NL7809334A - Halfgeleider-microgolfinrichting met verbeterde thermi- sche eigenschappen. - Google Patents

Halfgeleider-microgolfinrichting met verbeterde thermi- sche eigenschappen.

Info

Publication number
NL7809334A
NL7809334A NL7809334A NL7809334A NL7809334A NL 7809334 A NL7809334 A NL 7809334A NL 7809334 A NL7809334 A NL 7809334A NL 7809334 A NL7809334 A NL 7809334A NL 7809334 A NL7809334 A NL 7809334A
Authority
NL
Netherlands
Prior art keywords
thermal properties
improved thermal
microwave device
semiconductor microwave
semiconductor
Prior art date
Application number
NL7809334A
Other languages
English (en)
Other versions
NL186785B (nl
NL186785C (nl
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of NL7809334A publication Critical patent/NL7809334A/nl
Publication of NL186785B publication Critical patent/NL186785B/nl
Application granted granted Critical
Publication of NL186785C publication Critical patent/NL186785C/nl

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/10Arrangements for heating
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00Diodes
    • H10D8/40Transit-time diodes, e.g. IMPATT or TRAPATT diodes 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/072Connecting or disconnecting of bump connectors
    • H10W72/07251Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/20Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
NLAANVRAGE7809334,A 1977-09-14 1978-09-13 Microgolf-diode voorzien van warmte-opnemers. NL186785C (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/833,322 US4160992A (en) 1977-09-14 1977-09-14 Plural semiconductor devices mounted between plural heat sinks

Publications (3)

Publication Number Publication Date
NL7809334A true NL7809334A (nl) 1979-03-16
NL186785B NL186785B (nl) 1990-09-17
NL186785C NL186785C (nl) 1991-02-18

Family

ID=25264091

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE7809334,A NL186785C (nl) 1977-09-14 1978-09-13 Microgolf-diode voorzien van warmte-opnemers.

Country Status (7)

Country Link
US (1) US4160992A (nl)
JP (1) JPS5453973A (nl)
CA (1) CA1095178A (nl)
CH (1) CH633655A5 (nl)
DE (1) DE2839043C2 (nl)
GB (1) GB2004415B (nl)
NL (1) NL186785C (nl)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4313128A (en) * 1979-05-08 1982-01-26 Westinghouse Electric Corp. Compression bonded electronic device comprising a plurality of discrete semiconductor devices
CS214034B1 (en) * 1980-06-10 1982-04-09 Michal Pellant Semiconductor modulus
US4536469A (en) * 1981-11-23 1985-08-20 Raytheon Company Semiconductor structures and manufacturing methods
US4474623A (en) * 1982-04-26 1984-10-02 Raytheon Company Method of passivating a semiconductor body
DE3243307A1 (de) * 1982-11-23 1984-05-24 Raytheon Co., 02173 Lexington, Mass. Halbleiter-bauelemente und verfahren zu ihrer herstellung
DE3315583A1 (de) * 1983-04-29 1984-10-31 Siemens AG, 1000 Berlin und 8000 München Ein elektrisches bauteil tragendes, gut kuehlbares schaltungsmodul
US4604591A (en) * 1983-09-29 1986-08-05 Hazeltine Corporation Automatically adjustable delay circuit having adjustable diode mesa microstrip delay line
US4711859A (en) * 1984-05-24 1987-12-08 Raytheon Company Method for forming an insulator having a conductive surface
US4604529A (en) * 1984-09-28 1986-08-05 Cincinnati Microwave, Inc. Radar warning receiver with power plug
US5530658A (en) * 1994-12-07 1996-06-25 International Business Machines Corporation System and method for packing heat producing devices in an array to prevent local overheating
FR2793953B1 (fr) * 1999-05-21 2002-08-09 Thomson Csf Capacite thermique pour composant electronique fonctionnant en impulsions longues

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1327352A (en) * 1971-10-02 1973-08-22 Kyoto Ceramic Semiconductor device
US3783348A (en) * 1972-10-30 1974-01-01 Rca Corp Encapsulated semiconductor device assembly
US3896473A (en) * 1973-12-04 1975-07-22 Bell Telephone Labor Inc Gallium arsenide schottky barrier avalance diode array
US3956820A (en) * 1975-02-26 1976-05-18 Rca Corporation Method of manufacturing a semiconductor device having a lead bonded to a surface thereof
FR2344965A1 (fr) * 1976-03-16 1977-10-14 Siemens Ag Composant a semi-conducteurs denue de capot et comportant un puits de chaleur double

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB941375A (en) * 1959-05-11 1963-11-13 Microwaves Associates Inc A semi-conductor device
US3249891A (en) * 1959-08-05 1966-05-03 Ibm Oscillator apparatus utilizing esaki diode
US3231794A (en) * 1961-06-05 1966-01-25 Int Rectifier Corp Thermal coupling of parallel connected semiconductor elements
US3320497A (en) * 1964-09-11 1967-05-16 Control Data Corp Variable capacitance diode packages
FR1473250A (fr) * 1966-01-31 1967-03-17 Comp Generale Electricite Dispositif redresseur de puissance pour très haute tension
US3551842A (en) * 1968-03-27 1970-12-29 Rca Corp Semiconductor laser having high power output and reduced threshold
US3740617A (en) * 1968-11-20 1973-06-19 Matsushita Electronics Corp Semiconductor structure and method of manufacturing same
NL6902447A (nl) * 1969-02-14 1970-08-18
FR2032139A5 (nl) * 1969-02-19 1970-11-20 Comp Generale Electricite
US3649881A (en) * 1970-08-31 1972-03-14 Rca Corp High-power semiconductor device assembly
US3686541A (en) * 1971-07-19 1972-08-22 Gen Electric A flexible resilient member for applying a clamping force to thyristor units
US3728236A (en) * 1971-08-05 1973-04-17 Rca Corp Method of making semiconductor devices mounted on a heat sink
DE2324780C3 (de) * 1973-05-16 1978-07-27 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Herstellen eines Halbleiterbauelements
US3932226A (en) * 1974-12-06 1976-01-13 Rca Corporation Method of electrically interconnecting semiconductor elements
JPS5850428B2 (ja) * 1975-04-16 1983-11-10 株式会社東芝 メサ型半導体装置
DE2556749A1 (de) * 1975-12-17 1977-06-23 Bbc Brown Boveri & Cie Leistungshalbleiterbauelement in scheibenzellenbauweise
US4030943A (en) * 1976-05-21 1977-06-21 Hughes Aircraft Company Planar process for making high frequency ion implanted passivated semiconductor devices and microwave integrated circuits

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1327352A (en) * 1971-10-02 1973-08-22 Kyoto Ceramic Semiconductor device
US3783348A (en) * 1972-10-30 1974-01-01 Rca Corp Encapsulated semiconductor device assembly
US3896473A (en) * 1973-12-04 1975-07-22 Bell Telephone Labor Inc Gallium arsenide schottky barrier avalance diode array
US3956820A (en) * 1975-02-26 1976-05-18 Rca Corporation Method of manufacturing a semiconductor device having a lead bonded to a surface thereof
FR2344965A1 (fr) * 1976-03-16 1977-10-14 Siemens Ag Composant a semi-conducteurs denue de capot et comportant un puits de chaleur double

Also Published As

Publication number Publication date
GB2004415A (en) 1979-03-28
GB2004415B (en) 1982-01-20
DE2839043A1 (de) 1979-03-22
US4160992A (en) 1979-07-10
DE2839043C2 (de) 1986-10-30
CA1095178A (en) 1981-02-03
CH633655A5 (de) 1982-12-15
NL186785B (nl) 1990-09-17
NL186785C (nl) 1991-02-18
JPS5453973A (en) 1979-04-27

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Legal Events

Date Code Title Description
BA A request for search or an international-type search has been filed
BB A search report has been drawn up
A85 Still pending on 85-01-01
BC A request for examination has been filed
V1 Lapsed because of non-payment of the annual fee