NL8201653A - Werkwijze en inrichting voor het plaatsen van chipvormige electrische en/of electronische onderdelen op een substraat. - Google Patents

Werkwijze en inrichting voor het plaatsen van chipvormige electrische en/of electronische onderdelen op een substraat. Download PDF

Info

Publication number
NL8201653A
NL8201653A NL8201653A NL8201653A NL8201653A NL 8201653 A NL8201653 A NL 8201653A NL 8201653 A NL8201653 A NL 8201653A NL 8201653 A NL8201653 A NL 8201653A NL 8201653 A NL8201653 A NL 8201653A
Authority
NL
Netherlands
Prior art keywords
pick
substrate
elements
positions
parts
Prior art date
Application number
NL8201653A
Other languages
English (en)
Dutch (nl)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL8201653A priority Critical patent/NL8201653A/nl
Priority to CA000425753A priority patent/CA1204528A/en
Priority to EP83200563A priority patent/EP0092292B1/de
Priority to AT83200563T priority patent/ATE19327T1/de
Priority to DE8383200563T priority patent/DE3363018D1/de
Priority to JP58068492A priority patent/JPS58191494A/ja
Priority to KR1019830001670A priority patent/KR910003146B1/ko
Publication of NL8201653A publication Critical patent/NL8201653A/nl
Priority to US06/772,196 priority patent/US4644642A/en
Priority to HK853/91A priority patent/HK85391A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)
NL8201653A 1982-04-21 1982-04-21 Werkwijze en inrichting voor het plaatsen van chipvormige electrische en/of electronische onderdelen op een substraat. NL8201653A (nl)

Priority Applications (9)

Application Number Priority Date Filing Date Title
NL8201653A NL8201653A (nl) 1982-04-21 1982-04-21 Werkwijze en inrichting voor het plaatsen van chipvormige electrische en/of electronische onderdelen op een substraat.
CA000425753A CA1204528A (en) 1982-04-21 1983-04-13 Method of and device for placing chip-type electrical and/or electronic components on a substrate
EP83200563A EP0092292B1 (de) 1982-04-21 1983-04-19 Verfahren und Vorrichtung zum Anordnen chipförmiger elektrischer und/oder elektronischer Komponenten auf einem Substrat
AT83200563T ATE19327T1 (de) 1982-04-21 1983-04-19 Verfahren und vorrichtung zum anordnen chipfoermiger elektrischer und/oder elektronischer komponenten auf einem substrat.
DE8383200563T DE3363018D1 (en) 1982-04-21 1983-04-19 Method of and device for placing chip-type electrical and/or electronic components on a substrate
JP58068492A JPS58191494A (ja) 1982-04-21 1983-04-20 部品の載置方法および装置
KR1019830001670A KR910003146B1 (ko) 1982-04-21 1983-04-20 칩형 전기 및 전자 부품의 기판 배치 방법 및 장치
US06/772,196 US4644642A (en) 1982-04-21 1985-09-03 Method of and device for placing chip-type electrical and/or electronic components on a substrate
HK853/91A HK85391A (en) 1982-04-21 1991-10-31 Method of and device for placing chip-type electrical and/or electronic components on a substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8201653 1982-04-21
NL8201653A NL8201653A (nl) 1982-04-21 1982-04-21 Werkwijze en inrichting voor het plaatsen van chipvormige electrische en/of electronische onderdelen op een substraat.

Publications (1)

Publication Number Publication Date
NL8201653A true NL8201653A (nl) 1983-11-16

Family

ID=19839624

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8201653A NL8201653A (nl) 1982-04-21 1982-04-21 Werkwijze en inrichting voor het plaatsen van chipvormige electrische en/of electronische onderdelen op een substraat.

Country Status (9)

Country Link
US (1) US4644642A (de)
EP (1) EP0092292B1 (de)
JP (1) JPS58191494A (de)
KR (1) KR910003146B1 (de)
AT (1) ATE19327T1 (de)
CA (1) CA1204528A (de)
DE (1) DE3363018D1 (de)
HK (1) HK85391A (de)
NL (1) NL8201653A (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5851530A (ja) * 1981-09-22 1983-03-26 Toshiba Corp 半導体ペレツト配列装置および方法
GB2154921B (en) * 1984-02-24 1988-06-08 Pace Inc Device for attaching modular electronic components to or removing them from an insulative substrate
JPS60242922A (ja) * 1984-05-18 1985-12-02 Tokico Ltd 部品取付け装置
DE3532500C2 (de) * 1984-09-17 1996-03-14 Tdk Corp Pneumatisch betätigter Bestückungskopf mit Saugkammer für eine Saugpipette
JPS6171693A (ja) * 1984-09-17 1986-04-12 ティーディーケイ株式会社 チツプ部品の装着方法
NL8403513A (nl) * 1984-11-19 1986-06-16 Philips Nv Inrichting voor het plaatsen van electronische en/of electrische onderdelen op een substraat.
EP0190372A1 (de) * 1985-01-29 1986-08-13 TEKMA KINOMAT S.p.A. Verfahren zur automatischen Positionierung von Chips auf Leiterplatten und Maschine zu dessen Ausführung
NL8701139A (nl) * 1987-05-13 1988-12-01 Philips Nv Geleideinrichting.
CA1320005C (en) * 1988-06-16 1993-07-06 Kotaro Harigane Electronic component mounting apparatus
JPH0250440A (ja) * 1988-08-12 1990-02-20 Mitsubishi Electric Corp ダイボンド装置
JP2526602Y2 (ja) * 1988-10-18 1997-02-19 山形カシオ 株式会社 電子部品自動取上げ装置
JPH0268499U (de) * 1988-11-11 1990-05-24
NL8900027A (nl) * 1989-01-06 1990-08-01 Philips Nv Werkwijze en inrichting voor het plaatsen van onderdelen op een drager.
US5058263A (en) * 1989-12-21 1991-10-22 U.S. Philips Corporation Manipulation device
US5216804A (en) * 1991-05-21 1993-06-08 U.S. Philips Corp. Method and device for placing a component on a printed circuit board
NL9302155A (nl) * 1993-12-10 1995-07-03 Boschman Holding Bv Inrichting voor het in vormholten plaatsen van voorwerpen.
JP4346174B2 (ja) * 1998-10-13 2009-10-21 パナソニック株式会社 電子部品実装装置
KR100348400B1 (ko) * 2000-05-20 2002-08-10 미래산업 주식회사 표면실장장치의 모듈헤드의 노즐회전장치
DE102005033979B4 (de) * 2005-07-20 2007-08-02 Siemens Ag Bestücksystem und Verfahren zum Bestücken von Substraten mit elektrischen Bauteilen
JP5302773B2 (ja) * 2009-05-27 2013-10-02 株式会社日立ハイテクノロジーズ 電子部品実装装置

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3611561A (en) * 1969-04-21 1971-10-12 Paul A Dosier Transfer mechanism with loading nest
US3859723A (en) * 1973-11-05 1975-01-14 Microsystems Int Ltd Bonding method for multiple chip arrays
US3958740A (en) * 1974-07-08 1976-05-25 Dixon Automation, Inc. Automatic component assembly machine and method relating thereto
JPS51131273A (en) * 1975-05-10 1976-11-15 Fujitsu Ltd Wire bonding process
JPS51131274A (en) * 1975-05-10 1976-11-15 Fujitsu Ltd Tip bonding method
JPS52124168A (en) * 1976-04-12 1977-10-18 Matsushita Electric Industrial Co Ltd Method of assembling electronic device circuit
FR2365209A1 (fr) * 1976-09-20 1978-04-14 Cii Honeywell Bull Procede pour le montage de micro-plaquettes de circuits integres sur un substrat et installation pour sa mise en oeuvre
US4166562A (en) * 1977-09-01 1979-09-04 The Jade Corporation Assembly system for microcomponent devices such as semiconductor devices
US4151945A (en) * 1977-12-08 1979-05-01 Universal Instruments Corporation Automated hybrid circuit board assembly apparatus
US4292116A (en) * 1978-04-18 1981-09-29 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on a printed circuit board
JPS5537283A (en) * 1978-09-08 1980-03-15 Matsushita Electric Industrial Co Ltd Article shifter
JPS5921200B2 (ja) * 1978-10-24 1984-05-18 日本電気ホームエレクトロニクス株式会社 部品同時配列供給装置
GB2034613B (en) * 1978-11-09 1983-01-19 Tokyo Shibaura Electric Co Method and apparatus for mounting electronic components
JPS5583239A (en) * 1978-12-20 1980-06-23 Hitachi Ltd Mounting tip element
JPS5599795A (en) * 1979-01-25 1980-07-30 Matsushita Electric Industrial Co Ltd Device for mounting electronic part
JPS55118690A (en) * 1979-03-05 1980-09-11 Matsushita Electric Industrial Co Ltd Device for carrying electronic part
JPS55118698A (en) * 1979-03-05 1980-09-11 Matsushita Electric Industrial Co Ltd Device for mounting electronic part
US4345371A (en) * 1979-03-14 1982-08-24 Sony Corporation Method and apparatus for manufacturing hybrid integrated circuits
DE2923695A1 (de) * 1979-06-12 1980-12-18 Ruf Kg Wilhelm Vorrichtung zur aufnahme und positionsgerechten ablage von bauteilen
DE2935081C2 (de) * 1979-08-30 1985-12-19 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung zur Bestückung von Leiterplatten.
JPS5636196A (en) * 1979-09-03 1981-04-09 Sony Corp Apparatus for assembling electronic device circuit
JPS5661194A (en) * 1979-10-25 1981-05-26 Hitachi Ltd Method of carrying chip element
JPS6311756Y2 (de) * 1980-04-25 1988-04-05
JPS576277U (de) * 1980-06-12 1982-01-13
JPS5737281U (de) * 1980-08-13 1982-02-27

Also Published As

Publication number Publication date
EP0092292B1 (de) 1986-04-16
KR840004829A (ko) 1984-10-24
KR910003146B1 (ko) 1991-05-20
ATE19327T1 (de) 1986-05-15
HK85391A (en) 1991-11-08
EP0092292A1 (de) 1983-10-26
US4644642A (en) 1987-02-24
CA1204528A (en) 1986-05-13
DE3363018D1 (en) 1986-05-22
JPS58191494A (ja) 1983-11-08

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Legal Events

Date Code Title Description
A1B A search report has been drawn up
A85 Still pending on 85-01-01
BV The patent application has lapsed