NL7809334A - Halfgeleider-microgolfinrichting met verbeterde thermi- sche eigenschappen. - Google Patents
Halfgeleider-microgolfinrichting met verbeterde thermi- sche eigenschappen.Info
- Publication number
- NL7809334A NL7809334A NL7809334A NL7809334A NL7809334A NL 7809334 A NL7809334 A NL 7809334A NL 7809334 A NL7809334 A NL 7809334A NL 7809334 A NL7809334 A NL 7809334A NL 7809334 A NL7809334 A NL 7809334A
- Authority
- NL
- Netherlands
- Prior art keywords
- thermal properties
- improved thermal
- microwave device
- semiconductor microwave
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/40—Transit-time diodes, e.g. IMPATT or TRAPATT diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/833,322 US4160992A (en) | 1977-09-14 | 1977-09-14 | Plural semiconductor devices mounted between plural heat sinks |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NL7809334A true NL7809334A (nl) | 1979-03-16 |
| NL186785B NL186785B (nl) | 1990-09-17 |
| NL186785C NL186785C (nl) | 1991-02-18 |
Family
ID=25264091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NLAANVRAGE7809334,A NL186785C (nl) | 1977-09-14 | 1978-09-13 | Microgolf-diode voorzien van warmte-opnemers. |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4160992A (nl) |
| JP (1) | JPS5453973A (nl) |
| CA (1) | CA1095178A (nl) |
| CH (1) | CH633655A5 (nl) |
| DE (1) | DE2839043C2 (nl) |
| GB (1) | GB2004415B (nl) |
| NL (1) | NL186785C (nl) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4313128A (en) * | 1979-05-08 | 1982-01-26 | Westinghouse Electric Corp. | Compression bonded electronic device comprising a plurality of discrete semiconductor devices |
| CS214034B1 (en) * | 1980-06-10 | 1982-04-09 | Michal Pellant | Semiconductor modulus |
| US4536469A (en) * | 1981-11-23 | 1985-08-20 | Raytheon Company | Semiconductor structures and manufacturing methods |
| US4474623A (en) * | 1982-04-26 | 1984-10-02 | Raytheon Company | Method of passivating a semiconductor body |
| DE3243307A1 (de) * | 1982-11-23 | 1984-05-24 | Raytheon Co., 02173 Lexington, Mass. | Halbleiter-bauelemente und verfahren zu ihrer herstellung |
| DE3315583A1 (de) * | 1983-04-29 | 1984-10-31 | Siemens AG, 1000 Berlin und 8000 München | Ein elektrisches bauteil tragendes, gut kuehlbares schaltungsmodul |
| US4604591A (en) * | 1983-09-29 | 1986-08-05 | Hazeltine Corporation | Automatically adjustable delay circuit having adjustable diode mesa microstrip delay line |
| US4711859A (en) * | 1984-05-24 | 1987-12-08 | Raytheon Company | Method for forming an insulator having a conductive surface |
| US4604529A (en) * | 1984-09-28 | 1986-08-05 | Cincinnati Microwave, Inc. | Radar warning receiver with power plug |
| US5530658A (en) * | 1994-12-07 | 1996-06-25 | International Business Machines Corporation | System and method for packing heat producing devices in an array to prevent local overheating |
| FR2793953B1 (fr) * | 1999-05-21 | 2002-08-09 | Thomson Csf | Capacite thermique pour composant electronique fonctionnant en impulsions longues |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1327352A (en) * | 1971-10-02 | 1973-08-22 | Kyoto Ceramic | Semiconductor device |
| US3783348A (en) * | 1972-10-30 | 1974-01-01 | Rca Corp | Encapsulated semiconductor device assembly |
| US3896473A (en) * | 1973-12-04 | 1975-07-22 | Bell Telephone Labor Inc | Gallium arsenide schottky barrier avalance diode array |
| US3956820A (en) * | 1975-02-26 | 1976-05-18 | Rca Corporation | Method of manufacturing a semiconductor device having a lead bonded to a surface thereof |
| FR2344965A1 (fr) * | 1976-03-16 | 1977-10-14 | Siemens Ag | Composant a semi-conducteurs denue de capot et comportant un puits de chaleur double |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB941375A (en) * | 1959-05-11 | 1963-11-13 | Microwaves Associates Inc | A semi-conductor device |
| US3249891A (en) * | 1959-08-05 | 1966-05-03 | Ibm | Oscillator apparatus utilizing esaki diode |
| US3231794A (en) * | 1961-06-05 | 1966-01-25 | Int Rectifier Corp | Thermal coupling of parallel connected semiconductor elements |
| US3320497A (en) * | 1964-09-11 | 1967-05-16 | Control Data Corp | Variable capacitance diode packages |
| FR1473250A (fr) * | 1966-01-31 | 1967-03-17 | Comp Generale Electricite | Dispositif redresseur de puissance pour très haute tension |
| US3551842A (en) * | 1968-03-27 | 1970-12-29 | Rca Corp | Semiconductor laser having high power output and reduced threshold |
| US3740617A (en) * | 1968-11-20 | 1973-06-19 | Matsushita Electronics Corp | Semiconductor structure and method of manufacturing same |
| NL6902447A (nl) * | 1969-02-14 | 1970-08-18 | ||
| FR2032139A5 (nl) * | 1969-02-19 | 1970-11-20 | Comp Generale Electricite | |
| US3649881A (en) * | 1970-08-31 | 1972-03-14 | Rca Corp | High-power semiconductor device assembly |
| US3686541A (en) * | 1971-07-19 | 1972-08-22 | Gen Electric | A flexible resilient member for applying a clamping force to thyristor units |
| US3728236A (en) * | 1971-08-05 | 1973-04-17 | Rca Corp | Method of making semiconductor devices mounted on a heat sink |
| DE2324780C3 (de) * | 1973-05-16 | 1978-07-27 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zum Herstellen eines Halbleiterbauelements |
| US3932226A (en) * | 1974-12-06 | 1976-01-13 | Rca Corporation | Method of electrically interconnecting semiconductor elements |
| JPS5850428B2 (ja) * | 1975-04-16 | 1983-11-10 | 株式会社東芝 | メサ型半導体装置 |
| DE2556749A1 (de) * | 1975-12-17 | 1977-06-23 | Bbc Brown Boveri & Cie | Leistungshalbleiterbauelement in scheibenzellenbauweise |
| US4030943A (en) * | 1976-05-21 | 1977-06-21 | Hughes Aircraft Company | Planar process for making high frequency ion implanted passivated semiconductor devices and microwave integrated circuits |
-
1977
- 1977-09-14 US US05/833,322 patent/US4160992A/en not_active Expired - Lifetime
-
1978
- 1978-08-23 CA CA309,907A patent/CA1095178A/en not_active Expired
- 1978-09-07 DE DE2839043A patent/DE2839043C2/de not_active Expired
- 1978-09-12 GB GB7836558A patent/GB2004415B/en not_active Expired
- 1978-09-13 JP JP11288878A patent/JPS5453973A/ja active Pending
- 1978-09-13 NL NLAANVRAGE7809334,A patent/NL186785C/nl not_active IP Right Cessation
- 1978-09-14 CH CH961678A patent/CH633655A5/de not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1327352A (en) * | 1971-10-02 | 1973-08-22 | Kyoto Ceramic | Semiconductor device |
| US3783348A (en) * | 1972-10-30 | 1974-01-01 | Rca Corp | Encapsulated semiconductor device assembly |
| US3896473A (en) * | 1973-12-04 | 1975-07-22 | Bell Telephone Labor Inc | Gallium arsenide schottky barrier avalance diode array |
| US3956820A (en) * | 1975-02-26 | 1976-05-18 | Rca Corporation | Method of manufacturing a semiconductor device having a lead bonded to a surface thereof |
| FR2344965A1 (fr) * | 1976-03-16 | 1977-10-14 | Siemens Ag | Composant a semi-conducteurs denue de capot et comportant un puits de chaleur double |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2004415A (en) | 1979-03-28 |
| GB2004415B (en) | 1982-01-20 |
| DE2839043A1 (de) | 1979-03-22 |
| US4160992A (en) | 1979-07-10 |
| DE2839043C2 (de) | 1986-10-30 |
| CA1095178A (en) | 1981-02-03 |
| CH633655A5 (de) | 1982-12-15 |
| NL186785B (nl) | 1990-09-17 |
| NL186785C (nl) | 1991-02-18 |
| JPS5453973A (en) | 1979-04-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| BA | A request for search or an international-type search has been filed | ||
| BB | A search report has been drawn up | ||
| A85 | Still pending on 85-01-01 | ||
| BC | A request for examination has been filed | ||
| V1 | Lapsed because of non-payment of the annual fee |