NL7706232A - Hoogfrequent-halfgeleiderinrichting. - Google Patents

Hoogfrequent-halfgeleiderinrichting.

Info

Publication number
NL7706232A
NL7706232A NL7706232A NL7706232A NL7706232A NL 7706232 A NL7706232 A NL 7706232A NL 7706232 A NL7706232 A NL 7706232A NL 7706232 A NL7706232 A NL 7706232A NL 7706232 A NL7706232 A NL 7706232A
Authority
NL
Netherlands
Prior art keywords
frequent
semi
conductor device
conductor
frequent semi
Prior art date
Application number
NL7706232A
Other languages
English (en)
Other versions
NL182605B (nl
NL182605C (nl
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of NL7706232A publication Critical patent/NL7706232A/nl
Publication of NL182605B publication Critical patent/NL182605B/nl
Application granted granted Critical
Publication of NL182605C publication Critical patent/NL182605C/nl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/226—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for HF amplifiers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
NLAANVRAGE7706232,A 1976-06-09 1977-06-06 Hoogfrequent-transistorinrichting. NL182605C (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/694,252 US4042952A (en) 1976-06-09 1976-06-09 R. F. power transistor device with controlled common lead inductance

Publications (3)

Publication Number Publication Date
NL7706232A true NL7706232A (nl) 1977-12-13
NL182605B NL182605B (nl) 1987-11-02
NL182605C NL182605C (nl) 1988-04-05

Family

ID=24788045

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE7706232,A NL182605C (nl) 1976-06-09 1977-06-06 Hoogfrequent-transistorinrichting.

Country Status (7)

Country Link
US (1) US4042952A (nl)
JP (1) JPS52150969A (nl)
CA (1) CA1082372A (nl)
DE (1) DE2726040C3 (nl)
FR (1) FR2354635A1 (nl)
GB (1) GB1574497A (nl)
NL (1) NL182605C (nl)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4193083A (en) * 1977-01-07 1980-03-11 Varian Associates, Inc. Package for push-pull semiconductor devices
JPS5386576A (en) * 1977-01-10 1978-07-31 Nec Corp Package for semiconductor element
US4168507A (en) * 1977-11-21 1979-09-18 Motorola, Inc. Structure and technique for achieving reduced inductive effect of undesired components of common lead inductance in a semiconductive RF power package
JPS55140251A (en) * 1979-04-12 1980-11-01 Fujitsu Ltd Semiconductor device
FR2455785A1 (fr) * 1979-05-02 1980-11-28 Thomson Csf Support isolateur electrique, a faible resistance thermique, et embase ou boitier pour composant de puissance, comportant un tel support
US4376287A (en) * 1980-10-29 1983-03-08 Rca Corporation Microwave power circuit with an active device mounted on a heat dissipating substrate
FR2563050B1 (fr) * 1984-04-13 1987-01-16 Thomson Csf Combineur compact de dispositifs semiconducteurs, fonctionnant en hyperfrequences
DE3444076A1 (de) * 1984-12-04 1986-06-05 ANT Nachrichtentechnik GmbH, 7150 Backnang Kontaktierung einer auf einem substrat angeordneten mikrowellenschaltung
JPS6318648A (ja) * 1986-07-11 1988-01-26 Toshiba Corp 窒化アルミニウム回路基板
US4891686A (en) * 1988-04-08 1990-01-02 Directed Energy, Inc. Semiconductor packaging with ground plane conductor arrangement
US5103283A (en) * 1989-01-17 1992-04-07 Hite Larry R Packaged integrated circuit with in-cavity decoupling capacitors
JPH0583017A (ja) * 1991-09-24 1993-04-02 Mitsubishi Electric Corp マイクロ波集積回路装置
JP2864841B2 (ja) * 1992-02-04 1999-03-08 三菱電機株式会社 高周波高出力トランジスタ
US5311399A (en) * 1992-06-24 1994-05-10 The Carborundum Company High power ceramic microelectronic package
JP3053298B2 (ja) * 1992-08-19 2000-06-19 株式会社東芝 半導体装置
TW238419B (nl) * 1992-08-21 1995-01-11 Olin Corp
US5360942A (en) * 1993-11-16 1994-11-01 Olin Corporation Multi-chip electronic package module utilizing an adhesive sheet
JP3429921B2 (ja) * 1995-10-26 2003-07-28 三菱電機株式会社 半導体装置
US6049126A (en) * 1995-12-14 2000-04-11 Nec Corporation Semiconductor package and amplifier employing the same
US5889319A (en) * 1996-07-19 1999-03-30 Ericsson, Inc. RF power package with a dual ground
US6529081B1 (en) 2000-06-08 2003-03-04 Zeta, Division Of Sierra Tech Inc. Method of operating a solid state power amplifying device
WO2002005342A1 (en) * 2000-07-06 2002-01-17 Zeta, A Division Of Sierratech, Inc. A solid state power amplifying device
JP4789348B2 (ja) * 2001-05-31 2011-10-12 リンテック株式会社 面状コイル部品、面状コイル部品の特性調整方法、idタグ、及び、idタグの共振周波数の調整方法
US6617679B2 (en) * 2002-02-08 2003-09-09 Advanced Energy Industries, Inc. Semiconductor package for multiple high power transistors
US7683480B2 (en) * 2006-03-29 2010-03-23 Freescale Semiconductor, Inc. Methods and apparatus for a reduced inductance wirebond array
US7948078B2 (en) * 2006-07-25 2011-05-24 Rohm Co., Ltd. Semiconductor device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1193519A (en) * 1967-08-31 1970-06-03 Texas Instruments Ltd Semiconductor Devices
US3590341A (en) * 1968-08-19 1971-06-29 Kmc Semiconductor Corp Microwave transistor package
US3713006A (en) * 1971-02-08 1973-01-23 Trw Inc Hybrid transistor
US3908185A (en) * 1974-03-06 1975-09-23 Rca Corp High frequency semiconductor device having improved metallized patterns

Also Published As

Publication number Publication date
CA1082372A (en) 1980-07-22
DE2726040A1 (de) 1977-12-15
NL182605B (nl) 1987-11-02
FR2354635A1 (fr) 1978-01-06
DE2726040C3 (de) 1982-02-18
US4042952A (en) 1977-08-16
NL182605C (nl) 1988-04-05
JPS5757867B2 (nl) 1982-12-07
GB1574497A (en) 1980-09-10
FR2354635B1 (nl) 1981-12-24
JPS52150969A (en) 1977-12-15
DE2726040B2 (de) 1981-05-27

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Legal Events

Date Code Title Description
BC A request for examination has been filed
A85 Still pending on 85-01-01
V1 Lapsed because of non-payment of the annual fee