NL7608309A - Half-geleiderinrichting voor een geintegreerde schakeling en werkwijze voor de vervaardiging daarvan. - Google Patents
Half-geleiderinrichting voor een geintegreerde schakeling en werkwijze voor de vervaardiging daarvan.Info
- Publication number
- NL7608309A NL7608309A NL7608309A NL7608309A NL7608309A NL 7608309 A NL7608309 A NL 7608309A NL 7608309 A NL7608309 A NL 7608309A NL 7608309 A NL7608309 A NL 7608309A NL 7608309 A NL7608309 A NL 7608309A
- Authority
- NL
- Netherlands
- Prior art keywords
- semi
- procedure
- manufacturing
- integrated circuit
- conductor device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
- H10W20/44—Conductive materials thereof
- H10W20/4451—Semiconductor materials, e.g. polysilicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
- H10D64/0111—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors
- H10D64/0113—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors the conductive layers comprising highly doped semiconductor materials, e.g. polysilicon layers or amorphous silicon layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
- H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
- H10P32/14—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase
- H10P32/1408—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase from or through or into an external applied layer, e.g. photoresist or nitride layers
- H10P32/1414—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase from or through or into an external applied layer, e.g. photoresist or nitride layers the applied layer being silicon, silicide or SIPOS, e.g. polysilicon or porous silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
- H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
- H10P32/17—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material
- H10P32/171—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material being group IV material
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50091090A JPS5215262A (en) | 1975-07-28 | 1975-07-28 | Semiconductor device and its manufacturing method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NL7608309A true NL7608309A (nl) | 1977-02-01 |
| NL180264B NL180264B (nl) | 1986-08-18 |
| NL180264C NL180264C (nl) | 1987-01-16 |
Family
ID=14016812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NLAANVRAGE7608309,A NL180264C (nl) | 1975-07-28 | 1976-07-27 | Bipolaire transistor voor een geintegreerde halfgeleiderschakeling en werkwijzen voor het vervaardigen daarvan. |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4128845A (nl) |
| JP (1) | JPS5215262A (nl) |
| CA (1) | CA1042559A (nl) |
| DE (1) | DE2633714C2 (nl) |
| FR (1) | FR2319978A1 (nl) |
| GB (1) | GB1514370A (nl) |
| NL (1) | NL180264C (nl) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5351985A (en) * | 1976-10-22 | 1978-05-11 | Hitachi Ltd | Semiconductor wiring constitution |
| NL7703941A (nl) * | 1977-04-12 | 1978-10-16 | Philips Nv | Werkwijze ter vervaardiging van een halfgelei- derinrichting en inrichting, vervaardigd door toepassing van de werkwijze. |
| US4160991A (en) * | 1977-10-25 | 1979-07-10 | International Business Machines Corporation | High performance bipolar device and method for making same |
| US4190466A (en) * | 1977-12-22 | 1980-02-26 | International Business Machines Corporation | Method for making a bipolar transistor structure utilizing self-passivating diffusion sources |
| NL190710C (nl) * | 1978-02-10 | 1994-07-01 | Nec Corp | Geintegreerde halfgeleiderketen. |
| US4236122A (en) * | 1978-04-26 | 1980-11-25 | Bell Telephone Laboratories, Incorporated | Mesa devices fabricated on channeled substrates |
| JPS577959A (en) * | 1980-06-19 | 1982-01-16 | Toshiba Corp | Semiconductor device |
| US4446613A (en) * | 1981-10-19 | 1984-05-08 | Intel Corporation | Integrated circuit resistor and method of fabrication |
| JPS6080267A (ja) * | 1983-10-07 | 1985-05-08 | Toshiba Corp | 半導体集積回路装置の製造方法 |
| JPH0719838B2 (ja) * | 1985-07-19 | 1995-03-06 | 松下電器産業株式会社 | 半導体装置およびその製造方法 |
| US4922318A (en) * | 1985-09-18 | 1990-05-01 | Advanced Micro Devices, Inc. | Bipolar and MOS devices fabricated on same integrated circuit substrate |
| US4883772A (en) * | 1986-09-11 | 1989-11-28 | National Semiconductor Corporation | Process for making a self-aligned silicide shunt |
| US4904980A (en) * | 1988-08-19 | 1990-02-27 | Westinghouse Electric Corp. | Refractory resistors with etch stop for superconductor integrated circuits |
| US6060375A (en) * | 1996-07-31 | 2000-05-09 | Lsi Logic Corporation | Process for forming re-entrant geometry for gate electrode of integrated circuit structure |
| US5895960A (en) * | 1996-09-03 | 1999-04-20 | Lucent Technologies Inc. | Thin oxide mask level defined resistor |
| US7208361B2 (en) * | 2004-03-24 | 2007-04-24 | Intel Corporation | Replacement gate process for making a semiconductor device that includes a metal gate electrode |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1154201B (de) * | 1960-06-28 | 1963-09-12 | Intermetall | Verfahren zur gleichzeitigen Kontaktierung von zahlreichen Halbleiterbauelementen |
| US3519901A (en) * | 1968-01-29 | 1970-07-07 | Texas Instruments Inc | Bi-layer insulation structure including polycrystalline semiconductor material for integrated circuit isolation |
| US3756877A (en) * | 1970-10-05 | 1973-09-04 | Tokyo Shibaura Electric Co | By dielectric material method for manufacturing a semiconductor integrated circuit isolated |
| US3738880A (en) * | 1971-06-23 | 1973-06-12 | Rca Corp | Method of making a semiconductor device |
| US3780359A (en) * | 1971-12-20 | 1973-12-18 | Ibm | Bipolar transistor with a heterojunction emitter and a method fabricating the same |
| US3860836A (en) * | 1972-12-01 | 1975-01-14 | Honeywell Inc | Stabilization of emitter followers |
| JPS5513426B2 (nl) * | 1974-06-18 | 1980-04-09 |
-
1975
- 1975-07-28 JP JP50091090A patent/JPS5215262A/ja active Pending
-
1976
- 1976-07-19 US US05/706,596 patent/US4128845A/en not_active Expired - Lifetime
- 1976-07-20 GB GB30065/76A patent/GB1514370A/en not_active Expired
- 1976-07-21 CA CA257,488A patent/CA1042559A/en not_active Expired
- 1976-07-27 NL NLAANVRAGE7608309,A patent/NL180264C/nl not_active IP Right Cessation
- 1976-07-27 DE DE2633714A patent/DE2633714C2/de not_active Expired
- 1976-07-27 FR FR7622906A patent/FR2319978A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| FR2319978B1 (nl) | 1978-12-15 |
| JPS5215262A (en) | 1977-02-04 |
| NL180264C (nl) | 1987-01-16 |
| FR2319978A1 (fr) | 1977-02-25 |
| GB1514370A (en) | 1978-06-14 |
| DE2633714A1 (de) | 1977-02-03 |
| NL180264B (nl) | 1986-08-18 |
| CA1042559A (en) | 1978-11-14 |
| US4128845A (en) | 1978-12-05 |
| DE2633714C2 (de) | 1984-12-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| BC | A request for examination has been filed | ||
| A85 | Still pending on 85-01-01 | ||
| CNR | Transfer of rights (patent application after its laying open for public inspection) |
Free format text: NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
|
| V4 | Discontinued because of reaching the maximum lifetime of a patent |
Free format text: 960727 |