * 1978-02-10 1994-07-01 Nec Corp Geintegreerde halfgeleiderketen.
US4236122A (en) * 1978-04-26 1980-11-25 Bell Telephone Laboratories, Incorporated Mesa devices fabricated on channeled substrates
JPS577959A (en) * 1980-06-19 1982-01-16 Toshiba Corp Semiconductor device
US4446613A (en) * 1981-10-19 1984-05-08 Intel Corporation Integrated circuit resistor and method of fabrication
JPS6080267A (ja) * 1983-10-07 1985-05-08 Toshiba Corp 半導体集積回路装置の製造方法
JPH0719838B2 (ja) * 1985-07-19 1995-03-06 松下電器産業株式会社 半導体装置およびその製造方法
US4922318A (en) * 1985-09-18 1990-05-01 Advanced Micro Devices, Inc. Bipolar and MOS devices fabricated on same integrated circuit substrate
US4883772A (en) * 1986-09-11 1989-11-28 National Semiconductor Corporation Process for making a self-aligned silicide shunt
US4904980A (en) * 1988-08-19 1990-02-27 Westinghouse Electric Corp. Refractory resistors with etch stop for superconductor integrated circuits
US6060375A (en) * 1996-07-31 2000-05-09 Lsi Logic Corporation Process for forming re-entrant geometry for gate electrode of integrated circuit structure
US5895960A (en) * 1996-09-03 1999-04-20 Lucent Technologies Inc. Thin oxide mask level defined resistor
US7208361B2 (en) * 2004-03-24 2007-04-24 Intel Corporation Replacement gate process for making a semiconductor device that includes a metal gate electrode

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1154201B (de) * 1960-06-28 1963-09-12 Intermetall Verfahren zur gleichzeitigen Kontaktierung von zahlreichen Halbleiterbauelementen
US3519901A (en) * 1968-01-29 1970-07-07 Texas Instruments Inc Bi-layer insulation structure including polycrystalline semiconductor material for integrated circuit isolation
US3756877A (en) * 1970-10-05 1973-09-04 Tokyo Shibaura Electric Co By dielectric material method for manufacturing a semiconductor integrated circuit isolated
US3738880A (en) * 1971-06-23 1973-06-12 Rca Corp Method of making a semiconductor device
US3780359A (en) * 1971-12-20 1973-12-18 Ibm Bipolar transistor with a heterojunction emitter and a method fabricating the same
US3860836A (en) * 1972-12-01 1975-01-14 Honeywell Inc Stabilization of emitter followers
JPS5513426B2 (nl) * 1974-06-18 1980-04-09

Also Published As

Publication number Publication date
FR2319978B1 (nl) 1978-12-15
JPS5215262A (en) 1977-02-04
NL180264C (nl) 1987-01-16
FR2319978A1 (fr) 1977-02-25
GB1514370A (en) 1978-06-14
DE2633714A1 (de) 1977-02-03
NL180264B (nl) 1986-08-18
CA1042559A (en) 1978-11-14
US4128845A (en) 1978-12-05
DE2633714C2 (de) 1984-12-06

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Legal Events

Date Code Title Description
BC A request for examination has been filed
A85 Still pending on 85-01-01
CNR Transfer of rights (patent application after its laying open for public inspection)

Free format text: NIPPON TELEGRAPH AND TELEPHONE CORPORATION

V4 Discontinued because of reaching the maximum lifetime of a patent

Free format text: 960727